公开(公告)号：US11214874B2

公开(公告)日：2022-01-04

申请号：US16906436

申请日：2020-06-19

Applicant: TECHINSIGHTS INC.

Inventor： Robert K. Foster ,  Christopher Pawlowicz ,  Jason Abt ,  Ian Jones ,  Heinz Josef Nentwich

IPC: G01N1/32 ,  C23F4/00 ,  H01L23/00 ,  H01J37/32 ,  H01L21/263 ,  H01L21/66

Abstract: There is provided a method, system and computer program product to delayer a layer of a sample, the layer comprising one or more materials, in an ion beam mill by adjusting one or more operating parameters of the ion beam mill and selectively removing each of the one or more materials at their respective predetermined rates. There is also provided a method and system for obtaining rate of removal of a material from a sample in an ion beam mill.

公开(公告)号：US11074389B2

公开(公告)日：2021-07-27

申请号：US16692900

申请日：2019-11-22

Applicant: TechInsights Inc.

Inventor： Dale Carlson

IPC: G06F9/445 ,  G06F30/39 ,  G06T7/00 ,  G06F30/398

Abstract: Described are various embodiments of a system and method for verifying extracted integrated circuit (IC) features representative of a source IC and stored in a feature dataset structure. Generally, a set of extracted IC features imaged within a designated IC area is converted into a static tile image. The static tile image is then rendered for visualization as an interactive mapping of the feature dataset structure within the area. Corrections for one or more of the set of extracted IC features are received based on the static tile image and input corrections are executed on the feature dataset structure to produce an updated feature dataset structure.

公开(公告)号：US20200167517A1

公开(公告)日：2020-05-28

申请号：US16692900

申请日：2019-11-22

Applicant: TechInsights Inc.

Inventor： Dale Carlson

IPC: G06F30/39 ,  G06F30/398 ,  G06T7/00

Abstract: Described are various embodiments of a system and method for verifying extracted integrated circuit (IC) features representative of a source IC and stored in a feature dataset structure. Generally, a set of extracted IC features imaged within a designated IC area is converted into a static tile image. The static tile image is then rendered for visualization as an interactive mapping of the feature dataset structure within the area. Corrections for one or more of the set of extracted IC features are received based on the static tile image and input corrections are executed on the feature dataset structure to produce an updated feature dataset structure.

公开(公告)号：US09529040B2

公开(公告)日：2016-12-27

申请号：US14811549

申请日：2015-07-28

Applicant: TECHINSIGHTS INC.

Inventor： Christopher Pawlowicz ,  Alexander Sorkin ,  Alexander Krechmer

IPC: G21G5/00 ,  G01R31/303 ,  G01R31/28 ,  G01N23/225 ,  H01L21/66

CPC classification number: G01R31/303 ,  G01N23/2255 ,  G01R31/2896 ,  H01J2237/24564 ,  H01J2237/24585 ,  H01J2237/2803 ,  H01J2237/2809 ,  H01J2237/31749 ,  H01L22/12

Abstract: Described are various embodiments of methods and systems for tracing circuitry on integrated circuits using focused ion beam based imaging techniques. In one such embodiment, a method is provide for identifying functional componentry associated with a switchable power interface on an integrated circuit, wherein the switchable power interface comprises a source and a drain with a control switch therebetween, said control switch being controllable by a control signal during operation of the integrated circuit. The method comprises connecting, with deposited conductive material, the source and the drain; applying an external voltage bias to a power input of the switchable power interface via one of the source and the drain; exposing the integrated circuit to a focused ion beam; and gathering an image of the integrated circuit during exposure to determine areas of high contrast indicating functional componentry in operative connection with the switchable power interface.

Abstract translation: 描述了使用基于聚焦离子束的成像技术在集成电路上跟踪电路的方法和系统的各种实施例。 在一个这样的实施例中，提供了一种用于识别与集成电路上的可切换电力接口相关联的功能组件的方法，其中所述可切换电力接口包括其间具有控制开关的源极和漏极，所述控制开关由控制信号 在集成电路运行期间。 该方法包括用沉积的导电材料连接源极和漏极; 通过源极和漏极中的一个将外部电压施加到可切换电力接口的功率输入; 将集成电路暴露于聚焦离子束; 以及在曝光期间收集集成电路的图像，以确定与可切换电源接口可操作连接的功能组件的高对比度区域。

公开(公告)号：US20250104257A1

公开(公告)日：2025-03-27

申请号：US18730253

申请日：2023-01-23

Applicant: TECHINSIGHTS INC.

Inventor： Christopher Pawlowicz ,  Michael Green ,  Bruno Machado Trindade ,  Hamed Bagheri ,  Nabil David Bassim ,  Nasim Khoonkari ,  Christopher Kumar Anand

IPC: G06T7/32

Abstract: Described are various embodiments of image registration methods and systems, as well as associated non-transitory computer readable mediums comprising instructions directed to image registration.

公开(公告)号：US12176177B2

公开(公告)日：2024-12-24

申请号：US17805663

申请日：2022-06-06

Applicant: TECHINSIGHTS INC.

