公开(公告)号：US09416928B2

公开(公告)日：2016-08-16

申请号：US14940025

申请日：2015-11-12

Applicant: LedEngin, Inc.

Inventor： Xiantao Yan

IPC: H01L33/08 ,  H01L33/58 ,  H01L33/48 ,  F21K99/00 ,  F21V5/00 ,  F21V5/04 ,  H05K1/18 ,  F21V23/00 ,  H05K1/02 ,  H05K1/03 ,  H01L25/075 ,  F21Y101/02 ,  F21Y105/00 ,  H05K3/00 ,  H05K3/46

CPC classification number: F21V19/003 ,  F21K9/90 ,  F21V5/007 ,  F21V5/04 ,  F21V9/30 ,  F21V21/14 ,  F21V23/005 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/08 ,  H01L33/48 ,  H01L33/58 ,  H01L33/647 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0278 ,  H05K1/0283 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0097 ,  H05K3/4626 ,  H05K3/4688 ,  H05K2201/042 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/0143 ,  H05K2203/171 ,  H01L2924/00

Abstract: A flexible sheet of light-emitting diode (LED) light emitters includes a support substrate having a thermally conductive material. The flexible sheet of LED light emitters also has an LED emitter sheet overlying the support substrate, and the LED emitter sheet including a plurality of LED light emitters. The flexible sheet of LED light emitters also has a flexible circuit sheet overlying the LED emitter sheet, and a phosphor sheet overlying the flexible circuit sheet. The phosphor sheet includes a wave-length converting material. The flexible sheet of LED light emitters also has a lens sheet overlying the phosphor sheet. The lens sheet includes a plurality of lenses.

公开(公告)号：US09380698B1

公开(公告)日：2016-06-28

申请号：US14644183

申请日：2015-03-10

Applicant: VivaLnk Limited (Cayman Islands)

Inventor： Jiang Li ,  Junfeng Mei

IPC: G06K7/08 ,  G06K19/02 ,  G06K19/06 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14 ,  A61B5/00 ,  H04B1/3827 ,  H04B5/00

CPC classification number: H05K1/0283 ,  A61B5/6823 ,  A61B5/6824 ,  A61B5/6825 ,  A61B5/6828 ,  A61B5/6829 ,  A61B5/6833 ,  A61B2562/046 ,  H04B1/385 ,  H04B2001/3866 ,  H05K1/148 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2201/09027 ,  H05K2201/09263 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/1316

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

公开(公告)号：US09345126B2

公开(公告)日：2016-05-17

申请号：US14198718

申请日：2014-03-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Sou Hoshi ,  Nobuaki Yamashita ,  Yusuke Murai

IPC: H01L23/02 ,  H05K1/02 ,  H01L23/50 ,  H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H05K1/16 ,  H05K3/46

CPC classification number: H05K1/0224 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6655 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/06135 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/4644 ,  H05K2201/09263 ,  H05K2201/09672 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2924/00

Abstract: A substrate of a semiconductor package comprises a conductor pattern which is formed in a surface layer, and is electrically connected to one terminal out of a power terminal and a ground terminal of a semiconductor element. The substrate also comprises in the surface layer a conductor pattern which is arranged while being separated from the conductor pattern, and a conductor pattern which is formed so as to have a wiring width thinner than that of the conductor pattern and connects the conductor pattern with the conductor pattern. The substrate also comprises a conductor pattern which is formed in an inner layer, faces the conductor pattern through a dielectric and is electrically connected to the other terminal out of the power terminal and the ground terminal of the semiconductor element.

Abstract translation: 半导体封装的衬底包括形成在表面层中的导体图案，并且电连接到半导体元件的电源端子和接地端子之外的一个端子。 基板还在表面层中包括布置成与导体图案分离的导体图案，以及形成为具有比导体图案的布线宽度更薄的布线宽度的导体图案，并将导体图案与 导体图案。 衬底还包括形成在内层中的导体图案，其通过电介质面对导体图案，并且与另一个端子电连接到电源端子和半导体元件的接地端子之外。

公开(公告)号：US20160103534A1

公开(公告)日：2016-04-14

申请号：US14511945

申请日：2014-10-10

Applicant: Apple Inc.

