公开(公告)号：US20140342097A1

公开(公告)日：2014-11-20

申请号：US14227391

申请日：2014-03-27

Applicant: The United States Navy as represented by the Secretary of the Navy

Inventor： Nishkamraj Deshpande

IPC: H05K3/22

CPC classification number: H05K3/28 ,  H05K3/284 ,  H05K2201/0251 ,  H05K2201/0257 ,  H05K2201/0769 ,  H05K2201/09872

Abstract: The present invention relates application of conformal coatings made up of nano-fiber, nano-particle, and/or nano-capsule materials to be applied on electrical component parts in general and printed circuit boards (PCB) in particular. A conformal coating material, such as Parlyne, can be combined with nano-materials to produce desired results. Benefits of this invention include enhancement of conventional conformal coatings performance in terms of properties such as mechanical, electrical, magnetic and in particular to prevent or obstruct the growth of tin whiskers or any other manufacturing defect that can develop on the surface of a PCB.

Abstract translation: 本发明涉及将纳米纤维，纳米颗粒和/或纳米胶囊材料构成的保形涂层应用于一般的电子部件和特别是印刷电路板（PCB）上。 可将适形涂层材料（如Parlyne）与纳米材料结合以产生所需结果。 本发明的优点包括在诸如机械，电气，磁性的特性方面增强常规的保形涂层性能，特别是防止或阻碍锡晶须的生长或可能在PCB表面上发展的任何其它制造缺陷。

公开(公告)号：US20140138134A1

公开(公告)日：2014-05-22

申请号：US14084038

申请日：2013-11-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kei Imafuji ,  Jun Yoshiike

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/11 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0373 ,  H05K2201/0769 ,  H05K2201/099 ,  H05K2201/2072 ,  H05K2203/0594 ,  H05K2203/1184 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring substrate includes: a connection pad having a first surface; a protective insulation layer formed on the first surface of the connection pad and having an opening portion therein, wherein a portion of the first surface of the connection pad is exposed from the opening portion; a metal layer having a lower surface facing the first surface of the connection pad and an upper surface opposite to the lower surface and formed on the first surface of the connection pad which is exposed from the opening portion, the metal layer including a raised portion that extends upward from the upper surface of the metal layer in a peripheral portion thereof; and a bump electrode formed on the upper surface of the metal layer.

Abstract translation: 布线基板包括：具有第一表面的连接垫; 保护绝缘层，形成在连接焊盘的第一表面上并且在其中具有开口部分，其中连接焊盘的第一表面的一部分从开口部露出; 具有面向连接焊盘的第一表面的下表面的金属层和与下表面相对的上表面，并且形成在从开口部暴露的连接焊盘的第一表面上，金属层包括凸起部分， 从金属层的上表面在其周边部分向上延伸; 以及形成在金属层的上表面上的凸块电极。

公开(公告)号：US20140110402A1

公开(公告)日：2014-04-24

申请号：US13656293

申请日：2012-10-19

Applicant: THE BOEING COMPANY

Inventor： Mark J. Clemen, JR.

IPC: H05B6/36

CPC classification number: H05K3/22 ,  C25D5/48 ,  H05K1/0212 ,  H05K2201/0769 ,  H05K2201/10121 ,  H05K2201/10219 ,  H05K2203/102 ,  H05K2203/107

Abstract: Methods and apparatus for reducing the occurrence of metal whiskers on surfaces are disclosed herein. In particular, the present disclosure teaches providing at least one source of electromagnetic energy to emit energy to reduce the occurrence of metal whiskers on a surface.

