公开(公告)号：US06294742B1

公开(公告)日：2001-09-25

申请号：US09363497

申请日：1999-07-27

Applicant: Ted B Ziemkowski

Inventor： Ted B Ziemkowski

IPC: H05K100

CPC classification number: H05K1/0209 ,  H05K1/111 ,  H05K2201/0373 ,  H05K2201/09781 ,  H05K2201/10166 ,  Y02P70/611 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. Included is a printed wiring board having solder pads disposed on its surface that are adapted for soldering to leads of surface mount components. The solder pads are electrically interconnected by conductive traces also disposed on the surface. At least one of the solder pads has an enhanced surface area that is selected larger than necessary for the soldering, and that is selected sufficiently large so as to sink enough heat generated by one of the surface mount components to provide for its proper operation.

Abstract translation: 表面贴装焊盘，其适于作为焊接到焊盘的电子部件的散热器。 包括印刷线路板，其上表面上设置有适于焊接到表面安装部件的引线的焊盘。 焊盘通过也布置在表面上的导电迹线电互连。 焊盘中的至少一个具有被选择为大于焊接所需的更大的表面积，并且被选择得足够大以便吸收由一个表面安装部件产生的足够的热量以提供其正确的操作。

公开(公告)号：US06256874B1

公开(公告)日：2001-07-10

申请号：US09315305

申请日：1999-05-20

Applicant: Bernd K. Appelt ,  Saswati Datta ,  Michael A. Gaynes ,  John M. Lauffer ,  James R. Wilcox

Inventor： Bernd K. Appelt ,  Saswati Datta ,  Michael A. Gaynes ,  John M. Lauffer ,  James R. Wilcox

IPC: H05K336

CPC classification number: H05K3/325 ,  H05K3/4614 ,  H05K2201/0373 ,  H05K2201/09536 ,  H05K2201/10666 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49165 ,  Y10T29/49194

Abstract: A method is provided for connecting two conductive layers in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive layer, forming dendrites on selected regions of a second conductive layer, applying an epoxy adhesive material over the first conductive layer, and compressively attaching the second conductive layer to the first conductive layer such that the dendrites on the first conductive layer contact the dendrites on the second conductive layer. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection manufactured in accordance with the present invention. An alternative embodiment of the invention utilizes an intermediate surface metal with dendrites in place of a “through via.”

Abstract translation: 提供了一种用于连接电子电路封装中的两个导电层的方法，包括以下步骤：在第一导电层的选定区域上形成枝晶，在第二导电层的选定区域上形成枝晶，在第一导电层上施加环氧粘合剂材料 并且将第二导电层压缩附接到第一导电层，使得第一导电层上的枝晶与第二导电层上的枝晶接触。 还要求保护的是包括用于根据本发明制造的电互连的树突的电子电路封装。 本发明的替代实施例利用具有树突的中间表面金属代替“通孔”。

公开(公告)号：US6115260A

公开(公告)日：2000-09-05

申请号：US258403

申请日：1999-02-26

Applicant: Takao Nakajima ,  Tetsurou Tsuji ,  Tetsuro Washida

Inventor： Takao Nakajima ,  Tetsurou Tsuji ,  Tetsuro Washida

IPC: H01R43/00 ,  H05K1/11 ,  H05K3/26 ,  H05K1/18

CPC classification number: H01R12/83 ,  H05K1/117 ,  H01R43/002 ,  H05K2201/0373 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10159 ,  H05K3/26 ,  Y10S439/951 ,  Y10S439/954

Abstract: A terminal structure in a memory module includes a male connector having a plurality of terminal strips adapted to be engaged with the terminal tongues in the female socket. Each of the terminal strips has an obstacle removal portion defined therein for removing foreign matter present on at least one of the terminal tongues.

