公开(公告)号：US09482410B2

公开(公告)日：2016-11-01

申请号：US14068915

申请日：2013-10-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ki Un Lee ,  June Jang ,  Seung Gyun Jung

IPC: F21V11/00 ,  F21V13/02 ,  H01L25/075 ,  F21S8/04 ,  F21V5/04 ,  F21V7/00 ,  F21V23/04 ,  H05K1/05 ,  H05B33/08 ,  H05B37/02 ,  H01L33/38 ,  F21Y101/02 ,  F21Y105/00 ,  H05K1/02 ,  H05K3/00

CPC classification number: F21V13/02 ,  F21S8/04 ,  F21V5/04 ,  F21V7/0033 ,  F21V23/0442 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2105/12 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/382 ,  H01L2224/48091 ,  H05B33/0872 ,  H05B37/0227 ,  H05B37/0272 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/021 ,  H05K1/0278 ,  H05K1/056 ,  H05K3/0061 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10409 ,  H05K2203/0594 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: A light emitting module is configured to provide substantially uniform lighting using a plurality of lighting sources. The light emitting module includes a diffusion plate disposed at a set distance from the light emitting module. A light source substrate has a substantially quadrilateral outer perimeter with at least one gap formed therein, and a plurality of light sources are disposed on the light source substrate according to a repeated quadrilateral pattern. A distance between adjacent light sources in the repeated quadrilateral pattern is selected based on the set distance h from the diffusion plate to the light emitting module, and on a greater of two diagonal distances x, y of the quadrilateral pattern. The diffusion plate diffuses light emitted by the light sources to provide substantially uniform light. Various other aspects of the light emitting module are additionally described.

Abstract translation: 发光模块被配置为使用多个照明源来提供基本均匀的照明。 发光模块包括设置在离发光模块一定距离处的扩散板。 光源基板具有基本上四边形的外周边，其中形成有至少一个间隙，并且多个光源根据重复的四边形图案设置在光源基板上。 基于从扩散板到发光模块的设定距离h以及四边形图案的两个对角距离x，y的更大的两个方向，选择重复四边形图案中的相邻光源之间的距离。 扩散板扩散由光源发射的光以提供基本均匀的光。 另外描述发光模块的各种其它方面。

公开(公告)号：US09295151B2

公开(公告)日：2016-03-22

申请号：US14000568

申请日：2012-02-01

Applicant: Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

Inventor： Masami Hasegawa ,  Satoshi Hirayama ,  Naoki Kito

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H01L23/13 ,  H01L23/10 ,  H01L23/498 ,  C04B41/00 ,  H05K1/14 ,  H01L23/15

CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

Abstract: A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body.

Abstract translation: 布线基板包括由陶瓷层叠体形成的矩阵形状的基板主体，并且具有前表面和后表面，并且具有四个侧表面，每个侧表面位于前表面和背面之间 表面，并且具有位于朝向前表面的一侧的凹槽表面和位于朝向后表面的一侧的断裂表面; 以及金属化层，其形成在所述基板主体的前表面上，以便沿着所述四个侧表面延伸，并且在平面图中具有矩形框架形状，其中所述基板主体的陶瓷层叠体的水平表面 在金属化层与基板主体的各侧面的槽面之间露出。

公开(公告)号：US20150334823A1

公开(公告)日：2015-11-19

申请号：US14281733

申请日：2014-05-19

Applicant: Dyi-Chung HU

Inventor： Dyi-Chung HU

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H01L23/15 ,  H05K1/03

CPC classification number: H01L23/15 ,  H01L23/13 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/112 ,  H05K1/181 ,  H05K3/0052 ,  H05K3/4605 ,  H05K2201/068 ,  H05K2201/0909 ,  H05K2201/09154

Abstract: Substrate components for packaging IC chips and electronic device packages are disclosed. A substrate component for packaging IC chips comprises: a glass core base with at least one conductive through via connecting a combination of metallization and dielectric structures on both an upper surface and a lower surface of the glass core base; and, tapered edges created at a peripheral region of the glass core base; wherein dielectric layers are disposed over the tapered edges at the peripheral region of the glass core base. In accordance with an embodiment of the invention, the dielectric layers have a substantial planar upper surface, a lower surface conformably interfaced with the tapered edges at peripheral region of the glass core base, and a steep cutting face with the tapered edges of the glass core base. Alternatively, the tapered edges at peripheral region of the glass core base are not covered by the dielectric layers, and an encapsulated material sealing the tapered edges at peripheral region of the glass core base.