Abstract translation: 本文公开了用于减少表面上的金属晶须的发生的方法和装置。 特别地，本公开教导提供至少一个电磁能源以发射能量以减少表面上的金属晶须的出现。

公开(公告)号：US20140000940A1

公开(公告)日：2014-01-02

申请号：US13880589

申请日：2011-10-27

Applicant: Yurie Onitsuka ,  Yousuke Moriyama

Inventor： Yurie Onitsuka ,  Yousuke Moriyama

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49805 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/02 ,  H05K3/0052 ,  H05K3/0061 ,  H05K2201/0769 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09845 ,  H01L2924/00011 ,  H01L2924/00

Abstract: A wiring board includes an insulating substrate having a side surface including a protrusion portion or a recess portion and a lower surface having a metal member bonded thereto; a wiring conductor embedded in the insulating substrate and having an exposed portion partially exposed above the protrusion portion or the recess portion from the side surface of the insulating substrate; and a metal member bonded to the lower surface of the insulating substrate. It is possible to suppress occurrence of ion migration between the wiring conductor and the metal member by increasing a distance between the exposed portion and the metal member without increasing a thickness of the wiring board.

Abstract translation: 布线基板包括绝缘基板，该绝缘基板具有包括突出部或凹部的侧表面和与其接合的金属部件的下表面; 嵌入绝缘基板中的布线导体，并且具有从绝缘基板的侧面突出部分或凹部的部分露出的暴露部分; 以及结合到绝缘基板的下表面的金属构件。 通过在不增加布线板的厚度的情况下增加露出部与金属构件的距离，能够抑制布线导体与金属构件之间的离子迁移的发生。

公开(公告)号：US20130284066A1

公开(公告)日：2013-10-31

申请号：US13932903

申请日：2013-07-01

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Yutaka MORII

IPC: C09D7/12

CPC classification number: C09D7/1233 ,  C09D7/63 ,  C23C18/48 ,  C23C22/58 ,  C25D3/32 ,  C25D3/60 ,  H01L21/4835 ,  H05K3/22 ,  H05K3/244 ,  H05K3/3473 ,  H05K2201/0769 ,  H05K2203/0789 ,  H05K2203/122

Abstract: A tin or tin alloy plating film surface treatment aqueous solution that can reduce whiskers on the surface of a tin or tin alloy plating film, and can provide a favorable tin or tin alloy plating film using a simple method for tin or tin alloy plating films that are used on electronic components.

Abstract translation: 一种锡或锡合金电镀薄膜表面处理水溶液，可以减少锡或锡合金镀膜表面的晶须，并可以使用锡或锡合金镀膜的简单方法提供有利的锡或锡合金镀膜， 用于电子元件。

公开(公告)号：US08487347B2

公开(公告)日：2013-07-16

申请号：US12887698

申请日：2010-09-22

Applicant: Zhenyu Xie ,  Xiang Liu ,  Xu Chen

Inventor： Zhenyu Xie ,  Xiang Liu ,  Xu Chen

IPC: H01L27/118

CPC classification number: H01L27/124 ,  G02F1/136286 ,  G02F2001/134372 ,  G02F2001/13629 ,  G02F2001/136295 ,  G02F2201/501 ,  H01L29/458 ,  H01L29/4908 ,  H05K1/09 ,  H05K2201/0338 ,  H05K2201/0769

Abstract: An array substrate comprises a substrate provided with a circuit pattern and covering layers that cover the upper surfaces and side surfaces of respective portions of the circuit pattern.

Abstract translation: 阵列基板包括设置有电路图案的基板和覆盖电路图案的各个部分的上表面和侧表面的覆盖层。

公开(公告)号：US08378227B2

公开(公告)日：2013-02-19

申请号：US12585754

申请日：2009-09-24

Applicant: Seiichi Inoue

Inventor： Seiichi Inoue

IPC: H05K1/11

CPC classification number: H05K3/246 ,  H05K1/0256 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/1208 ,  H05K3/125 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2201/09036 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/1147 ,  H05K2203/1173 ,  Y10T29/49155

Abstract: A method of forming a wiring board comprises: a step of forming a receptive layer having a porous structure on a substrate; a step of forming wiring portions in a desired conductive pattern on a surface of the receptive layer by ejecting a colloidal metal solution for drawing by an ink-jet system based on image date of the conductive pattern; and a step of performing a migration-proof treatment on at least part of the receptive layer exposed between mutually adjacent wiring portions.