Abstract translation: 存储器模块中的端子结构包括具有适于与母插座中的端子舌接合的多个端子条的阳连接器。 每个端子条具有限定在其中的障碍物去除部，用于去除至少一个端子舌上存在的异物。

公开(公告)号：US6031727A

公开(公告)日：2000-02-29

申请号：US178682

申请日：1998-10-26

Applicant: Kevin G. Duesman ,  L. Jan Bissey

Inventor： Kevin G. Duesman ,  L. Jan Bissey

IPC: H05K1/02 ,  H05K3/46 ,  H05K7/20

CPC classification number: H05K3/4641 ,  H05K1/0207 ,  H05K2201/0373 ,  H05K2201/0382 ,  H05K2201/09309

Abstract: According to the present invention, functional heat conducting planar layers within a printed circuit board (PCB) are corrugated to allow for enhanced heat dissipation. According to a preferred embodiment, at least one of the power and ground planes is at least partially corrugated to extract heat from the PCB. By corrugating heat conducting structures within the PCB, additional heat dissipating surface area is provided for the PCB without the need to provide any additional heat dissipating structure.

Abstract translation: 根据本发明，印刷电路板（PCB）内的功能导热平面层是波纹状的，以允许增强散热。 根据优选实施例，功率和接地平面中的至少一个至少部分地波纹以从PCB提取热量。 通过瓦解PCB内的导热结构，为PCB提供了额外的散热表面积，而不需要提供任何额外的散热结构。

公开(公告)号：US5929521A

公开(公告)日：1999-07-27

申请号：US828255

申请日：1997-03-26

Applicant: James M. Wark ,  Salman Akram

Inventor： James M. Wark ,  Salman Akram

IPC: H01L21/60 ,  H01L23/485 ,  H01L23/498 ,  H05K3/32 ,  H05K3/40 ,  H01L23/48 ,  H01L23/52 ,  H01L29/46

CPC classification number: H01L24/10 ,  G01R1/06738 ,  H01L22/34 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/81 ,  H05K3/325 ,  H05K3/4007 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05555 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L24/12 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10734 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: A bumped semiconductor device contact structure is disclosed including at least one non-planar contact pad having a plurality of projections extending therefrom for contacting at least one solder ball of a bumped integrated circuit (IC) device, such as a bumped die and a bumped packaged IC device. The projections are arranged to make electrical contact with the solder balls of a bumped IC device without substantially deforming the solder ball. Accordingly, reflow of solder balls to reform the solder balls is not necessary with the contact pad of the present invention. Such a contact pad may be provided on various testing equipment such as probes and the like and may be used for both temporary and permanent connections. Also disclosed is an improved method of forming the contact pads by etching and deposition.

Abstract translation: 公开了凸起的半导体器件接触结构，其包括至少一个非平面接触焊盘，其具有从其延伸的多个突起，用于接触凸起的集成电路（IC）器件的至少一个焊球，例如凸起的裸片和凸起的封装 IC设备。 突起被布置成与凸起的IC器件的焊球电接触，而不会使焊球基本上变形。 因此，本发明的接触焊盘不需要焊球的回流以重新形成焊球。 这样的接触垫可以设置在诸如探针等的各种测试设备上，并且可以用于临时和永久连接。 还公开了通过蚀刻和沉积形成接触焊盘的改进方法。

公开(公告)号：US5917245A

公开(公告)日：1999-06-29

申请号：US777944

申请日：1996-12-23

Applicant: Hisao Tomizawa

Inventor： Hisao Tomizawa

IPC: H01L23/367 ,  H01L29/06 ,  H05K1/02 ,  H05K3/34 ,  H01L23/48

CPC classification number: H01L24/31 ,  H01L23/367 ,  H05K3/341 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L24/48 ,  H01L29/0657 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/10158 ,  H05K1/0203 ,  H05K2201/0373 ,  H05K2201/066 ,  H05K2201/10568 ,  H05K2201/10772 ,  H05K2201/10969 ,  H05K2203/1178 ,  Y02P70/613

Abstract: A mount 2 is secured on a circuit board 1 to support a diode chip 3 thereon. A plurality of legs 7, 12 formed in the mount 2 are in contact with an electrode 4 on the circuit board 1 to form at least a dent 14. The mount 2 also has an inclined surface 8 formed at the periphery which faces the electrode 4. Solder 9 is filled in the dent 14 between the legs 7, 12 and in the flaring area 13 between the circuit board 1 and the inclined surface 8 of the mount 2 to prevent exfoliation or detachment of the mount from the electrode 4.

