公开(公告)号：US20060180341A1

公开(公告)日：2006-08-17

申请号：US11397802

申请日：2006-04-05

Applicant: Takashi Kariya ,  Toshiki Furutani

Inventor： Takashi Kariya ,  Toshiki Furutani

IPC: H05K1/03

CPC classification number: H01L24/16 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30105 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/111 ,  H05K1/115 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/068 ,  H05K2201/09881 ,  H05K2201/10674 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A multilayer printed wiring board 10 includes: a core substrate 20; a build-up layer 30 formed on the core substrate 20 and having a conductor pattern 32 on an upper surface; a low elastic modulus layer 40 formed on the build-up layer 30; lands 52 that are disposed on an upper surface of the low elastic modulus layer 40 and connected via solder bumps 66 to a semiconductor chip 70; and conductor posts 50 that are passing through the low elastic modulus layer 40 and electrically connecting lands 52 with conductor patterns 32. The conductor posts 50 are formed to have the diameters of an upper portion and a lower portion of 80 μm, the diameter of an intermediate portion of 35 μm, the height of 200 μm, and the aspect ratio Rasp (height/minimum diameter) of 5.7 and the maximum diameter/minimum diameter of 2.3.

Abstract translation: 多层印刷线路板10包括：芯基板20; 形成在芯基板20上并且在上表面上具有导体图案32的堆积层30; 形成在积层30上的低弹性模量层40; 焊盘52设置在低弹性模量层40的上表面上并通过焊锡凸块66连接到半导体芯片70; 以及导体柱50，其穿过低弹性模量层40和电连接焊盘52与导体图案32。 导体柱50形成为具有80μm的上部和下部的直径，35μm的中间部分的直径，200μm的高度以及纵横比Rasp（高度/最小直径） 5.7，最大直径/最小直径为2.3。

公开(公告)号：US20060147684A1

公开(公告)日：2006-07-06

申请号：US11364056

申请日：2006-03-01

Applicant: Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

Inventor： Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

IPC: B32B3/00 ,  B32B18/00

CPC classification number: H05K3/4688 ,  B32B17/04 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/068 ,  H05K2201/0959 ,  H05K2203/162 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A manufacturing method of a layered board that includes a core layer that serves as a printed board, and a buildup layer that is electrically connected to said core layer, said buildup layer including an insulation-part and a wiring part includes the step of setting a coefficient of thermal expansion, a thickness and a modulus of longitudinal elasticity of each layer so that the layered board has a predetermined value of the coefficient of thermal expansion.

Abstract translation: 一种层叠板的制造方法，其包括用作印刷电路板的芯层和与所述芯层电连接的积层，所述积层层包括绝缘部分和布线部分，包括设置 热膨胀系数，各层的厚度和纵向弹性模量，使得层状板具有预定的热膨胀系数。

公开(公告)号：US20060114011A1

公开(公告)日：2006-06-01

申请号：US11329583

申请日：2006-01-11

Applicant: Phillip Byrd

Inventor： Phillip Byrd

IPC: H04R31/00

CPC classification number: G01R1/06766 ,  G01R1/07371 ,  G01R3/00 ,  G01R31/2886 ,  H05K1/0293 ,  H05K1/09 ,  H05K1/167 ,  H05K2201/068 ,  H05K2201/10053 ,  H05K2201/10181 ,  Y10T29/49004 ,  Y10T29/49005 ,  Y10T29/49107 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49204

Abstract: Probe cards are configured with protective circuitry suitable for use in electrical testing of semiconductor dice without damage to the probe cards. Protective fuses are provided in electrical communication with conductive traces and probe elements (e.g., probe needles) of a probe card. The fuses may be active or passive fuses and are preferably self-resetting, repairable, and/or replaceable. Typically, the fuses will be interposed in, or located adjacent to, conductive traces residing over a surface of the probe card. Methods of fabricating a probe card are provided, as well as various probe card configurations. A semiconductor die testing system using the probe card is also provided.

Abstract translation: 探头卡配置有适用于半导体裸片电气测试的保护电路，而不会损坏探针卡。 提供保护性熔丝与探针卡的导电迹线和探针元件（例如探针）电连通。 保险丝可以是有源或被动保险丝，并且优选地是自复位，可修复和/或可更换的。 通常，保险丝将被置于位于探针卡的表面上方的导电迹线中或邻近其上。 提供制造探针卡的方法以及各种探针卡配置。 还提供了使用探针卡的半导体管芯测试系统。

公开(公告)号：US20060074151A1

公开(公告)日：2006-04-06

申请号：US10952102

申请日：2004-09-28

Applicant: Guoren He ,  William Varnell ,  Thomas Williams

Inventor： Guoren He ,  William Varnell ,  Thomas Williams

IPC: C08L63/00

CPC classification number: H05K1/0373 ,  C08L63/00 ,  C08L71/12 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/121 ,  C08L2666/22

Abstract: Dielectric compositions comprising a first component and a second component present at about 5 parts to about 60 parts filler per 100 parts of the first component are disclosed. In certain examples, the first component includes a polyphenylene ether, a polyepoxide, and optionally a compatibilizing agent and a catalyst. Certain examples of the dielectric compositions disclosed herein have low coefficients of thermal expansion. Prepregs, laminates, molded articles and printed circuit boards using the dielectric compositions are also disclosed.

