公开(公告)号：US6154364A

公开(公告)日：2000-11-28

申请号：US197093

申请日：1998-11-19

Applicant: Troy M. Girrens ,  Robert Gordon Fessenden ,  Dianne K. Ruch ,  Thomas P. Douglas ,  Timothy J. Guse ,  Billy R. Colwell ,  Sidney T. Faulkner

Inventor： Troy M. Girrens ,  Robert Gordon Fessenden ,  Dianne K. Ruch ,  Thomas P. Douglas ,  Timothy J. Guse ,  Billy R. Colwell ,  Sidney T. Faulkner

IPC: H01L23/36 ,  H05K3/34 ,  H05K3/40 ,  H05K7/20

CPC classification number: H01L23/36 ,  H05K3/341 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/10166 ,  H05K2201/1028 ,  H05K2201/1084 ,  H05K2201/10969 ,  H05K2203/0545 ,  H05K3/3426 ,  H05K3/3484 ,  H05K3/4015 ,  Y02P70/613

Abstract: A process and circuit board assembly by which a single soldering operation produces a multicomponent stack capable of dissipating heat from a power IC chip (12) mounted to a substrate (10). The circuit board assembly generally includes a number of conductors (16) on the substrate (10), with the conductors (16) being spaced apart and substantially parallel to each other. A heat spreader (14) is soldered to at least some of the conductors (16), and the chip (12) is soldered to the heat spreader (14). With this structure, heat is conducted from the chip (12) through the heat spreader (14) and conductors (16) to the substrate (10). To maintain proper orientation of the components (12, 14, 16) relative to each other during a single soldering operation, the components (12, 14, 16) are equipped with complementary features.

Abstract translation: 一种工艺和电路板组件，其中单个焊接操作产生能够从安装到衬底（10）的功率IC芯片（12）散热的多组件堆叠。 电路板组件通常在衬底（10）上包括多个导体（16），其中导体（16）彼此间隔开并且基本上彼此平行。 散热器（14）被焊接到至少一些导体（16），并且芯片（12）被焊接到散热器（14）。 利用这种结构，热量从芯片（12）通过散热器（14）和导体（16）传导到衬底（10）。 为了在单次焊接操作期间保持部件（12,14,16）相对于彼此的适当取向，部件（12,14,16）配备有互补特征。

公开(公告)号：US6142802A

公开(公告)日：2000-11-07

申请号：US441248

申请日：1999-11-16

Applicant: Jerry Berg ,  David Peter Gaio ,  William Kim Hogan

Inventor： Jerry Berg ,  David Peter Gaio ,  William Kim Hogan

IPC: G02B6/42 ,  H01R13/193 ,  H01R13/24 ,  H01R13/629 ,  H05K1/11 ,  H05K5/00 ,  H05K5/02 ,  H01R13/62

CPC classification number: H01R13/2442 ,  G02B6/4284 ,  H01R12/57 ,  H01R13/193 ,  H05K1/117 ,  G02B6/4246 ,  H05K2201/0746 ,  H05K2201/09409 ,  H05K2201/09663

Abstract: An electrical connector system has two connectors, one of which is included in a module mateable with the other connector in a pluggable manner. The other connector includes an elongated guide rail and a connector block in which are retained two or more electrical contacts. Signal connections can be made in a predetermined sequence when the module is plugged into the other connector because the contact pads of the module are of different lengths. For example, sequencing the connection of power and ground signals with respect to data signals provides hot-pluggability. Also, a grounding contact on the module is engaged by a spring clip on the other connector to provide an additional or alternative grounding path.

Abstract translation: 电连接器系统具有两个连接器，其中一个连接器被包括在可插拔方式与另一连接器配合的模块中。 另一个连接器包括细长的导轨和连接器块，其中保持有两个或更多个电触点。 当模块插入到另一个连接器中时，可以以预定顺序进行信号连接，因为模块的接触垫具有不同的长度。 例如，对数据信号的电源和接地信号的连接进行排序提供了热插拔功能。 此外，模块上的接地触点由另一个连接器上的弹簧夹接合以提供附加的或替代的接地路径。

公开(公告)号：US06118182A

公开(公告)日：2000-09-12

申请号：US104494

申请日：1998-06-25

Applicant: Michael Barrow

Inventor： Michael Barrow

IPC: H01L23/498 ,  H05K3/34 ,  H01L23/48

CPC classification number: H05K3/3436 ,  H01L23/49838 ,  H01L2224/05599 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09663 ,  Y02P70/613

Abstract: An integrated circuit package which has a substrate that has a plurality of rectangular contact pads. Solder balls are attached to the contact pads of the substrate. The solder balls are reflowed to create solder joints which attach the substrate to a printed circuit board. The rectangular shape of the contact pads will induce a rectangular shape in the solder joints. The longitudinal axis of the contact pads and resultant solder joints may be aligned with the axes of expansion/contraction of the substrate when the package substrate is subjected to variations in temperature.