Inventor： Zhen Zhang ,  Paul S. Drzaic ,  Yi Tao

IPC: G06F3/041 ,  H05K1/02 ,  H05K1/03 ,  G06F1/16

CPC classification number: G06F3/0412 ,  G06F1/169 ,  G06F2203/04102 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0296 ,  H05K1/0393 ,  H05K2201/09263 ,  H05K2201/09663 ,  H05K2201/09672 ,  H05K2201/0979 ,  H05K2201/10106

Abstract: A flexible substrate may have one or more bends. A bend in a flexible substrate may be made along a bend axis. Conductive traces in the flexible substrate may have elongated shapes. Each conductive trace may extend along a longitudinal axis that is perpendicular to the bend axis. Metal or other conductive materials may form the conductive traces. The traces may be formed from a chain of linked segments. Each segment may have patterned trace portions that surround one, two, or more than two openings. Traces may also be formed that have multiple layers of metal or other conductive material interconnected using vias. A polymer layer may cover the traces to align a neutral stress plane with the traces and to serve as a moisture barrier layer.

Abstract translation: 柔性基底可以具有一个或多个弯曲部。 柔性基板中的弯曲部可以沿弯曲轴线制成。 柔性基板中的导电迹线可以具有细长形状。 每个导电迹线可以沿着垂直于弯曲轴线的纵向轴线延伸。 金属或其他导电材料可形成导电迹线。 迹线可以由链节段形成。 每个段可以具有围绕一个，两个或多于两个开口的图案化痕迹部分。 还可以形成具有使用通孔互连的多层金属或其它导电材料的迹线。 聚合物层可以覆盖迹线以将中性应力平面与迹线对准并且用作防潮层。

公开(公告)号：US09307686B2

公开(公告)日：2016-04-05

申请号：US13420131

申请日：2012-03-14

Applicant: Katsumi Takada ,  Kiyokazu Moriizumi ,  Masayuki Itoh

Inventor： Katsumi Takada ,  Kiyokazu Moriizumi ,  Masayuki Itoh

IPC: H05K13/04 ,  H05K1/02 ,  H05K3/34 ,  H01L23/36 ,  H01L23/00 ,  H01L23/34 ,  H01L23/373 ,  H05K3/22

CPC classification number: H05K1/0212 ,  H01L23/345 ,  H01L23/3735 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/32238 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/81444 ,  H01L2224/83444 ,  H01L2924/0001 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/22 ,  H05K3/3494 ,  H05K2201/09263 ,  H05K2203/1115 ,  H05K2203/176 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

Abstract: An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

Abstract translation: 电子部件包括具有第一表面和第二表面的布线基板，安装在布线基板的第一表面侧上的电子部件主体，形成在布线基板的与第一表面相对的第二表面侧上的外部电极 表面侧，外部电极电连接到电子部件主体，具有导电性能并且具有比外部电极更高的电阻率的发热部件，以及设置在电子部件主体和发热部件之间的绝热层， 所述绝热层具有绝缘性，并且由与所述布线基板的其它材料不同的材料形成。

公开(公告)号：US20160069544A1

公开(公告)日：2016-03-10

申请号：US14943201

申请日：2015-11-17

Applicant: LongWide Technology Inc.

Inventor： Huan-Jan CHIEN ,  Tsung-Hong TSAI

IPC: F21V21/00 ,  H05K3/20 ,  H05K1/18 ,  F21K99/00

CPC classification number: F21V21/00 ,  F21K9/232 ,  F21V15/01 ,  F21V23/001 ,  F21V29/773 ,  F21Y2101/00 ,  F21Y2107/20 ,  F21Y2113/13 ,  F21Y2113/17 ,  F21Y2115/10 ,  H05K1/181 ,  H05K1/189 ,  H05K3/202 ,  H05K2201/0397 ,  H05K2201/09263 ,  H05K2201/10106

Abstract: A 3D curved structure and LED 3D curved lead frame for a curved surface illumination of an illumination device. First of all, draw illumination circuit with banded structure of multilayer lead frame on 3D illumination curved surface, then spread these curved circuit into plane circuit, dismantle the banded structure of multilayer lead frame of circuit into circuit pattern of single layers, use process the prototype of circuit patterns of each layer with conductive metal charge tape, and produce the prototype of banded structure of multilayer conductive frame through repeated accumulation of multi-disc charge tapes, and install the LED chip on the installation seat to get LED flat lead frame, then flex the conductive metal into LED 3D curved lead frame with jig and paste on the luminous curved surface, and package them with transparent material.