Abstract translation: 公开了包含第一组分和第二组分的介电组合物，其以每100份第一组分约5份至约60份填料存在。 在某些实例中，第一组分包括聚苯醚，聚环氧化物和任选的相容剂和催化剂。 本文公开的电介质组合物的某些实例具有低的热膨胀系数。 还公开了使用电介质组合物的预浸料，层压板，模制品和印刷电路板。

公开(公告)号：US07000316B2

公开(公告)日：2006-02-21

申请号：US10750617

申请日：2003-12-31

Applicant: Jurgen Schulz-Harder ,  Andreas Meyer

Inventor： Jurgen Schulz-Harder ,  Andreas Meyer

IPC: H01R43/04

CPC classification number: H05K3/4084 ,  H05K1/0306 ,  H05K3/321 ,  H05K3/328 ,  H05K3/3484 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/10416 ,  H05K2203/0195 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49218

Abstract: The conductor board has at least one layer of a dielectric provided areally on two mutually opposed faces with at least one metalization on each. There is at least one through contacting in the region of an aperture. The metalizations are applied to cover at least one aperture and are electrically connected to each other through the aperture.

公开(公告)号：US06974515B2

公开(公告)日：2005-12-13

申请号：US10352709

申请日：2003-01-27

Applicant: Anja Neubert ,  Holger Hoefer

Inventor： Anja Neubert ,  Holger Hoefer

IPC: G01L1/22 ,  B32B9/00 ,  B32B18/00 ,  C04B35/00 ,  C04B35/622 ,  G01L9/04 ,  H05K1/03 ,  H05K3/00 ,  B32B31/26

CPC classification number: B32B18/00 ,  B32B2315/02 ,  C04B2235/9607 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/582 ,  C04B2237/76 ,  H05K1/0306 ,  H05K3/0014 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/09018

Abstract: A ceramic substrate having a defined curvature and a method of its manufacture are described. For this purpose at least two ceramic layers having different defined temperature coefficients of expansion are positioned on top of one another and are permanently bonded together. A curved ceramic substrate may be advantageously utilized in micro-hybrid technology, in multilayer ceramic technology, or in hybrid technology, e.g., as a membrane element of a piezoresistive pressure sensor element.

Abstract translation: 描述了具有限定曲率的陶瓷衬底及其制造方法。 为此，具有不同的限定温度膨胀系数的至少两个陶瓷层位于彼此之上并永久地结合在一起。 弯曲的陶瓷衬底可以有利地用于微混合技术，多层陶瓷技术或混合技术中，例如作为压阻式压力传感器元件的膜元件。

公开(公告)号：US20050266212A1

公开(公告)日：2005-12-01

申请号：US10997973

申请日：2004-11-29

Applicant: Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

Inventor： Takashi Kanda ,  Kenji Fukuzono ,  Manabu Watanabe

IPC: B32B3/00 ,  B32B17/04 ,  H01L23/12 ,  H05K1/00 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4688 ,  B32B17/04 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4673 ,  H05K2201/068 ,  H05K2201/0959 ,  H05K2203/162 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A manufacturing method of a layered board that includes a core layer that serves as a printed board, and a buildup layer that is electrically connected to said core layer, said buildup layer including an insulation part and a wiring part includes the step of setting a coefficient of thermal expansion, a thickness and a modulus of longitudinal elasticity of each layer so that the layered board has a predetermined value of the coefficient of thermal expansion.

Abstract translation: 一种分层板的制造方法，其包括用作印刷电路板的芯层和与所述芯层电连接的积层，所述积层层包括绝缘部分和布线部分，包括设定系数 的热膨胀，各层的厚度和纵向弹性模量，使得层状板具有预定的热膨胀系数值。

公开(公告)号：US20050252682A1

公开(公告)日：2005-11-17

申请号：US11125158

申请日：2005-05-10

Applicant: Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

Inventor： Tadanori Shimoto ,  Katsumi Kikuchi ,  Hideya Murai ,  Kazuhiro Baba ,  Hirokazu Honda ,  Keiichiro Kata

IPC: H01L23/12 ,  H01L21/48 ,  H01L21/68 ,  H01L23/14 ,  H01L23/498 ,  H01L25/065 ,  H05K1/03 ,  H05K1/11 ,  H05K3/20 ,  H05K3/42

