公开(公告)号：US20170311447A1

公开(公告)日：2017-10-26

申请号：US15495405

申请日：2017-04-24

Applicant: LINEAR TECHNOLOGY CORPORATION

Inventor： John David BRAZZLE ,  Frederick E. BEVILLE ,  David A. PRUITT

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/181 ,  H01L23/49811 ,  H01L23/50 ,  H05K1/0203 ,  H05K3/284 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10553 ,  H05K2201/10757 ,  H05K2203/1316

Abstract: A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.A method of making a component-on-package circuit may include attaching a component for an electrical circuit to a circuit module. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component after the attachment both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides a spring-like cushioning of force applied to the component in the direction of the circuit module. The circuit module may be encapsulated in molding material after the circuit module has been attached to the component, without encapsulation the component at the same time.

公开(公告)号：US20170236643A1

公开(公告)日：2017-08-17

申请号：US15518746

申请日：2015-08-27

Applicant: Robert Bosch GmbH

Inventor： Thomas PEUSER

IPC: H01G4/228 ,  H01G4/258 ,  H01L23/373 ,  H01L29/861 ,  H05K1/18 ,  H01L23/00 ,  H01L23/498 ,  H01G4/12

CPC classification number: H01G4/228 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/258 ,  H01G4/30 ,  H01L23/3735 ,  H01L23/49555 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/06 ,  H01L29/861 ,  H01L2224/05082 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/0516 ,  H01L2224/06181 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10174 ,  H05K2201/10757 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/613 ,  H01L2924/00

Abstract: The invention relates to an electronic component. The electronic component 2 has an electrical assembly 3 having two electrical connections 4, 5 that are each formed on opposing faces of the assembly. For each connection 4, 5, the component has at least one electrically conductive connection element 9, 10 having a mounting foot 14, 15 for connection to a circuit carrier 22. According to the invention, the connection element 8, 9 has at least two metal layers 10, 11, 12, 13 at least on one section, wherein the metal layers are each formed from different metals and integrally connected to one another. Preferably, one metal layer 12, 13 from the metal layers has greater thermal conductivity than the other metal layer 10, 11.

公开(公告)号：US20160163613A1

公开(公告)日：2016-06-09

申请号：US14900651

申请日：2014-06-24

Applicant: DENSO CORPORATION

Inventor： Shinya UCHIBORI ,  Norihisa IMAIZUMI ,  Masayuki TAKENAKA

IPC: H01L23/31 ,  H05K1/18 ,  H01L23/498

CPC classification number: H01L23/3157 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K3/301 ,  H05K3/3415 ,  H05K2201/09436 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10583 ,  H05K2201/10757 ,  H05K2201/2036 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic apparatus includes a board, a first electronic component, a mold resin and a second electronic component. The board has a first surface and a second surface opposite to the first surface. The first electronic component is mounted on the first surface of the board. The mold resin seals the first electronic component and the first surface of the board. The second electronic component is arranged on the mold resin.

Abstract translation: 电子设备包括板，第一电子部件，模具树脂和第二电子部件。 板具有与第一表面相对的第一表面和第二表面。 第一电子部件安装在板的第一表面上。 模具树脂密封第一电子部件和板的第一表面。 第二电子部件布置在模制树脂上。

公开(公告)号：US09332645B2

公开(公告)日：2016-05-03

申请号：US14190297

申请日：2014-02-26

Applicant: DENSO CORPORATION ,  Murata Manufacturing Co., Ltd.

Inventor： Yuuto Kamiya ,  Toru Itabashi ,  Ryoichi Shiraishi ,  Yuki Mikami ,  Akihiro Yanagisawa ,  Shigeki Nishiyama

IPC: H02H5/04 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/181 ,  H05K3/3426 ,  H05K2201/10015 ,  H05K2201/10181 ,  H05K2201/10636 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2201/10848 ,  H05K2201/10946 ,  Y02P70/611

Abstract: A main body of an electronic part has multiple electrodes, to which multiple terminals are respectively connected. The terminals include a fuse terminal and a normal terminal, each of which extends from the main body to a printed board so that the main body is supported at a position above and separated from a board surface of the printed board. The fuse terminal has an intermediate portion between an electrode-connected portion and a land-connected portion. The intermediate portion has a cut-off portion having a smaller width than other portions of the fuse terminal, so that the cut-off portion is melted down when excess current flows in the fuse terminal. The intermediate portion extends in a direction parallel to the board surface or in a direction inclined to the board surface at an angle smaller than 90 degrees.