Abstract translation: 安装件2固定在电路板1上以在其上支撑二极管芯片3。 形成在安装件2上的多个支脚7,12与电路板1上的电极4接触以形成至少凹陷14.支架2还具有形成在周边的与电极4相对的倾斜表面8 焊料9填充在支腿7,12之间的凹陷14和电路板1与安装件2的倾斜表面8之间的扩口区域13中，以防止支架从电极4剥离或脱离。

公开(公告)号：US5889657A

公开(公告)日：1999-03-30

申请号：US724002

申请日：1996-09-30

Applicant: Takashi Kono

Inventor： Takashi Kono

IPC: H01L21/60 ,  H01R4/26 ,  H01R43/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40 ,  H01R9/00

CPC classification number: H01R12/57 ,  H05K1/111 ,  H05K3/3442 ,  H01L2224/1411 ,  H01L2224/16237 ,  H01L2224/17107 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01R4/26 ,  H01R43/0235 ,  H01R43/0256 ,  H05K2201/0373 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K3/3421 ,  H05K3/3431 ,  H05K3/4007 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49147

Abstract: A surface-mounting structure of a surface-mounting electronic device onto the surface of a circuit medium is provided. An external terminal of the device has a first mounting surface on which a first set of protrusions are formed. The first mounting surface includes a first uncovered space in the remaining area of the first set of protrusions. A mounting pad of the circuit medium has a second mounting surface on which a second set of protrusions are formed. The second mounting surface includes a second uncovered space in the remaining area of the second set of protrusions. The second mounting surface is opposite to the first mounting surface. The second set of protrusions are inserted into the first uncovered space. The first set of protrusions are inserted into the second uncovered space. A bonding material is placed between the first and second mounting surfaces. The bonding material provides a mechanical engagement between the first and second mounting surfaces, thereby mechanically and electrically connecting the terminal of the device onto the mounting pad of the circuit medium. The mounting process and its process control are simplified, and connection accuracy and reliability are improved.

Abstract translation: 提供了表面安装电子器件在电路介质表面上的表面安装结构。 该装置的外部端子具有形成有第一组突起的第一安装表面。 第一安装表面包括在第一组突起的剩余区域中的第一未覆盖空间。 电路介质的安装垫具有第二安装表面，在其上形成有第二组突起。 第二安装表面包括在第二组突起的剩余区域中的第二未覆盖空间。 第二安装表面与第一安装表面相对。 第二组突起插入第一未覆盖空间。 第一组突起插入第二未覆盖空间。 接合材料放置在第一和第二安装表面之间。 接合材料在第一和第二安装表面之间提供机械接合，从而将器件的端子机械地和电连接到电路介质的安装焊盘上。 安装过程及其过程控制简化，提高了连接精度和可靠性。

公开(公告)号：US5831826A

公开(公告)日：1998-11-03

申请号：US717055

申请日：1996-09-20

Applicant: James Edward Van Ryswyk

Inventor： James Edward Van Ryswyk

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/32 ,  H05K3/34 ,  H05K7/20

CPC classification number: H05K7/20445 ,  H05K1/0206 ,  H05K1/11 ,  H05K2201/0373 ,  H05K2201/066 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/043 ,  H05K3/0061 ,  H05K3/325 ,  H05K3/3468

Abstract: A heat transfer apparatus is carried on a substrate (204) having top and bottom surfaces (212, 214). The heat transfer apparatus includes a pad (220/222), at least one via (224/226), and a plurality of pads (302). The pad (220/222) is carried on the top surface (212) of the substrate (204) to electrically connect to an electronic component (228/230). The via (224/226) intersects the pad (220/222) and extends between the top and bottom surfaces (212, 214) of the substrate (204). The plurality of pads (302) are carried on the bottom surface (214) of the substrate (204) beneath the pad (220/222). The via (224/226) intersects one of the plurality of pads (302) to transfer heat generated during operation of the electronic component (228/230) thereto.