公开(公告)号：US20160029489A1

公开(公告)日：2016-01-28

申请号：US14878287

申请日：2015-10-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuki WAKABAYASHI ,  Shigeru TAGO ,  Daisuke TSURUGA ,  Masaki KAWATA

IPC: H05K1/11 ,  H05K3/32 ,  H05K3/46 ,  H05K3/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/115 ,  H03H7/0115 ,  H03H2001/0085 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0064 ,  H05K3/0094 ,  H05K3/32 ,  H05K3/3484 ,  H05K3/4617 ,  H05K3/4697 ,  H05K2201/0141 ,  H05K2201/09263 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/046 ,  H05K2203/063 ,  H05K2203/1484 ,  Y02P70/611

Abstract: A component-embedded substrate includes a cavity including through-holes penetrating through resin sheets in a stacked body of resin sheets having flexibility. An electronic chip component including external electrodes is disposed in the cavity. The resin sheet on which the electronic chip component is located is provided with through-holes into which conductive pastes are filled. The resin sheet includes cut-away portions communicating with a through-hole and located at a distance from each other across the through-hole. When this stacked body is hot-pressed, the conductive pastes overflow from the through-holes. However, the overflowing conductive pastes enter the cut-away portions.

Abstract translation: 组件嵌入式基板包括具有穿透树脂片的通孔的空腔，该树脂片具有柔性的树脂片层叠体。 包括外部电极的电子芯片组件设置在空腔中。 电子芯片部件所在的树脂片设置有填充有导电性糊剂的贯通孔。 树脂片包括与通孔连通并且穿过通孔彼此相距一定距离的切除部分。 当该堆叠体被热压时，导电浆料从通孔溢出。 然而，溢出的导电浆料进入切割部分。

公开(公告)号：US09232663B2

公开(公告)日：2016-01-05

申请号：US14241187

申请日：2012-08-29

Applicant: Antonius Petrus Marinus Dingemans ,  Johannes Wilhelmus Weekamp ,  Sébastien Paul René Libon ,  Gerard Kums ,  Giovanni Cennini

Inventor： Antonius Petrus Marinus Dingemans ,  Johannes Wilhelmus Weekamp ,  Sébastien Paul René Libon ,  Gerard Kums ,  Giovanni Cennini

IPC: H01L21/00 ,  H05K3/30 ,  H05K3/20 ,  H01L25/075 ,  F21K99/00 ,  F21S4/00 ,  H01L27/15 ,  H01L33/62 ,  F21V21/002 ,  H05K13/04 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K3/303 ,  F21K9/90 ,  F21V21/002 ,  H01L25/0753 ,  H01L27/153 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/0283 ,  H05K1/0284 ,  H05K1/05 ,  H05K3/0058 ,  H05K3/0097 ,  H05K3/202 ,  H05K13/046 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2203/04 ,  H05K2203/1545 ,  H05K2203/175 ,  Y10T29/49144 ,  H01L2924/00

Abstract: There is provided a method for manufacturing a light emitting diode, LED, matrix (100) comprising the steps of providing with a maintained integrity a conductor sheet (150) with a plurality of component areas (111) interconnected with meandering connection tracks (116), mounting a plurality of LEDs (120) to a respective component area thereby forming a subassembly (100′), trimming and stretching the subassembly thereby straightening the connection tracks such that an m×n LED conductor matrix is formed during the step of stretching.

