公开(公告)号：US09633976B1

公开(公告)日：2017-04-25

申请号：US14090993

申请日：2013-11-26

Applicant: University of Notre Dame du Lac

Inventor： Gary H. Bernstein ,  Patrick Fay ,  Wolfgang Porod ,  Qing Liu

IPC: H01L25/00 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L24/67 ,  H01L23/60 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/48 ,  H01L24/49 ,  H01L24/66 ,  H01L24/72 ,  H01L24/73 ,  H01L24/82 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/167 ,  H01L25/18 ,  H01L29/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13099 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/81141 ,  H01L2224/81224 ,  H01L2225/0651 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10156 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/181 ,  H05K1/182 ,  H05K3/326 ,  H05K3/328 ,  H05K2201/0314 ,  H05K2201/10454 ,  H05K2201/10909 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A quilt packaging system includes a first and second electronic device each comprising a plurality of edge surfaces at least a first edge surface of which comprises one or more interconnect modules disposed thereon. The first edge surface of the second electronic device is positioned contiguous to the first edge surface of the first electronic device, and at least one of the one or more interconnect nodules disposed on the first edge surface of the first electronic device is configured to be in physical contact with at least one of the one or more interconnect nodules disposed on the first edge surface of second electronic device so as to provide an electrical connection between the first and second electronic devices at the first edge surfaces of the first and second electronic device.

公开(公告)号：US20160294083A1

公开(公告)日：2016-10-06

申请号：US14672494

申请日：2015-03-30

Applicant: Hamilton Sundstrand Corporation

Inventor： Robert C. Cooney ,  John A. Dickey ,  Christian Miller ,  Kevin Case Fritz

IPC: H01R12/70 ,  H01R43/20 ,  H01R13/52

CPC classification number: H01R12/7076 ,  H01R13/5202 ,  H01R43/205 ,  H05K1/181 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/09754 ,  H05K2201/10189 ,  H05K2201/10287

Abstract: A circuit board has a socket with at least one plated through-hole. A connector includes a housing that has first and second connector interfaces with, respectively, at least first and second connector contacts. The first connector interface opens into an interior of the housing such that there is a vapor path through the first connector interface and the interior of the housing to the second connector contact at the second connector interface. A resilient seal is located at the first connector interface. The first connector contact extends through the resilient seal and into the plated through-hole. The resilient seal intimately seals around the first connector contact and provides a barrier at the first connector interface into the vapor path.

Abstract translation: 电路板具有至少一个电镀通孔的插座。 连接器包括具有分别具有至少第一和第二连接器触头的第一和第二连接器接口的壳体。 第一连接器接口开口到壳体的内部，使得在第二连接器接口处存在穿过第一连接器接口的蒸气路径和壳体的内部到第二连接器触点。 弹性密封件位于第一连接器接口处。 第一连接器触头延伸穿过弹性密封件并进入电镀通孔。 弹性密封件密封地围绕第一连接器接头密封，并且在第一连接器接口处提供在蒸气路径中的阻挡层。

公开(公告)号：US09414493B2

公开(公告)日：2016-08-09

申请号：US14715943

申请日：2015-05-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Andreas C. Doering ,  Ralph Heller ,  Ronald P. Luijten ,  Martin L. Schmatz

IPC: H05K1/11 ,  H01R12/52 ,  H01R13/24 ,  H05K1/14 ,  H01R12/73 ,  H01R43/26 ,  H05K3/36

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

Abstract translation: 印刷电路板（PCB）组件包括基本上平行且彼此相对设置的第一PCB和第二PCB，使得第一PCB的第二面与第二PCB的第一侧相对; 其中所述第二PCB在其第一侧上具有第一组侧连接器，在其第二侧上具有第二组侧连接器，其被配置用于与所述第二PCB的电力供应和信号通信; 第二PCB经由第一弹性体连接器电连接和机械地连接到第一PCB的第二侧; 并且所述第二PCB经由其第二组侧连接器电连接到所述第一PCB，以及电连接到所述第二组侧连接器和所述第一PCB的柔性电连接器。

公开(公告)号：US20150351242A1

公开(公告)日：2015-12-03

申请号：US14715943

申请日：2015-05-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： ANDREAS C. DOERING ,  RALPH HELLER ,  RONALD P. LUIJTEN ,  MARTIN L. SCHMATZ