Abstract translation: 传热装置承载在具有顶表面和底表面（212,214）的基底（204）上。 传热装置包括垫（220/222），至少一个通孔（224/226）和多个垫（302）。 衬垫（220/222）被承载在衬底（204）的顶表面（212）上以电连接到电子部件（228/230）。 通孔（224/226）与焊盘（220/222）相交并且在衬底（204）的顶表面和底表面（212,214）之间延伸。 多个焊盘（302）被承载在衬垫（220/222）下方的衬底（204）的底表面（214）上。 通孔（224/226）与多个焊盘（302）中的一个相交，以将电子部件（228/230）的操作期间产生的热传递到其上。

公开(公告)号：US5759047A

公开(公告)日：1998-06-02

申请号：US653214

申请日：1996-05-24

Applicant: William Louis Brodsky ,  Glenn Lee Kehley ,  Glenn Edward Myrto ,  John Henry Sherman

Inventor： William Louis Brodsky ,  Glenn Lee Kehley ,  Glenn Edward Myrto ,  John Henry Sherman

IPC: H01R12/62 ,  H01R12/71 ,  H01R13/24 ,  H01R13/648 ,  H05K1/03 ,  H05K1/11 ,  H05K3/32 ,  H01R9/09

CPC classification number: H01R13/2414 ,  H01L23/49811 ,  H01R12/62 ,  H01R12/714 ,  H01R13/648 ,  H05K1/118 ,  H05K3/326 ,  H01L2224/16225 ,  H05K1/036 ,  H05K2201/0133 ,  H05K2201/0373 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09109 ,  H05K2201/10378 ,  H05K2201/10734

Abstract: A flexible circuitized interposer (50) and method of making same wherein the interposer includes at least one flexible circuitized substrate (53) having a dielectric (e.g., polyimide) layer (54) with a conductor (55) and plated elements (56), e.g., copper pad, including possibly with dendrites (57) thereon for enhanced connection, an apertured support member (58) aligning with the conductor, and a support member (60) having the apertured member thereon. When the interposer is engaged, the flexible circuitized substrate (53) is depressed within the aperture (59). Various alternatives, including a support (60") formed with compressible portions (69) that extend into respective apertures (59) in the support member (58), and an interim, compressible support (60""), are disclosed. The support member may also be metallic, e.g., for use as an electrical ground shield. Flexure is also enhanced by utilization of patterns of one or more apertures (64) in the flexible substrate relative to and substantially surrounding the positioned conductors (56). Electrical assemblies including a pair of circuitized substrates electrically interconnected by the defined interposers are also described.

Abstract translation: 一种柔性电路插入器（50）及其制造方法，其中插入器包括至少一个柔性电路化衬底（53），其具有导体（55）和电镀元件（56）的电介质（例如，聚酰亚胺）层（54） 例如铜垫，其中可能具有用于增强连接的枝晶（57），与导体对准的有孔支撑构件（58）和在其上具有有孔构件的支撑构件（60）。 当插入件接合时，柔性电路化基板（53）在孔（59）内被压下。 公开了包括延伸到支撑构件（58）中的相应孔（59）中的可压缩部分（69）形成的支撑件（60“）和一个临时的可压缩支撑件（60”）， 。 支撑构件也可以是金属的，例如用作电接地屏蔽。 通过利用柔性基板中的一个或多个孔（64）的图案相对于并且基本上围绕定位的导体（56）也增强了弯曲。 还描述了包括通过限定的插入体电互连的一对电路化基板的电气组件。

公开(公告)号：US5460319A

公开(公告)日：1995-10-24

申请号：US80622

申请日：1993-06-22

Applicant: Hazime Kato

Inventor： Hazime Kato

IPC: H01L23/50 ,  H01R4/02 ,  H01R43/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36

CPC classification number: H01R4/028 ,  H05K3/308 ,  H05K3/3447 ,  H05K1/141 ,  H05K1/142 ,  H05K2201/0373 ,  H05K2201/09709 ,  H05K2201/10386 ,  H05K2201/10757 ,  H05K2201/10871 ,  H05K3/368

Abstract: A lead for achieving solder joining with great vibration strength includes an upper lead portion having a clip and a lower lead portion having a thin tip for insertion into an electrode in a lower substrate and an oblong through hole in the body of the lower lead portion for inducing capillarity of soldering flux.

Abstract translation: 用于实现具有强烈振动强度的焊料接合的引线包括具有夹子的上引线部分和具有用于插入下基板中的电极的薄端部的下引线部分和下引线部分的主体中的长方形通孔， 引起助焊剂的毛细作用。