Abstract translation: 电子部件的主体具有分别连接有多个端子的多个电极。 端子包括保险丝端子和正常端子，每个端子从主体延伸到印刷电路板，使得主体被支撑在印刷电路板的板表面上方和离开印刷电路板的位置。 熔丝端子在电极连接部分和平台连接部分之间具有中间部分。 中间部分具有比熔丝端子的其它部分更小的宽度的截止部分，使得当过剩电流在熔丝端子中流动时，切断部分熔化。 中间部分在平行于板表面的方向上或者以小于90度的角度沿与板表面倾斜的方向延伸。

公开(公告)号：US20150313024A1

公开(公告)日：2015-10-29

申请号：US14792713

申请日：2015-07-07

Applicant: FUJITSU COMPONENT LIMITED

Inventor： Takeshi Okuyama ,  Toshihiro Kusagaya ,  Tohru Yamakami

IPC: H05K3/34

CPC classification number: H05K3/3426 ,  H01R4/028 ,  H01R12/57 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/025 ,  H05K3/3494 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10803 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/04 ,  Y02P70/613

Abstract: Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.

Abstract translation: 公开了一种表面安装装置，其安装在基座构件上，包括多个引线单元，所述多个引线单元中的每一个包括：引线，其包括形成在引线端部的主体部分和脚部; 形成在引脚的脚部处的焊料部分朝向基部构件的方向突出以具有顶部部分，以及设置在引线上的防止扩散部分，用于防止焊料沿引线的主体部分扩散。

公开(公告)号：US09147630B2

公开(公告)日：2015-09-29

申请号：US13786129

申请日：2013-03-05

Applicant: Infineon Technologies AG

Inventor： Andrea Carletti

IPC: H01L23/48 ,  H01L23/34 ,  H01L23/00 ,  H01L23/36 ,  H01L23/40 ,  H01L23/42

CPC classification number: H01L23/34 ,  H01L23/36 ,  H01L23/4006 ,  H01L23/42 ,  H01L24/92 ,  H01L2924/0002 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H05K1/0203 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/10757 ,  H05K2201/10765 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A method and apparatus for assembling a power semiconductor is provided. A device includes a printed circuit board, a heat sink, and a semiconductor chip package. The semiconductor chip package is located between the printed circuit board and the heat sink. A heat-generating surface of the semiconductor chip package is oriented such that the heat-generating surface faces the heat sink.

Abstract translation: 提供了一种用于组装功率半导体的方法和装置。 一种器件包括印刷电路板，散热器和半导体芯片封装。 半导体芯片封装位于印刷电路板和散热片之间。 半导体芯片封装的发热表面被定向成使得发热表面面向散热器。

公开(公告)号：US20150146355A1

公开(公告)日：2015-05-28

申请号：US14541135

申请日：2014-11-13

Applicant: Dileep Goyal ,  Mihai Ionescu ,  Hari N. Chakravarthula

Inventor： Dileep Goyal ,  Mihai Ionescu ,  Hari N. Chakravarthula

IPC: G06F1/16 ,  H05K3/00 ,  H05K1/18

CPC classification number: G06F1/163 ,  A61B5/0533 ,  A61B5/6831 ,  G04G17/04 ,  G04G21/025 ,  H05K1/0271 ,  H05K1/0277 ,  H05K1/028 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/0379 ,  H05K2201/10469 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/2009 ,  H05K2203/0126 ,  H05K2203/1327

Abstract: Embodiments relate generally to wearable electrical and electronic hardware, computer software, wired and wireless network communications, and to wearable/mobile computing devices. More specifically, various embodiments are directed to, for example, aligning a flexible substrate and/or components thereof during fabrication to enhance reliability. In one example, a method includes forming a framework that includes, for example, a portion (e.g., an anchor portion) configured to couple to a flexible substrate, the portion having a neutral axis. Also, the method may include forming a flexible substrate that includes a supported flex region including conductors and one or more rigid regions configured to receive one or more components. A rigid region might include an encapsulated rigid region. The method further may also include aligning the encapsulated rigid region at an angle to the neutral axis, and molding over the encapsulated rigid region.