IPC: H05K1/11 ,  H05K1/14 ,  H01R12/73

CPC classification number: H05K1/117 ,  H01R12/52 ,  H01R12/73 ,  H01R13/2414 ,  H01R43/26 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/0133 ,  H05K2201/0314 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10954 ,  Y10T29/49128

Abstract: A printed circuit board (PCB) assembly includes a first PCB and a second PCB disposed substantially parallel and opposite to each other, such that a second side of the first PCB is opposite to a first side of the second PCB; wherein the second PCB has a first set of side connectors on its first side and a second set of side connectors on its second side, configured for both electrical power supply to and signal communication with the second PCB; the second PCB both electrically and mechanically connected to the second side of the first PCB via a first elastomeric connector; and the second PCB electrically connected to the first PCB via its second set of side connectors and a flexible electrical connector that is electrically connected to the second set of side connectors and the first PCB.

Abstract translation: 印刷电路板（PCB）组件包括基本上平行且彼此相对设置的第一PCB和第二PCB，使得第一PCB的第二面与第二PCB的第一侧相对; 其中所述第二PCB在其第一侧上具有第一组侧连接器，在其第二侧上具有第二组侧连接器，其被配置用于与所述第二PCB的电力供应和信号通信; 第二PCB经由第一弹性体连接器电连接和机械地连接到第一PCB的第二侧; 并且所述第二PCB经由其第二组侧连接器电连接到所述第一PCB，以及电连接到所述第二组侧连接器和所述第一PCB的柔性电连接器。

公开(公告)号：US20150163897A1

公开(公告)日：2015-06-11

申请号：US14181412

申请日：2014-02-14

Applicant: LOTES CO., LTD

Inventor： Ted Ju

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K3/32 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49883 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13111 ,  H01L2224/16235 ,  H01L2224/81101 ,  H01L2224/81405 ,  H01L2224/81411 ,  H01L2224/81494 ,  H01L2224/81505 ,  H01L2224/81594 ,  H01L2224/81691 ,  H01L2224/81711 ,  H01L2224/819 ,  H01R13/035 ,  H01R13/2414 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10962 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0715

Abstract: An electrical connector for electrically connecting a first electronic element to a second electronic element includes an insulating body and multiple conductors. The insulating body has multiple accommodating holes. Each conductor is accommodated in a corresponding accommodating hole. Each conductor has an elastic insulator and low melting point liquid metal wrapping a surface of the elastic insulator, such that a continuous conducting path is formed by the liquid metal between the first electronic element and the second electronic element.

Abstract translation: 用于将第一电子元件电连接到第二电子元件的电连接器包括绝缘体和多个导体。 绝缘体具有多个容纳孔。 每个导体容纳在相应的容纳孔中。 每个导体具有包裹弹性绝缘体的表面的弹性绝缘体和低熔点液体金属，使得在第一电子元件和第二电子元件之间由液态金属形成连续导电路径。

公开(公告)号：US09053838B2

公开(公告)日：2015-06-09

申请号：US13809772

申请日：2011-05-18

Applicant: Toshiki Ogawa ,  Masakazu Koizumi

Inventor： Toshiki Ogawa ,  Masakazu Koizumi

IPC: H01B1/12 ,  H01R12/57 ,  H01R13/24 ,  H05K3/32 ,  H01R43/00 ,  H01R43/02 ,  H05K3/34

CPC classification number: H01B1/12 ,  H01R12/57 ,  H01R13/03 ,  H01R13/2414 ,  H01R43/007 ,  H01R43/0263 ,  H05K3/32 ,  H05K3/341 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/1031 ,  H05K2201/10962 ,  Y02P70/611 ,  Y10T29/49149

Abstract: A conductive rubber component (10) of the present invention includes a metal coating (2) formed on at least one surface located perpendicular to a compression direction of a conductive rubber single body (1) by atomic and/or molecular deposition, and can be surface mounted and soldered. In a method for mounting a conductive rubber component (10) of the present invention, the conductive rubber component (10) is surface mounted on a wiring layer (8) on a printed wiring board (9) and is fixed by a solder layer (7) thereto and thereby is incorporated to electrically connect the printed circuit board (9) and an electronic component (11) to each other. Thus, a conductive rubber component and a method for mounting same are provided, wherein the conductive rubber component is used as an electrical contact of an electronic component compatible with the surface mount technology (SMT), the conductive rubber component does not cause any damage to the electrode surface of the electronic component even when the body of an electronic device in which it is mounted is distorted or warped, it has lower resistance and excellent chemical stability and can be used for SMT.