Abstract translation: 一种集成电路封装，其具有具有多个矩形接触焊盘的基板。 焊球附着到基片的接触垫上。 焊球被回流以产生将衬底附接到印刷电路板的焊接接头。 接触焊盘的矩形形状将在焊点中引起矩形形状。 当封装衬底经受温度变化时，接触焊盘和所得到的焊点的纵向轴线可以与衬底的膨胀/收缩轴线对齐。

公开(公告)号：US6091609A

公开(公告)日：2000-07-18

申请号：US146010

申请日：1998-09-02

Applicant: Maurice Leron Hutson ,  Douglas Allan Kuchta ,  Paul Steven Severson

Inventor： Maurice Leron Hutson ,  Douglas Allan Kuchta ,  Paul Steven Severson

IPC: H05K7/10 ,  G06F1/18 ,  G06F13/40 ,  G11B33/12 ,  H02J1/10 ,  H02J9/00 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H05K7/18 ,  H05K7/06

CPC classification number: G11B33/126 ,  G06F1/184 ,  G06F1/187 ,  G06F1/188 ,  G06F13/409 ,  H02J1/102 ,  H05K1/0216 ,  H05K7/1492 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09663 ,  Y02B60/1228 ,  Y02B60/1235 ,  Y10T307/50

Abstract: An electronic system contains a backplane circuit card which supplies power to various modules. Embedded power distribution planes each include one or more islands, each island being associated with a respective module. The island is electrically isolated from the body of the power plane except at a relatively small area, called the power ramp. The electronic current path from the power plane to the module goes through the power ramp and the island. Preferably, a pair of adjacent power planes at +48 VDC and 0 VDC are in the middle layers of the backplane with a ground plane on either side. Signal planes carrying circuit patterns for multiple data signals are deposited as additional layers on either side of the ground planes. The pair of power planes are nearly identical patterns, the differences being the location of power connections for the modules. In particular, the islands and power ramps are located in the same places on each power plane. This causes substantially equal but opposite current densities in the power planes, so that transients induced when a module is removed from or inserted into a powered-on system are significantly reduced. The exemplary embodiment is an intelligent redundant array of independent disks (RAID) storage server having concurrent maintenance capability.

Abstract translation: 电子系统包含向各种模块供电的背板电路卡。 嵌入式配电平面各自包括一个或多个岛，每个岛与相应的模块相关联。 该岛与电力平面的主体电隔离，除了相对较小的区域，称为功率斜坡。 从电源平面到模块的电子电流通过电源斜坡和岛。 优选地，在+48VDC和0VDC处的一对相邻电力平面位于背板的中间层中，在任一侧具有接地平面。 携带多个数据信号的电路图案的信号平面作为附加层沉积在接地层的任一侧上。 一对电源平面几乎相同，不同之处在于模块的电源连接位置。 特别地，岛和功率斜坡位于每个电源平面上的相同位置。 这在电源平面中导致基本上相等但相反的电流密度，使得当模块被去除或插入到通电系统中时引起的瞬变显着减少。 该示例性实施例是具有并发维护能力的独立磁盘（RAID）存储服务器的智能冗余阵列。

公开(公告)号：US6044708A

公开(公告)日：2000-04-04

申请号：US256529

申请日：1999-02-24

Applicant: Nobuyuki Hirosawa

Inventor： Nobuyuki Hirosawa

IPC: H01L41/09 ,  G01C19/56 ,  G01C19/5628 ,  H05K3/36 ,  G01P9/00

CPC classification number: G01C19/5607 ,  G01C19/5628 ,  H05K3/363 ,  H05K2201/09063 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/09727

Abstract: The oscillation type gyroscope comprises an oscillator having electrodes for driving and for detection and also having oscillating arms adapted to oscillate in a cantilevered state, with front end portions of the oscillating arms being free ends; a support member for supporting a base end portion of the oscillator; a circuit board to which the support member is secured; a flexible printed circuit board with wiring patterns formed thereon and having oscillator-side end portions, a circuit board-side end portion and a wiring portion; first connecting portions provided in the oscillator-side end portions, conducted with the wiring patterns and connected to corresponding electrodes electrically by soldering at the base end portion of the oscillator; and a second connecting portion provided in the circuit board-side end portion, conducted with the wiring patterns and connected electrically to the circuit board at the circuit board-side end portion, wherein among the electrodes, those which lie in the same plane and which become equal in potential at the time of polarization and in use, are gathered as one group at the base end portion of the oscillator.