Abstract translation: 实施例一般涉及可穿戴电气和电子硬件，计算机软件，有线和无线网络通信以及可穿戴/移动计算设备。 更具体地，各种实施例涉及例如在制造期间对准柔性基板和/或其部件以增强可靠性。 在一个示例中，一种方法包括形成框架，该框架包括例如被配置为耦合到柔性基板的部分（例如，锚定部分），所述部分具有中性轴线。 此外，该方法可以包括形成柔性基板，该柔性基板包括被支撑的柔性区域，该支撑的柔性区域包括导体和一个或多个刚性区域，该刚性区域被配置为 刚性区域可以包括封装的刚性区域。 该方法还可以包括将封装的刚性区域与中性轴线成角度对准，并且在封装的刚性区域上模制。

公开(公告)号：US20140369042A1

公开(公告)日：2014-12-18

申请号：US14228356

申请日：2014-03-28

Applicant: AU Optronics Corporation

Inventor： Ming-Ji HSU

IPC: F21V23/00

CPC classification number: F21V23/00 ,  F21Y2101/00 ,  F21Y2115/10 ,  H05K1/0296 ,  H05K3/3421 ,  H05K2201/10106 ,  H05K2201/10757

Abstract: A light source module includes a substrate, a circuit, at least one first light source unit, and at least one second light source. The circuit is disposed on the substrate and includes a first signal channel and a second signal channel. The first light source unit is disposed on a bearing surface, wherein the first light source unit has a first A pin and a first B pin having different polarity from the first A pin. The second light source unit is disposed on the bearing surface and is adjacent to the first light source unit, wherein the second light source unit has a second A pin and a second B pin having different polarity from the second A pin, and the second A pin is adjacent to the first A pin of the first light source unit and has a same polarity with the first A pin.

Abstract translation: 光源模块包括基板，电路，至少一个第一光源单元和至少一个第二光源。 电路设置在基板上，并且包括第一信号通道和第二信号通道。 第一光源单元设置在支承表面上，其中第一光源单元具有第一A引脚和与第一A引脚具有不同极性的第一B引脚。 第二光源单元设置在支承表面上并与第一光源单元相邻，其中第二光源单元具有第二A引脚和与第二A引脚具有不同极性的第二B引脚，第二A 引脚与第一光源单元的第一个A引脚相邻，并且与第一个A引脚具有相同的极性。

公开(公告)号：US08867220B2

公开(公告)日：2014-10-21

申请号：US13209062

申请日：2011-08-12

Applicant: Yukinori Kita

Inventor： Yukinori Kita

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/306 ,  H01R43/0256 ,  H05K3/02 ,  H05K3/3447 ,  H05K2201/10295 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/10757 ,  H05K2201/10818

Abstract: A packaging board of the type having board terminals soldered on a printed board and including an insulation support member made of a resin disposed on a printed board having tubular support portions configured to receive board terminals, visual recognition windows configured for visually recognizing soldering portions of the board terminals inserted into the printed board through the windows, and engaging portions that engage the board terminals and define insertion amounts of the board terminals.

Abstract translation: 一种具有板端子的封装板，其焊接在印刷电路板上，并且包括由设置在印刷电路板上的树脂构成的绝缘支撑部件，所述绝缘支撑部件设置在具有用于容纳电路板端子的管状支撑部分的印刷电路板上， 板端子通过窗口插入印刷电路板，以及接合部分，其接合电路板端子并限定电路板端子的插入量。

公开(公告)号：US08795865B2

公开(公告)日：2014-08-05

申请号：US12358032

申请日：2009-01-22

Applicant: Junyoung Park

Inventor： Junyoung Park

IPC: H01M2/10 ,  H01M4/02

CPC classification number: H01M4/02 ,  H01M2/0404 ,  H01M2/1055 ,  H01M2/30 ,  H01M10/425 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10871

Abstract: A battery pack that prevents a solder material from flowing down due to a tab electrically connecting a battery to a protective circuit board, thereby improving reliability, coupling efficiency, safety, and productivity is disclosed. The battery pack includes: a multi-cell battery having a positive electrode and a negative electrode, in which a plurality of battery cells are electrically connected to each other; a protective circuit board electrically connected to the multi-cell battery and having via holes; a pair of conductive tabs each including an insert portion inserted into a corresponding via hole and a bending portion integrally extending from the insert portion and bent from the insert portion; and a pair of soldering portions each being formed at at least some portions of a corresponding insert portion and a corresponding bending portion.

Abstract translation: 公开了一种电池组，其防止由于电池将电池连接到保护电路板而将焊料材料向下流动，从而提高了可靠性，耦合效率，安全性和生产率。 电池组包括：具有正电极和负电极的多单元电池，多个电池单元彼此电连接; 电连接到多节电池并具有通孔的保护电路板; 一对导电片，每个导电片包括插入对应的通孔中的插入部分和从插入部分整体延伸并从插入部分弯曲的弯曲部分; 以及一对焊接部分，每个焊接部分在相应的插入部分和对应的弯曲部分的至少一些部分处形成。