Abstract translation: 本发明的导电性橡胶成分（10）包括通过原子和/或分子沉积形成在与导电性橡胶单体（1）的压缩方向正交的至少一个表面上的金属涂层（2），并且可以 表面安装和焊接。 在本发明的导电性橡胶成分（10）的安装方法中，将导电性橡胶成分（10）表面安装在印刷电路板（9）上的布线层（8）上，并通过焊料层 7），从而将印刷电路板（9）和电子部件（11）彼此电连接。 因此，提供导电橡胶部件及其安装方法，其中导电橡胶部件用作与表面贴装技术（SMT）兼容的电子部件的电接触，导电橡胶部件不会对 电子部件的电极表面即使其安装的电子器件的主体变形或翘曲，它具有较低的电阻和优异的化学稳定性，并且可用于SMT。

公开(公告)号：US09042105B2

公开(公告)日：2015-05-26

申请号：US13530038

申请日：2012-06-21

Applicant: Shayan Malek ,  Michael B. Wittenberg ,  John Ardisana

Inventor： Shayan Malek ,  Michael B. Wittenberg ,  John Ardisana

IPC: H05K1/00 ,  H05K7/14 ,  H05K1/11 ,  H05K1/09 ,  H05K1/02 ,  H05K3/42 ,  G06F1/18 ,  H05K5/00

CPC classification number: H05K7/1417 ,  G06F1/183 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/0215 ,  H05K1/09 ,  H05K1/11 ,  H05K3/42 ,  H05K5/0043 ,  H05K5/0047 ,  H05K5/0052 ,  H05K5/0073 ,  H05K2201/0314

Abstract: An electronic device may be provided with a printed circuit board having padded through-holes. The padded through-holes may be formed from openings in a printed circuit board substrate and elastomeric members in the openings. The elastomeric members may be conductive elastomeric members such as electrically or thermally conductive elastomeric members. The printed circuit board may be secured within a housing for the electronic device using engagement members that extend through padded through-holes. The engagement members may engage with the housing or with additional engagement members that are attached to the housing. The electronic device may include a cowling structure formed over electronic components on a surface of the printed circuit board. The cowling structure may be secured to the printed circuit board using attachment members that engage with the engagement members in the padded through-holes.

Abstract translation: 电子设备可以设置有具有填充通孔的印刷电路板。 填充的通孔可以由印刷电路板基板中的开口和开口中的弹性体构件形成。 弹性体构件可以是导电弹性构件，例如导电或导热的弹性构件。 印刷电路板可以使用延伸穿过填充通孔的接合构件固定在电子设备的壳体内。 接合构件可以与壳体接合或者与附接到壳体的附加接合构件接合。 电子设备可以包括形成在印刷电路板的表面上的电子部件上的整流罩结构。 整流罩结构可以使用与填充通孔中的接合构件接合的附接构件固定到印刷电路板。

公开(公告)号：US20140238727A1

公开(公告)日：2014-08-28

申请号：US14130156

申请日：2012-07-02

Applicant: Stephane Roger ,  Marie Dieudonne ,  Gregory Guicheney ,  Phillippe Sonntag

Inventor： Stephane Roger ,  Marie Dieudonne ,  Gregory Guicheney ,  Phillippe Sonntag

IPC: H05K1/02 ,  H01B13/00

CPC classification number: H05K1/0274 ,  B22F1/0025 ,  B22F1/0074 ,  B82Y30/00 ,  H01B1/22 ,  H01B13/0013 ,  H01L31/022466 ,  H01L31/1884 ,  H01L51/442 ,  H01L51/444 ,  H01L51/5215 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/09 ,  H05K2201/0108 ,  H05K2201/026 ,  H05K2201/0314 ,  H05K2201/10128 ,  Y02E10/549

Abstract: The present invention relates to a multilayer transparent conducting electrode, comprising a substrate layer (1), an adhesion layer (2), a percolating network of metal nanofilaments (3) and an electrical homogenization layer (4), the said electrical homogenization layer (4) comprising: an elastomer having a glass transition temperature Tg of less than 20° C. and/or a thermoplastic polymer having a glass transition temperature Tg of less than 20° C. and/or a polymer, an optionally substituted polythiophene conducting polymer, and nanometric conducting or semiconducting fillers.