Inventor： Christopher Pawlowicz ,  Alexander Sorkin ,  Trevor Jason French ,  Ian Jones ,  Paul Gagnon

IPC: H01J37/08 ,  H01J37/32

Abstract: Described are various embodiments of an ion beam chamber fluid delivery system and method for delivering a fluid onto a substrate in an ion beam system during operation. In one embodiment, the system comprises: a chamber comprising an ion beam gun oriented so as to cause ions to impinge the substrate, said chamber having a fluid delivery conduit therein for delivering the fluid into the chamber; a transferable substrate stage for holding the substrate, the transferable stage further configured to move between an operating position and a payload position during non-operation, said payload position for receiving and removing said substrate; and a fluid delivery nozzle being in a fixed location relative to the transferable stage, at least during operation, with an outlet position that is configured to deliver a fluid to a predetermined location on said transferable stage.

公开(公告)号：US20230196581A1

公开(公告)日：2023-06-22

申请号：US17917872

申请日：2021-04-06

Applicant: TECHINSIGHTS INC.

Inventor： Christopher PAWLOWICZ ,  Michael GREEN ,  Alexander SORKIN ,  Christopher Kumar ANAND ,  Nabil David BASSIM ,  Yasamin SARTIPI

IPC: G06T7/11 ,  G06V10/24 ,  G06V10/74 ,  G01N23/04

CPC classification number: G06T7/11 ,  G06V10/242 ,  G06V10/761 ,  G01N23/04 ,  G06T2207/10061

Abstract: Described are systems and methods for segmenting images which comprise impinging a substrate surface with a particle beam at each of a plurality of sensing locations which define a subset of locations within an area of interest of the substrate surface. An intensity value associated with post-impingement particles resulting from the impinging is measured and the measured intensity based on the intensity value of the sensing location is calculated. For each of a plurality of estimated locations which define a further subset of said area of interest and a corresponding estimated intensity based on at least one of the following corresponding to one or more locations proximal to the estimated location is calculated. The plurality of estimated locations is each segmented based on the corresponding estimated intensity, each of the sensing locations, and based on the corresponding measured intensity, to correspond to one of the plurality of features.

公开(公告)号：US20220122805A1

公开(公告)日：2022-04-21

申请号：US17425280

申请日：2020-01-21

Applicant: TECHINSIGHTS INC.

Inventor： Christopher PAWLOWICZ

IPC: H01J37/304 ,  H01J37/305 ,  C23F4/00 ,  H01L21/3213 ,  H01L21/66 ,  G01N19/06

Abstract: Described are various embodiments of an ion beam delayering system and method, and endpoint monitoring system and method. One embodiment includes a method for monitoring an ion beam de-layering process for an unknown heterogeneously layered sample, the method comprising: grounding the sample to allow an electrical current to flow from the sample, at least in part, as a result of the ion beam de-layering process; milling a currently exposed layer of the sample using the ion beam, resulting in a given measurable electrical current to flow from the sample as said currently exposed layer is milled, wherein said given measurable electrical current is indicative of an exposed surface material composition of said currently exposed layer; detecting a measurable change in said measureable electrical current during said milling as representative of a corresponding exposed surface material composition change; and associating said measurable change with a newly exposed layer of the sample.

公开(公告)号：US11301988B2

公开(公告)日：2022-04-12

申请号：US17068590

申请日：2020-10-12

Applicant: TechInsights Inc.

Inventor： Michael Green

IPC: G06F30/327 ,  G06F30/398 ,  G06T7/00 ,  G06F21/14

Abstract: Described are reverse engineering data analysis systems, and integrated circuit component data processing tools and methods thereof. A system can comprise: a data storage device operable to store a data structure comprising extracted IC component data nodes representative of corresponding IC components of target IC and a connectivity therebetween; a graphical user interface (GUI); and a digital data processor operable on said data structure to: render, via said GUI, a dynamic graph of said data nodes; graphically migrate at least some of said data nodes on said dynamic graph as a function of a connectivity thereof with other nodes, wherein connected nodes are attractively displaced relative to one another such that said migrating nodes progressively cluster with related nodes to define distinct IC component clusters representative of distinct groups of related IC components of the target IC, whereas unconnected notes are repulsively displaced so to progressively distance said unconnected nodes.

公开(公告)号：US20220005669A1

公开(公告)日：2022-01-06

申请号：US17309372

申请日：2019-11-20

Applicant: TechInsights Inc.

Inventor： Christopher PAWLOWICZ ,  Alexander SORKIN

IPC: H01J37/304 ,  G01N1/28 ,  G01N1/32 ,  G01N23/2251 ,  G01R31/28 ,  H01J37/31

Abstract: Described are various embodiments of an ion beam delayering system and method, topographically enhanced sample produced thereby, and imaging methods and systems related thereto. In one embodiment, a method comprises: identifying at least two materials in an exposed surface of the sample and predetermined operational characteristics of an ion beam mill that correspond with a substantially different ion beam mill removal rate for at least one of the materials; operating the ion beam mill in accordance with the predetermined operational characteristics to simultaneously remove the materials and introduce or enhance a topography associated with the materials and surface features defined thereby; acquiring surface data; and repeating the operating and acquiring steps for at least one more layer.