Abstract translation: 公开了用于封装IC芯片和电子器件封装的衬底元件。 用于封装IC芯片的基板部件包括：具有至少一个导电通孔的玻璃芯基座，该导电通孔在玻璃芯基座的上表面和下表面上连接金属化和电介质结构的组合; 以及在玻璃核心基座的周边区域处产生的锥形边缘; 其中电介质层设置在玻璃芯基底的周边区域的锥形边缘上方。 根据本发明的实施例，电介质层具有基本的平面上表面，下表面与玻璃芯基底的周边区域处的锥形边缘顺应地接合，以及具有玻璃芯的锥形边缘的陡峭切割面 基础。 或者，玻璃芯基部的周边区域的锥形边缘不被电介质层覆盖，并且在玻璃芯基部的周边区域封装有锥形边缘的封装材料。

公开(公告)号：US20150327372A1

公开(公告)日：2015-11-12

申请号：US14661080

申请日：2015-03-18

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Hideyuki Sakamoto

IPC: H05K3/28 ,  B29C45/14

CPC classification number: H01L23/3107 ,  B29C45/14008 ,  B29C45/14819 ,  B29L2031/3425 ,  H01L21/565 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/284 ,  H05K2201/09154 ,  H05K2203/1316 ,  H05K2203/1545 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin.

Abstract translation: 提供一种电路装置，其中密封电路板的封装树脂的形状优化，以及制造电路装置的方法。 作为根据本发明的电路装置的混合集成电路装置包括电路板，安装在电路板的顶表面上的电路元件和封装电路元件的封装树脂，并且将顶表面，侧表面 ，以及电路板的底面。 此外，封装树脂部分凹陷，从而在电路板的两侧设置有凹陷区域。 凹陷区域的设置减少了使用的树脂的量，并且防止混合集成电路器件由于封装树脂的固化收缩而变形。

公开(公告)号：US20150237734A1

公开(公告)日：2015-08-20

申请号：US14429741

申请日：2012-09-26

Applicant: MEIKO ELECTRONICS CO., LTD.

Inventor： Ryoichi Shimizu ,  Mitsuo Iwamoto ,  Mitsuaki Toda

IPC: H05K1/18 ,  H05K1/09 ,  H05K1/02 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/188 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/544 ,  H01L24/19 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L2221/68359 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/04105 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32245 ,  H01L2224/82039 ,  H01L2224/82132 ,  H01L2224/83005 ,  H01L2224/83132 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/09 ,  H05K1/115 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0335 ,  H05K2201/09154 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/09918 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/063 ,  Y02P70/613 ,  Y10T29/49131

Abstract: In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line.

Abstract translation: 在其中电子部件相对于形成在铜层中的标记定位的部件结合基板的制造方法中的标记形成步骤中，当从传感器的搜索范围的搜索中心延伸到假想线时， 搜索范围的边缘侧被表示为搜索参考线，并且在标记中心与搜索中心匹配的状态下从与标记中心沿与搜索基准线相同的方向延伸的假想线延伸到 标记的外脊线被表示为标记参考线，标记形成为标记的外脊线存在于标记基准线的长度在30％以上的范围内的位置的形状 的搜索参考线。

公开(公告)号：US20150131300A1

公开(公告)日：2015-05-14

申请号：US14478327

申请日：2014-09-05

Applicant: Molex Incorporated

Inventor： Yi-Tse HO

IPC: F21V29/83 ,  F21K99/00 ,  F21V21/00

CPC classification number: F21V29/83 ,  F21K9/232 ,  F21V3/00 ,  F21V19/0055 ,  F21V29/77 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/182 ,  H05K3/381 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09154 ,  H05K2201/09645 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10287 ,  H05K2201/10409 ,  H05K2203/107

Abstract: An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.

Abstract translation: 照明装置包括保持器，多个发光元件，半透明盖和灯帽结构。 支架包括散热基体和承载单元。 承载单元连接到散热基体的顶部，并且包括承载基体，电路图案和散热图案，电路图案和散热图案直接形成在承载基体的表面上 电路图案具有多个安装位置，散热图案至少从靠近安装位置的区域延伸到散热图案可以与散热基体接触的区域。 多个发光元件分别设置在多个安装位置并与电路图形建立电连接。

公开(公告)号：US20150054601A1

公开(公告)日：2015-02-26

申请号：US14537059

申请日：2014-11-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuo IKEMOTO ,  Yuki WAKABAYASHI ,  Shigeru TAGO

IPC: H01P3/08 ,  H05K1/11 ,  H01P11/00 ,  H05K1/02

CPC classification number: H01P3/082 ,  H01P3/08 ,  H01P11/003 ,  H01R12/62 ,  H01R24/50 ,  H01R2103/00 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/024 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/115 ,  H05K1/118 ,  H05K1/147 ,  H05K3/0052 ,  H05K3/363 ,  H05K3/4623 ,  H05K3/4632 ,  H05K2201/07 ,  H05K2201/09154 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09618 ,  H05K2201/097 ,  H05K2201/09845 ,  H05K2201/10037 ,  H05K2201/10204 ,  Y10T29/49016

Abstract: In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.

