公开(公告)号：US11828742B2

公开(公告)日：2023-11-28

申请号：US18170849

申请日：2023-02-17

Applicant: Brown University

Inventor： Jacob K. Rosenstein ,  Christopher Rose

IPC: G01N33/00 ,  B81B3/00

CPC classification number: G01N33/0075 ,  B81B3/0018 ,  B81B2201/0264 ,  B81B2201/0278

Abstract: A system includes an array of chemical, pressure, and temperature sensors, and a temporal airflow modulator configured to provide sniffed vapors in a temporally-modulated sequence through a plurality of different air paths across multiple sensor locations.

公开(公告)号：US11825266B2

公开(公告)日：2023-11-21

申请号：US16982497

申请日：2019-03-20

Applicant: Knowles Electronics, LLC

Inventor： Mohsin Nawaz ,  Shubham Shubham ,  David Schafer ,  Michael Pedersen ,  Claus Furst ,  Mohammad Shajaan ,  Jay Cech

IPC: H04R19/04 ,  B81B7/02 ,  H04R31/00 ,  B81C1/00 ,  G01L9/00 ,  G01L19/14

CPC classification number: H04R19/04 ,  B81B7/02 ,  B81C1/00341 ,  G01L9/0072 ,  G01L19/14 ,  H04R31/00 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0136 ,  B81B2207/03 ,  B81C2201/0109 ,  B81C2201/0132 ,  H04R2201/003

Abstract: Microphones including a housing defining a cavity, a plurality of conductors positioned within the cavity, at least one dielectric bar positioned within the cavity, and a transducer diaphragm. The conductors are structured to move in response to pressure changes while the housing remains fixed. A first conductor generates first electrical signals responsive to the pressure changes resulting from changes in an atmospheric pressure. A second conductor generates second electrical signals responsive to the pressure changes resulting from acoustic activity. The dielectric bar is fixed with respect to the cavity and remains fixed under the pressure changes. The dielectric bar is adjacent to at least one of the conductors. In response to an applied pressure that is an atmospheric pressure and/or an acoustic pressure, the transducer diaphragm exerts a force on the housing and displaces at least a portion of conductors with respect to the dielectric bar.

公开(公告)号：US11820650B2

公开(公告)日：2023-11-21

申请号：US16882039

申请日：2020-05-22

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Bor-Shiun Lee ,  Ming-Fa Chen ,  Yu-Wen Hsu ,  Chao-Ta Huang

IPC: B81B7/02 ,  B81C1/00 ,  G01L19/00 ,  G01K7/18 ,  G01N27/22

CPC classification number: B81B7/02 ,  B81C1/00246 ,  G01K7/186 ,  G01L19/0092 ,  G01N27/223 ,  B81B2201/0264 ,  B81B2201/0278

Abstract: The disclosure relates to a microelectromechanical apparatus including a substrate, a stationary electrode, a movable electrode, and a heater. The substrate includes an upper surface, an inner bottom surface, and an inner side surface. The inner side surface surrounds and connects with the inner bottom surface. The inner side surface and the inner bottom surface define a recess. The stationary electrode is disposed on the inner bottom surface. The movable electrode covers the recess. The movable electrode, the inner bottom surface, and the inner side surface define a hermetic chamber. The heater is disposed on the movable electrode and located above the hermetic chamber.

公开(公告)号：US11802806B2

公开(公告)日：2023-10-31

申请号：US17154698

申请日：2021-01-21

Applicant: MKS Instruments, Inc.

Inventor： Gerardo A. Brucker

IPC: G01L27/00 ,  G01L13/02 ,  G01L9/12 ,  G01L21/12 ,  G01L9/00 ,  B81B3/00

CPC classification number: G01L21/12 ,  B81B3/0018 ,  G01L9/0055 ,  G01L13/025 ,  G01L27/005 ,  B81B2201/0264

Abstract: A load lock pressure gauge comprises a housing configured to be coupled to a load lock vacuum chamber. The housing supports an absolute vacuum pressure sensor that provides instantaneous high vacuum pressure signal over a range of high vacuum pressures and a differential diaphragm pressure sensor that provides an instantaneous differential pressure signal between load lock pressure and ambient pressure. The housing further supports an absolute ambient pressure sensor. A low vacuum absolute pressure is computed from the instantaneous differential pressure signal and the instantaneous ambient pressure signal. A controller in the housing is able to recalibrate the differential diaphragm pressure sensor based on measured voltages of the sensor and a measured ambient pressure during normal operation of the pressure gauge with routine cycling of pressure in the load lock.