CPC classification number: H01L23/49816 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/145 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0366 ,  H05K3/205 ,  H05K3/423 ,  H05K2201/0376 ,  H05K2201/068 ,  H05K2203/0733 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wiring board has a base insulating film. The base insulating film has a thickness of 20 to 100 μm and is made of a heat-resistant resin which has a glass-transition temperature of 150° C. or higher and which contains reinforcing fibers made of glass or aramid. The base insulating film has the following physical properties (1) to (6) when an elastic modulus at a temperature of T° C. is given as DT (GPa) and a breaking strength at a temperature of T° C. is given as HT (MPa). (1) A coefficient of thermal expansion in the direction of thickness thereof is 90 ppm/K or less. (2) D23≧5 (3) D150≧2.5 (4) (D-65/D150)≦3.0 (5) H23≧140 (6) (H-65/H150)≦2.3

Abstract translation: 布线板具有基底绝缘膜。 基底绝缘膜的厚度为20〜100μm，由玻璃化转变温度为150℃以上的含有玻璃或芳族聚酰胺的增强纤维的耐热性树脂构成。 当在T℃的温度下的弹性模量为D T（GPa）时，基体绝缘膜具有以下物理性质（1）至（6））和在温度下的断裂强度 的T℃给出为H T（MPa）。 （1）其厚度方向的热膨胀系数为90ppm / K以下。 （2）D 23 = 5（3）D 150 > = 2.5（4）（D-65 / D 150 <= 3.0（5）H 23 = 140（6）（H-65 / H 150） 2.3

公开(公告)号：US06956174B2

公开(公告)日：2005-10-18

申请号：US09295269

申请日：1999-04-20

Applicant: Igor Y. Khandros ,  Gaetan L. Mathieu

Inventor： Igor Y. Khandros ,  Gaetan L. Mathieu

IPC: H01L23/12 ,  C23C18/16 ,  C25D7/12 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/66 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R4/02 ,  H01R9/00 ,  H01R12/52 ,  H01R33/76 ,  H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R12/04 ,  H05K1/11

CPC classification number: H05K7/1069 ,  B23K2101/40 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06761 ,  G01R1/07314 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2884 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/67138 ,  H01L21/6715 ,  H01L22/20 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06153 ,  H01L2224/1134 ,  H01L2224/13083 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49162 ,  Y10T29/49169 ,  Y10T29/49217 ,  Y10T29/49224 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/81205

Abstract: An interconnection contact structure assembly including an electronic component having a surface and a conductive contact carried by the electronic component and accessible at the surface. The contact structure includes an internal flexible elongate member having first and second ends and with the first end forming a first intimate bond to the surface of said conductive contact terminal without the use of a separate bonding material. An electrically conductive shell is provided and is formed of at least one layer of a conductive material enveloping the elongate member and forming a second intimate bond with at lease a portion of the conductive contact terminal immediately adjacent the first intimate bond.

Abstract translation: 一种互连接触结构组件，包括具有表面的电子部件和由电子部件承载并可在表面处接触的导电接触。 接触结构包括具有第一端和第二端的内部柔性细长构件，并且第一端在不使用单独的接合材料的情况下形成与所述导电接触端子的表面的第一紧密结合。 提供导电外壳，并且由至少一层导电材料形成，所述导电材料层包围细长构件并形成第二紧密结合，至少一部分直接邻近第一紧密接合的导电接触端子。

公开(公告)号：US20050205297A1

公开(公告)日：2005-09-22

申请号：US11142399

申请日：2005-06-02

Applicant: Tokihito Suwa ,  Haruo Akahoshi ,  Shingo Kumamoto

Inventor： Tokihito Suwa ,  Haruo Akahoshi ,  Shingo Kumamoto

IPC: H05K1/09 ,  H01L21/4763 ,  H01L23/12 ,  H01L23/14 ,  H05K1/11 ,  H05K1/14 ,  H05K3/44 ,  H05K3/46

CPC classification number: H05K3/44 ,  H05K1/115 ,  H05K3/4641 ,  H05K2201/0338 ,  H05K2201/068 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/09663

Abstract: A multilayer circuit board including a laminate of at least one insulating layer and at least one wiring layer. The wiring layer is formed by a composite member having a first metal layer and a second metal layer formed on one or both sides of the first metal layer. The first metal layer having a smaller coefficient of thermal expansion than the second metal layer. The second metal layer having a higher electric conductivity than the first metal layer. The insulating layer has a blind via-hole with a bottom provided by a surface of the second metal layer. A layer-to-layer interconnection portion is provided on the surface of the insulating layer and in the blind via-hole and is formed in the blind via-hole to be in contact with the surface of the second metal layer.

Abstract translation: 包括至少一个绝缘层和至少一个布线层的叠层的多层电路板。 布线层由具有形成在第一金属层的一侧或两侧上的第一金属层和第二金属层的复合构件形成。 第一金属层的热膨胀系数小于第二金属层。 第二金属层的导电率比第一金属层高。 绝缘层具有通过第二金属层的表面设置的底部的盲通孔。 在绝缘层的表面和盲通孔中设置层间互连部，并且形成在盲通孔中，与第二金属层的表面接触。