Abstract translation: 形成布线板的方法包括：在基板上形成具有多孔结构的接收层的步骤; 基于导电图案的图像日期，通过喷射通过喷墨系统进行拉伸的胶体金属溶液，在接收层的表面上形成所需导电图案中的布线部分的步骤; 以及对相互相邻的布线部之间露出的接受层的至少一部分进行防迁移处理的步骤。

公开(公告)号：US08314339B2

公开(公告)日：2012-11-20

申请号：US12495860

申请日：2009-07-01

Applicant: Masayuki Kitajima ,  Takeshi Ishitsuka ,  Satoshi Emoto

Inventor： Masayuki Kitajima ,  Takeshi Ishitsuka ,  Satoshi Emoto

IPC: H05K1/03 ,  H05K1/09

CPC classification number: H05K3/249 ,  H05K1/118 ,  H05K2201/0272 ,  H05K2201/035 ,  H05K2201/0769 ,  H05K2203/1105

Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.

Abstract translation: 印刷布线板包括形成布线图案的第一导电浆料和包含捏合的第一导电材料的第二导电浆料和其颗粒比第一导电材料细颗粒的第二导电材料。

公开(公告)号：US08222536B2

公开(公告)日：2012-07-17

申请号：US12324516

申请日：2008-11-26

Applicant: Shuzo Hirata ,  Akinobu Ono

Inventor： Shuzo Hirata ,  Akinobu Ono

IPC: H05K1/11

CPC classification number: H05K1/117 ,  H05K1/095 ,  H05K3/247 ,  H05K3/28 ,  H05K2201/035 ,  H05K2201/0769 ,  H05K2201/09436 ,  H05K2201/09709

Abstract: A wiring substrate is provided with a substrate, a conductive circuit formed on a surface of the substrate, and an insulating layer which covers the conductive circuit. In a fitting portion of the wiring substrate, the insulating layer is formed with an opening portion through which a portion of the conductive circuit is exposed or displayed as an exposed surface. On the exposed surface of the conductive circuit, an electrode layer is formed which is made of a conductive member. A bottom surface of the electrode layer is connected to the conductive circuit. An upper surface of the electrode layer is extended in the widthwise direction W of wirings of the conductive circuit so as to cover even a part of the insulating layer.

Abstract translation: 布线基板设置有基板，形成在基板的表面上的导电电路以及覆盖导电电路的绝缘层。 在布线基板的配合部分中，绝缘层形成有一个开口部分，一部分导电电路通过该开口部分露出或显示为暴露表面。 在导电电路的暴露表面上形成由导电构件制成的电极层。 电极层的底面与导电电路连接。 电极层的上表面在导电电路的布线的宽度方向W上延伸，以覆盖绝缘层的一部分。

公开(公告)号：US08209859B2

公开(公告)日：2012-07-03

申请号：US12123733

申请日：2008-05-20

Applicant: Louis H. Feinstein

Inventor： Louis H. Feinstein

IPC: H05K3/30

CPC classification number: H05K3/284 ,  H05K2201/068 ,  H05K2201/0769 ,  H05K2201/09909 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/0126 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49227 ,  Y10T29/52 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A technique for processing an electronic apparatus (e.g., manufacturing an assembled circuit board, treating an assembled circuit board, etc.) involves applying encasement material to an area of the circuit board assembly while leaving at least a portion of the circuit board assembly exposed. The technique further involves causing the applied encasement material to harden (e.g., heating the encasement material in a curing oven, applying radiation, providing a chemical catalyst, etc.). Application and hardening of the encasement material may take place shortly after circuit board assembly (e.g., by automated equipment at a manufacturing facility in order to treat newly assembled boards) or at some later time in the field (e.g., by a technician servicing a legacy board).

Abstract translation: 一种用于处理电子设备（例如，制造组装电路板，处理组装电路板等）的技术涉及将外壳材料施加到电路板组件的区域，同时使电路板组件的至少一部分露出。 该技术还包括使所施加的包装材料硬化（例如，在固化炉中加热包装材料，施加辐射，提供化学催化剂等）。 封装材料的应用和硬化可能在电路板组装之后不久（例如，通过制造设施处的自动化设备来处理新组装的板）或在现场的某个稍后的时间（例如，由维护遗留物的技术人员） 板）。