Abstract translation: 振荡型陀螺仪包括具有用于驱动和检测的电极的振荡器，并且还具有适于以悬臂状态摆动的摆动臂，其中摆动臂的前端部为自由端; 用于支撑所述振荡器的基端部分的支撑构件; 固定有支撑构件的电路板; 具有形成在其上的具有振荡器侧端部的布线图案的柔性印刷电路板，电路板侧端部和布线部分; 设置在振荡器侧端部的第一连接部分，与布线图案导通，并且通过在振荡器的基端部处通过焊接电连接到相应的电极; 以及第二连接部，其设置在所述电路基板侧端部，与所述布线图形一体地导电并与所述电路基板侧端部的所述电路基板电连接，其中，所述电极中位于同一平面内的电极， 在极化时和使用时的电位变得相等，在振荡器的基端部聚集成一组。

公开(公告)号：US6018462A

公开(公告)日：2000-01-25

申请号：US104824

申请日：1998-06-25

Applicant: Tomohiro Sakuyama

Inventor： Tomohiro Sakuyama

IPC: G01R31/26 ,  G01R31/28 ,  H01L21/66 ,  H01L23/498 ,  H01L23/538 ,  H01L23/58 ,  H01L25/04 ,  H01L25/18 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01L23/12 ,  H05K1/14

CPC classification number: H01L22/32 ,  H01L23/49816 ,  H01L23/5382 ,  H01L23/5386 ,  H05K1/113 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K1/0266 ,  H05K1/0268 ,  H05K1/111 ,  H05K2201/09663 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/3457

Abstract: An electrical pad for installation to a board, formed on the module substrate on which a plurality of tips is mounted, are divided into a plurality of divisional pads. Furthermore, each of the divisional pads are connected to each electrode terminals of those tips, and when installed, divisional pads of a pad are electrically connected to be united into a pad.

Abstract translation: 形成在其上安装有多个尖端的模块基板上的用于安装到基板的电焊盘被分成多个分隔板。 此外，每个分区焊盘连接到那些尖端的每个电极端子，并且当安装时，焊盘的分隔焊盘电连接以组合成焊盘。

公开(公告)号：US6016084A

公开(公告)日：2000-01-18

申请号：US994563

申请日：1997-12-19

Applicant: Satoshi Sugimoto

Inventor： Satoshi Sugimoto

IPC: H03H7/01 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0233 ,  H03H7/01 ,  H03H7/1758 ,  H03H7/1775 ,  H05K1/0215 ,  H05K1/023 ,  H05K1/0234 ,  H05K1/165 ,  H05K1/0227 ,  H05K1/0231 ,  H05K1/162 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/093 ,  H05K2201/09663 ,  H05K2201/10022 ,  H05K2201/10409 ,  H05K2201/10522

Abstract: A ground pattern of a printed circuit board of an electronic instrument is connected with a conductive part of a housing of the instrument by a series combination of components respectively having the inductive nature and capacitive nature, or by a series combination of components respectively having the resistive nature and capacitive nature, or by a series combination of components respectively having the inductive nature, capacitive nature, and resistive nature. In this way the impedance can be adjusted against frequency so as to be ready for the frequency where the standing wave appears, the resonance frequency of LC series circuit, and harmonic frequencies of electric current flowing on the circuit board. In another arrangement, the ground pattern of a printed circuit board is connected with the conductive part of the housing of instrument through a plurality of separate connection paths with different impedances.

