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公开(公告)号:US11950474B2
公开(公告)日:2024-04-02
申请号:US18143182
申请日:2023-05-04
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei Yamazaki , Kensuke Yoshizumi
IPC: H05K1/18 , G04G9/00 , H10K59/121 , H10K59/131 , H10K77/10 , H01L27/12 , H05K1/02 , H05K1/14 , H10K59/12 , H10K102/00
CPC classification number: H10K59/131 , G04G9/0088 , H10K59/1213 , H10K77/111 , H01L27/1244 , H05K1/0277 , H05K1/028 , H05K1/0283 , H05K1/147 , H05K1/189 , H05K2201/05 , H05K2201/051 , H05K2201/052 , H05K2201/053 , H05K2201/055 , H10K59/1201 , H10K2102/311 , Y02E10/549
Abstract: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.
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公开(公告)号:US20230371184A1
公开(公告)日:2023-11-16
申请号:US17426125
申请日:2021-05-31
Inventor: Jinfeng LIU
CPC classification number: H05K1/18 , H05K1/028 , H05K1/142 , H05K1/11 , H05K2201/05 , H05K2201/10128 , H05K2201/10212
Abstract: The present application discloses a display panel and a display device. The display panel includes a display panel main body, a flexible wiring board, and a printed circuit board. The display panel main body includes a plurality of wires, and the display panel main body is connected to an end of the flexible wiring board. The printed circuit board is connected to another end of the flexible wiring board. The printed circuit board includes a driver chip, and the driver chip is electrically connected to the wires.
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公开(公告)号:US20230247761A1
公开(公告)日:2023-08-03
申请号:US18102826
申请日:2023-01-30
Applicant: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
Inventor: Shinji UEDA
IPC: H05K1/02 , H01L23/498 , H01L23/10
CPC classification number: H05K1/0277 , H01L23/10 , H01L23/49838 , H05K1/0298 , H05K2201/05
Abstract: A device comprises a first circuit member, a second circuit member and a third circuit member. The first circuit member comprises a first body for performing the function of the first circuit member and a first flexible board formed with a first integrated-electrode portion including first electrodes. The second circuit member comprises a second body for performing the function of the second circuit member and a second flexible board formed with a second integrated-electrode portion including second electrodes. The third circuit member comprises a third body for performing the function of the third circuit member and a third flexible board formed with a third integrated-electrode portion including third electrodes. The first integrated-electrode portion, the second integrated-electrode portion and the third integrated-electrode portion lie over each other in an upper-lower direction. The first body, second body and the third body are apart from each other when seen along the upper-lower direction.
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公开(公告)号:US20190159342A1
公开(公告)日:2019-05-23
申请号:US16190045
申请日:2018-11-13
Applicant: LG Display Co., Ltd.
Inventor: Changseok OH
CPC classification number: H05K1/189 , H05K1/0281 , H05K1/0393 , H05K2201/05 , H05K2201/052 , H05K2201/09063 , H05K2201/09181 , H05K2201/10128
Abstract: A flexible printed circuit board that can reduce detachment when a flexible printed circuit board is attached to a display panel, and reduce a work cost, and simplify process, and reduce a tearing of the flexible printed circuit board due to a stress concentrated on a specific area of the flexible printed circuit board, and a display apparatus including the same. The flexible printed circuit board includes a base film having a notch at one side, on at least one side, and a plurality of rows of impact absorbing parts spaced apart from each other along the edge of the notch. The impact absorbing part provides a pattern layer one surface or both surfaces of the base film or a pattern hole of penetrating through the base film.
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公开(公告)号:US20180332702A1
公开(公告)日:2018-11-15
申请号:US15768252
申请日:2016-10-14
Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCY
Inventor: Masao NAKAJIMA , Ichiro AMIMORI , Osamu SAWANOBORI , Takao SOMEYA
CPC classification number: H05K1/038 , H05K1/0283 , H05K1/11 , H05K1/14 , H05K1/141 , H05K1/144 , H05K3/4046 , H05K2201/029 , H05K2201/05 , H05K2201/10287
Abstract: The present invention provides a stress relaxation substrate for relaxing stress generated due to differences in the hardness of a circuit substrate and a cloth body. This stress relaxation substrate is disposed between a cloth body and a circuit board having a wiring, wherein the stress relaxation substrate includes a stress relaxation layer harder than the cloth body, and softer than the circuit board, an adhesive layer provided on one surface of the stress relaxation layer, and a conductive portion provided on the stress relaxation layer to be formed between a first surface and a second surface.