Abstract translation: 提供一种用于制造发光二极管，LED，矩阵（100）的方法，包括以下步骤：提供具有与曲折连接轨道（116）互连的多个部件区域（111）的导体片（150）的完整性， ，将多个LED（120）安装到相应的部件区域，从而形成子组件（100'），修整和拉伸子组件，从而矫正连接轨道，使得在拉伸步骤期间形成m×n个LED导体矩阵。

公开(公告)号：US20150382455A1

公开(公告)日：2015-12-31

申请号：US14649848

申请日：2013-12-06

Applicant: CRYPTERA A/S

Inventor： Mathias Tannebæk Enevoldsen ,  Thomas Trabolt West ,  Erling Wesselhoff ,  Jan Rasmussen ,  Dennis Bruun Mikkelsen

IPC: H05K1/02 ,  H05K7/14 ,  G01R27/02

CPC classification number: H05K1/0275 ,  G01R27/02 ,  G06F21/87 ,  G09C1/00 ,  H04L9/004 ,  H05K1/02 ,  H05K1/0268 ,  H05K1/141 ,  H05K7/1422 ,  H05K2201/09263 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: There is provided a security module for protecting circuit components from unauthorized access. The security module comprises a base printed circuit board, base PCB, for supporting circuit components to be protected, a frame printed circuit board, frame PCB, where the frame PCB is secured on top of the base PCB and defining a protective space for circuit components supported by the base PCB, and a lid printed circuit board, lid PCB, which is secured on top of the frame PCB, thereby providing a top closure to the protective space. First and third meshes are provided in the frame PCB, and a second mesh is provided in the lid PCB. The first, second and third meshes have a number of electrically conductive tracks, and one or more tamper detection paths are formed comprising a serial connection of one track from each of the first, second and third meshes. The security module may further comprise security circuitry arranged on the base PCB within the protective space, and for each tamper detection path the security circuitry has a pair of electrical signal input/outputs being electrically connected to the tamper detection path.

Abstract translation: 提供了用于保护电路组件免于未授权访问的安全模块。 该安全模块包括用于支持要保护的电路元件的基本印刷电路板，基底PCB，框架印刷电路板，框架PCB，其中框架PCB固定在基座PCB的顶部上并且为电路部件定义保护空间 由基板PCB支撑，以及盖印刷电路板，盖PCB，其固定在框架PCB的顶部上，从而向保护空间提供顶部封闭。 第一和第三网格设置在框架PCB中，并且第二网格设置在盖PCB中。 第一，第二和第三网格具有多个导电轨道，并且形成一个或多个篡改检测路径，其包括从第一，第二和第三网格中的每一个的一个轨道的串行连接。 安全模块还可以包括布置在保护空间内的基本PCB上的安全电路，并且对于每个篡改检测路径，安全电路具有电连接到篡改检测路径的一对电信号输入/输出。

公开(公告)号：US20150319845A1

公开(公告)日：2015-11-05

申请号：US14438546

申请日：2013-11-14

Applicant: CANON KABUSHIKI KAISHA

Inventor： Takashi Numagi ,  Hikaru Nomura ,  Masanori Kikuchi ,  Hiroyuki Mizuno

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/0243 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/114 ,  H05K1/115 ,  H05K1/181 ,  H05K3/429 ,  H05K2201/09254 ,  H05K2201/09263 ,  H05K2201/09627 ,  H05K2201/097 ,  H05K2201/10159

Abstract: A main wire 111 has inner layer wiring patterns 161 to 165 which are wired on an inner layers 114 and 115 connected by via conductors 166 to 169 in series. In addition, a main wire 112 has inner layer wiring patterns 181 to 185 which are wired on the inner layers 114 and 115 connected by via conductors 186 to 189. The inner layer wiring patterns 161 to 165 and the inner layer wiring patterns 181 to 185 are wired so as to change the layer to the inner layer on the opposite side to each other. Branch wires 1211 to 1214 and 1221 to 1224 are branched from the via conductors 166 to 169 and 186 to 189, respectively. Thereby, the present invention provides an inexpensive printed wiring board which can reduce ringing without upsizing the printed wiring board.

Abstract translation: 主导线111具有布线在通过导体166至169串联连接的内层114和115上的内层布线图案161至165。 此外，主导线112具有布线在通过导体186至189连接的内层114和115上的内层布线图案181至185.内层布线图案161至165和内层布线图案181至185 被布线以将层改变成彼此相对侧上的内层。 分支线1211至1214和1221至1224分别从通孔导体166至169和186至189分支。 因此，本发明提供了一种廉价的印刷布线板，其可以在不使印刷线路板增大的情况下减少振铃。