Abstract translation: 电子仪器的印刷电路板的接地图案通过分别具有电感特性和电容性质的部件的串联组合或分别具有电阻的部件的串联组合与仪器的壳体的导电部分连接 自然和电容性质，或通过分别具有感性性质，电容性质和电阻性质的组分的串联组合。 以这种方式，可以根据频率调整阻抗，以便准备好出现驻波的频率，LC串联电路的谐振频率和电路板上电流的谐波频率。 在另一种布置中，印刷电路板的接地图案通过具有不同阻抗的多个单独的连接路径与仪器壳体的导电部分连接。

公开(公告)号：US5880925A

公开(公告)日：1999-03-09

申请号：US884597

申请日：1997-06-27

Applicant: David A. DuPre ,  John L. Galvagni ,  Andrew P. Ritter

Inventor： David A. DuPre ,  John L. Galvagni ,  Andrew P. Ritter

IPC: H01G4/12 ,  H01G2/06 ,  H01G4/252 ,  H01G4/30 ,  H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H01G4/005 ,  H01G4/06 ,  H01G4/228

CPC classification number: H01G2/065 ,  H01G4/30 ,  H05K3/3442 ,  H05K1/0216 ,  H05K1/0231 ,  H05K1/112 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/0979 ,  H05K2201/10045 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A multilayer ceramic device suitable for use in surface mount decoupling applications may have a single capacitor or a capacitor array. The device has a capacitor body defining a plurality of electrical terminals on an outer surface thereof. The terminals are interdigitated such that a respective first polarity terminal will be adjacent to a respective second polarity terminal (and vice versa). The capacitor body contains a plurality of interleaved capacitor plates in opposed and spaced apart relation. Capacitor plates of the first polarity are electrically connected to respective first polarity terminals via a plurality of lead structures. Likewise, a plurality of lead structures electrically connect capacitor plates of the second polarity to respective second polarity terminals.

Abstract translation: 适用于表面贴装去耦应用的多层陶瓷器件可以具有单个电容器或电容器阵列。 该装置具有在其外表面上限定多个电端子的电容器主体。 端子相互交错，使得相应的第一极性端子将与相应的第二极性端子相邻（反之亦然）。 电容器主体包含相互间隔开的多个交错电容器板。 第一极性的电容器板经由多个引线结构电连接到相应的第一极性端子。 同样地，多个引线结构将第二极性的电容器板电连接到相应的第二极性端子。

公开(公告)号：US5877033A

公开(公告)日：1999-03-02

申请号：US812903

申请日：1997-03-10

Applicant: Michael L. Matern

Inventor： Michael L. Matern

IPC: H05K1/02 ,  H05K1/11 ,  H01L21/00

CPC classification number: H05K1/111 ,  H05K1/0268 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10689 ,  Y02P70/611

Abstract: A system for detecting certain improperly soldered electrical component connections to a printed circuit board includes methods and apparatus providing an automated means for detecting unsoldered component leads is disclosed. A connection pad divided into two portions, or land areas is bridged by the component lead when soldered. A test pad connected to one of the land areas provides a test point for detecting the presence or absence of an open circuit condition through the lead of an electrical component to a point in the circuit to which it is to be electrically connected.

Abstract translation: 一种用于检测与印刷电路板的某些不正确焊接的电气部件连接的系统包括提供用于检测未焊接部件引线的自动化装置的方法和装置。 连接焊盘分为两部分，或焊接区域由部件引线桥接。 连接到其中一个陆地区域的测试焊盘提供了一个测试点，用于通过电气部件的引线到电气连接的电路中的一个点检测是否存在开路状态。

公开(公告)号：US5847451A

公开(公告)日：1998-12-08

申请号：US721793

申请日：1996-09-25

Applicant: Toru Ohtaki ,  Yasuteru Ichida ,  Yasushi Takeuchi

Inventor： Toru Ohtaki ,  Yasuteru Ichida ,  Yasushi Takeuchi

IPC: H01L23/12 ,  H01L23/64 ,  H05K1/00 ,  H05K1/02 ,  H05K1/16 ,  H05K3/34 ,  H05K3/46 ,  H01L23/48 ,  H01L23/34 ,  H01L29/00 ,  H01L29/053

CPC classification number: H01L23/642 ,  H01L23/645 ,  H05K1/0233 ,  H05K1/165 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0298 ,  H05K1/162 ,  H05K2201/09263 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/09772 ,  H05K2201/1006 ,  H05K2201/10689 ,  H05K3/3421 ,  Y10S257/924

Abstract: In a multi-layered printed circuit board on which an LSI having a plurality of power supply pins and a plurality of signal pins is mounted, and a grid array package which adopts the printed circuit board, some or all of the plurality of power supply pins are connected to a power supply pattern via an inductance pattern, thereby reducing generation of radiation noise.

Abstract translation: 在其上安装有多个电源引脚和多个信号引脚的LSI的多层印刷电路板和采用该印刷电路板的栅格阵列封装中，多个电源引脚中的一些或全部 通过电感图案连接到电源图案，从而减少辐射噪声的产生。