Abstract translation: 本发明涉及一种多层透明导电电极，其包括基底层（1），粘附层（2），金属纳米丝（3）的渗滤网和电均匀化层（4），所述电均匀层 4）包括：玻璃化转变温度Tg低于20℃的弹性体和/或玻璃化转变温度Tg低于20℃的热塑性聚合物和/或聚合物，任选取代的聚噻吩导电聚合物 ，以及纳米导电或半导体填料。

公开(公告)号：US20140177180A1

公开(公告)日：2014-06-26

申请号：US13726509

申请日：2012-12-24

Applicant: APPLE INC.

Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Sawyer I. Cohen ,  Ashutosh Y. Shukla

IPC: H05K1/02 ,  H05K1/11 ,  H05K13/00 ,  H05K9/00

CPC classification number: H05K1/0219 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/363 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0022 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409 ,  Y10T29/49126

Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.

Abstract translation: 电子设备中的电气部件安装在诸如印刷电路的基板上。 印刷电路包含由金属迹线形成的信号路径。 印刷电路的信号路径中的信号线通过诸如印刷电路板对板连接器，由各向异性导电膜连接的触点或使用焊料连接的触点之类的电连接结构耦合在一起。 电连接结构可以由诸如导电泡沫结构或弹簧结构的导电弹性环形结构围绕。 导电泡沫结构可以设置有金属层，导电泡沫结构通过该金属层焊接到印刷电路上的金属环。 应变消除结构可以由围绕电连接结构或包覆成型的塑料结构的弹性体环形成。 涂层和导电塑料可用于提供具有电磁干扰屏蔽能力的应变消除结构。

公开(公告)号：US20130105198A1

公开(公告)日：2013-05-02

申请号：US13809772

申请日：2011-05-18

Applicant: Toshiki Ogawa ,  Masakazu Koizumi

Inventor： Toshiki Ogawa ,  Masakazu Koizumi

IPC: H01B1/12 ,  H05K3/34

CPC classification number: H01B1/12 ,  H01R12/57 ,  H01R13/03 ,  H01R13/2414 ,  H01R43/007 ,  H01R43/0263 ,  H05K3/32 ,  H05K3/341 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/1031 ,  H05K2201/10962 ,  Y02P70/611 ,  Y10T29/49149

Abstract: A conductive rubber component (10) of the present invention includes a metal coating (2) formed on at least one surface located perpendicular to a compression direction of a conductive rubber single body (1) by atomic and/or molecular deposition, and can be surface mounted and soldered. In a method for mounting a conductive rubber component (10) of the present invention, the conductive rubber component (10) is surface mounted on a wiring layer (8) on a printed wiring board (9) and is fixed by a solder layer (7) thereto and thereby is incorporated to electrically connect the printed circuit board (9) and an electronic component (11) to each other. Thus, a conductive rubber component and a method for mounting same are provided, wherein the conductive rubber component is used as an electrical contact of an electronic component compatible with the surface mount technology (SMT), the conductive rubber component does not cause any damage to the electrode surface of the electronic component even when the body of an electronic device in which it is mounted is distorted or warped, it has lower resistance and excellent chemical stability and can be used for SMT.

Abstract translation: 本发明的导电性橡胶成分（10）包括通过原子和/或分子沉积形成在与导电性橡胶单体（1）的压缩方向正交的至少一个表面上的金属涂层（2），并且可以 表面安装和焊接。 在本发明的导电性橡胶成分（10）的安装方法中，将导电性橡胶成分（10）表面安装在印刷电路板（9）上的布线层（8）上，并通过焊料层 7），从而将印刷电路板（9）和电子部件（11）彼此电连接。 因此，提供导电橡胶部件及其安装方法，其中导电橡胶部件用作与表面安装技术（SMT）兼容的电子部件的电接触，导电橡胶部件不会对 电子部件的电极表面即使其安装的电子器件的主体变形或翘曲，它具有较低的电阻和优异的化学稳定性，并且可用于SMT。