Abstract translation: 在高频信号线中，第一信号线沿着第一介电元件组件延伸，第一参考接地导体沿着第一信号线延伸，第二信号线设置在第二电介质元件组件中或第二电介质元件组件上，并沿着第二信号线延伸 电介质元件组件，第二参考接地导体设置在第二电介质元件组件中或第二介质元件组件上并沿第二信号线延伸。 在第一介电元件组件的端部处的底表面的一部分和第二介电元件组件的端部处的顶表面的一部分被接合在一起，使得第一和第二介电元件组件的接合部分包括角部 。 第二信号线和第一信号线电耦合在一起。 第一和第二参考接地导体电耦合在一起。

公开(公告)号：US20150035433A1

公开(公告)日：2015-02-05

申请号：US14168036

申请日：2014-01-30

Applicant: UUSI, LLC d/b/a NARTRON

Inventor： David W. SHANK ,  John M. WASHELESKI ,  Edward J. COX, II

IPC: B60R16/02 ,  B60Q3/00 ,  H05B33/08 ,  H05K1/02

CPC classification number: H05B33/0803 ,  H05B33/086 ,  H05K1/02 ,  H05K1/117 ,  H05K1/142 ,  H05K1/16 ,  H05K2201/09027 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09154 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09709 ,  H05K2201/0979 ,  H05K2201/0999 ,  H05K2201/10053 ,  H05K2201/10356

Abstract: An illustrative inventory of vehicle accessory control components includes a plurality of first circuit boards and a plurality of second circuit boards. The first circuit boards each have a substrate with a plurality of circuit elements supported on the substrate. The first circuit board substrates have an overall perimeter shape including an outer edge profile and a plurality of first deviations from the outer edge profile. The second circuit boards each have a substrate with a plurality of circuit elements supported on them. The second circuit board substrates have the overall perimeter shape including the same outer edge profile as the first circuit board substrates. The second circuit board substrates include a plurality of second deviations from the outer edge profile. At least one portion of the second deviations is different than the first deviations of the first circuit boards.

Abstract translation: 车辆附件控制部件的说明性库存包括多个第一电路板和多个第二电路板。 第一电路板各自具有支撑在基板上的多个电路元件的基板。 第一电路板基板具有包括外缘轮廓和从外边缘轮廓的多个第一偏离的总体周边形状。 第二电路板各自具有支撑在它们上的多个电路元件的基板。 第二电路板基板具有包括与第一电路板基板相同的外边缘轮廓的整体周边形状。 第二电路板基板包括与外边缘轮廓的多个第二偏差。 第二偏差的至少一部分不同于第一电路板的第一偏差。

公开(公告)号：US20150027753A1

公开(公告)日：2015-01-29

申请号：US14340564

申请日：2014-07-25

Applicant: Chun-Ming Huang ,  Yi-Chun Lin ,  Yi-Chen Tsai ,  Ming-Kung Wu

Inventor： Chun-Ming Huang ,  Yi-Chun Lin ,  Yi-Chen Tsai ,  Ming-Kung Wu

IPC: H05K1/02

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K3/12 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09681 ,  H05K2201/09727

Abstract: A panel structure includes a substrate, a decoration layer and a conductive component. The decoration layer is located in a first region and the rest region is a second region. The decoration layer includes a middle portion and a first edge protruding portion located between the middle portion and the second region and thinner than the middle portion. Each the conductive component extends in a first direction towards the first region from the second region and crosses the first edge protruding portion followed by extending in a second direction on the middle portion of the decoration layer, the first direction intersects the second direction, each the conductive component on the first edge protruding portion has a first width, each the conductive component on the middle portion extends in the second direction and has a second width less than the first width.

Abstract translation: 面板结构包括基板，装饰层和导电部件。 装饰层位于第一区域中，其余区域是第二区域。 装饰层包括位于中间部分和第二区域之间的中间部分和第一边缘突出部分，并且比中间部分薄。 每个导电部件沿着第一方向从第二区域朝向第一区域延伸，并且穿过第一边缘突出部分，然后在装饰层的中间部分上沿第二方向延伸，第一方向与第二方向相交， 第一边缘突出部分上的导电部件具有第一宽度，中间部分上的导电部件在第二方向上延伸，并且具有小于第一宽度的第二宽度。

公开(公告)号：US08911848B2

公开(公告)日：2014-12-16

申请号：US13681872

申请日：2012-11-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young Kyung Kim

IPC: H05K1/05 ,  H05K3/00 ,  H05K3/02

CPC classification number: H05K1/056 ,  H05K3/0061 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0761 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0228 ,  Y10T156/10

Abstract: There is provided a copper clad laminate (CCL) including: a metal plate; an insulating layer having a planar area greater than that of the metal plate and laminated on the metal plate; and a copper layer laminated on the insulating layer, wherein edges of the insulating layer extend outwardly beyond edges of the metal plate so that an insulation distance insulating the edges of the metal plate from edges of the copper layer is formed. The insulating layer may include a polyimide layer, and a polyimide bonding layer.

Abstract translation: 提供了一种覆铜层压板（CCL），包括：金属板; 绝缘层，其平面面积大于金属板的面积，并且层压在金属板上; 以及层叠在所述绝缘层上的铜层，其中所述绝缘层的边缘向外延伸超过所述金属板的边缘，使得形成将所述金属板的边缘与所述铜层的边缘绝缘的绝缘距离。 绝缘层可以包括聚酰亚胺层和聚酰亚胺接合层。