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公开(公告)号:US20180254566A1
公开(公告)日:2018-09-06
申请号:US15449808
申请日:2017-03-03
Applicant: Microsoft Technology Licensing, LLC
Inventor: James David Holbery , Siyuan Ma , Flavio Protasio Ribeiro , Michael David Dickey , Collin Alexander Ladd , Andrew Lewis Fassler
IPC: H01R3/08 , H01R12/61 , H01L23/00 , H05K1/02 , H05K1/18 , H05K1/11 , H05K1/09 , H05K3/28 , H05K3/10 , H05K3/34
CPC classification number: H01R3/08 , H01L23/4985 , H01L23/49866 , H01L23/5389 , H01L24/69 , H01L24/89 , H01R12/613 , H05K1/028 , H05K1/09 , H05K1/111 , H05K1/18 , H05K3/10 , H05K3/28 , H05K3/34 , H05K2201/05 , H05K2201/10977
Abstract: Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.
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公开(公告)号:US20180249574A1
公开(公告)日:2018-08-30
申请号:US15942913
申请日:2018-04-02
Applicant: LG DISPLAY CO., LTD.
Inventor: Ducksu OH , Sung Soo PARK , Minsoo KANG
CPC classification number: H05K1/028 , H01L27/3276 , H05K1/111 , H05K1/117 , H05K1/118 , H05K1/14 , H05K1/141 , H05K1/142 , H05K1/145 , H05K1/147 , H05K1/189 , H05K3/323 , H05K3/361 , H05K3/363 , H05K2201/0397 , H05K2201/046 , H05K2201/05 , H05K2201/058 , H05K2201/09418 , H05K2201/10128 , H05K2201/10681 , H05K2203/049
Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.
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公开(公告)号:US10016590B2
公开(公告)日:2018-07-10
申请号:US15475788
申请日:2017-03-31
Applicant: Second Sight Medical Products, Inc.
Inventor: Robert J Greenberg , Jordan M Neysmith , James S Little , Brian V Mech , Neil H Talbot
CPC classification number: A61N1/0543 , A61N1/36046 , H05K1/036 , H05K1/0393 , H05K1/118 , H05K3/0014 , H05K2201/05 , H05K2201/053 , H05K2201/09063 , H05K2201/09409 , Y10T29/49002 , Y10T29/49117 , Y10T29/49155 , Y10T29/49156 , Y10T29/49158 , Y10T29/49174 , Y10T29/49176
Abstract: The present invention provides a flexible circuit electrode array adapted for neural stimulation, comprising: a polymer base layer; metal traces deposited on the polymer base layer, including electrodes suitable to stimulate neural tissue; a polymer top layer deposited on the polymer base layer and the metal traces at least one tack opening. The present invention provides further a method of making a flexible circuit electrode array comprising depositing a polymer base layer; depositing metal on the polymer base layer; patterning the metal to form metal traces; depositing a polymer top layer on the polymer base layer and the metal traces; and preparing at least one tack opening.
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公开(公告)号:US20180178493A1
公开(公告)日:2018-06-28
申请号:US15825176
申请日:2017-11-29
Applicant: Japan Display Inc.
Inventor: Takahiro FUJIOKA , Kazuhiro Odaka
CPC classification number: B32B27/04 , B23P19/04 , B32B2250/03 , H01L27/3244 , H01L51/003 , H01L2227/326 , H05K1/028 , H05K5/0017 , H05K2201/05
Abstract: A protective element includes a protective film including a first surface and a second surface opposite to the first surface; a first adhesive layer including an adhesive region on the first surface of the protective film; a first release film on the first adhesive layer; a second adhesive layer on the second surface of the protective film; a second release film on the second adhesive layer; a non-adhesive region located to surround the adhesive region, the non-adhesive region including a non-adhesive layer located between the first adhesive layer and the first release film; and a cutting portion located in the non-adhesive region and, as seen in a cross-sectional view, extending from a top surface of the protective film to a bottom surface of the non-adhesive layer.
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公开(公告)号:US20180168027A1
公开(公告)日:2018-06-14
申请号:US15882836
申请日:2018-01-29
Applicant: Apple Inc.
Inventor: Benjamin A. Cousins , Kurt R. Stiehl , Samuel G. Smith , Kirk M. Mayer , Siddhartha Hegde , Melody Kuna
IPC: H05K1/02 , H05K1/11 , G06F1/16 , H05K1/09 , H05K1/03 , A45C13/00 , H05K3/10 , A45C11/00 , H04M1/18 , H04M1/23
CPC classification number: H05K1/028 , A45C13/005 , A45C2011/003 , G06F1/1626 , G06F1/1656 , G06F1/1662 , G06F1/1683 , H04M1/185 , H04M1/23 , H05K1/0296 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/111 , H05K1/189 , H05K3/06 , H05K3/10 , H05K3/108 , H05K2201/05
Abstract: An electronic device such as a cover for a portable device may be provided with a body having hinge portions. The hinge portions may allow the body to bend about one or more bend axes. The cover may have electrical components such as a keyboard. A keyboard may be mounted at one end of the cover and a connector may be mounted at an opposing end of the cover. A flexible fabric signal path structure may be formed from metal traces on a flexible fabric substrate. At one end of the cover, the flexible fabric signal path structure may be coupled to a printed circuit in the keyboard using conductive adhesive. At the opposing end of the cover, the metal traces on the flexible fabric substrate may be coupled to the connector.
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