公开(公告)号：US11767218B2

公开(公告)日：2023-09-26

申请号：US17274817

申请日：2019-09-12

Applicant: Teknologian tutkimuskeskus VTT Oy

Inventor： Tapio Pernu ,  Jukka Kyynäräinen ,  Jaakko Saarilahti

IPC: B81B7/02 ,  B81C1/00 ,  G01L9/00 ,  G01L13/02

CPC classification number: B81B7/02 ,  B81C1/00158 ,  G01L9/0055 ,  G01L13/025 ,  B81B2201/0264 ,  B81B2203/0127

Abstract: According to an example aspect of the present invention, there is provided a MEMS pressure sensor, comprising: a sensor portion comprising a deformable membrane and a first volume, and a valve portion comprising a first output to a first side of the pressure sensor and a second output to a second side of the pressure sensor. The valve portion is operable to close the second output and open the first output to equalize pressure in the first volume with pressure at the first side of the pressure sensor for calibrating the sensor; and close the first output and open the second output to equalize pressure in the first volume with pressure at the second side of the pressure sensor for pressure measurement.

公开(公告)号：US20230294976A1

公开(公告)日：2023-09-21

申请号：US18065978

申请日：2022-12-14

Applicant: Infineon Technologies AG

Inventor： Abhiraj Basavanna ,  Somu Goswami ,  Andreas Bogner

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0072 ,  B81C1/00666 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2201/0285 ,  B81B2203/0127

Abstract: A semiconductor device for use in a sensor device has a deformable membrane for the measurement of an acceleration, a vibration, or a pressure. The semiconductor device includes a deformable membrane having a membrane border; a structure holding the deformable membrane in correspondence of the membrane border; at least one electric contact to obtain an electric signal indicative of deformation of the deformable membrane; and mass elements suspended from the membrane.

公开(公告)号：US20230258948A1

公开(公告)日：2023-08-17

申请号：US18308559

申请日：2023-04-27

Applicant: Sony Interactive Entertainment Inc.

Inventor： Dennis Castleman ,  Todd Tokubo ,  Victoria Dorn

IPC: G02B27/01 ,  G01L19/14 ,  B81B7/02

CPC classification number: G02B27/0176 ,  G01L19/14 ,  B81B7/02 ,  G02B2027/0178 ,  B81B2201/0264

Abstract: Methods and systems for interacting with an augmented reality application includes a providing an array of barometric pressure sensors within a housing of a wearable device to capture pressure variances detected from motion of one or more facial features that are proximate to the array of barometric pressure sensors. The pressure variances are analyzed to identify motion metrics related to the motion of the facial features. The motion metrics are used to derive engagement metrics of the user to content of the augmented reality application presented to the user.

公开(公告)号：US11691870B2

公开(公告)日：2023-07-04

申请号：US17164546

申请日：2021-02-01

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alessandro Tocchio ,  Lorenzo Corso

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81C1/00246 ,  B81B2201/0235 ,  B81B2201/0264 ,  B81B2207/092 ,  B81B2207/096 ,  B81C2201/0132 ,  B81C2203/0118 ,  B81C2203/0136 ,  B81C2203/0771 ,  B81C2203/0792

Abstract: An integrated semiconductor device includes: a MEMS structure; an ASIC electronic circuit; and conductive interconnection structures electrically coupling the MEMS structure to the ASIC electronic circuit. The MEMS structure and the ASIC electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the MEMS structure is formed at a first surface of the substrate, and the ASIC electronic circuit is formed at a second surface of the substrate, vertically opposite to the first surface in a direction transverse to a horizontal plane of extension of the first surface and of the second surface.

公开(公告)号：US20230192478A1

公开(公告)日：2023-06-22

申请号：US18058565

申请日：2022-11-23

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Phongsak Sawasdee

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0061 ,  B81B7/0064 ,  B81B7/0074 ,  B81C1/00309 ,  B81B2201/0214 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2207/07 ,  B81C2203/0145

Abstract: A semiconductor device includes a substrate. A first semiconductor die including a microelectromechanical system (MEMS) is disposed over the substrate. A lid is disposed on the substrate around the first semiconductor die. A first encapsulant is deposited over the substrate and lid. A second encapsulant is deposited into the lid.

公开(公告)号：US11667517B2

公开(公告)日：2023-06-06

申请号：US16908243

申请日：2020-06-22

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Chia Liu ,  Chia-Hua Chu ,  Chun-Wen Cheng

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0006 ,  B81B7/0051 ,  B81C1/00246 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0271 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/0176 ,  B81C2201/0181 ,  B81C2201/112 ,  B81C2203/0714 ,  B81C2203/0735

Abstract: Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.