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    Patch Panel Assembly For Use With Data Networks
    11.
    发明申请
    Patch Panel Assembly For Use With Data Networks 有权
    用于数据网络的配线架组件

    公开(公告)号：US20110256742A1

    公开(公告)日：2011-10-20

    申请号：US13123030

    申请日：2009-10-07

    Applicant: Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

    Inventor： Augusto P. Panella ,  Elliot A. Baines ,  Jeng-De Lin

    IPC: H01R12/73 ,  H01R12/71

    CPC classification number: H04Q1/136 ,  H04L41/12 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

    Abstract: A patch panel (100) for use with infrastructure management systems that utilizes a plurality of cables interconnected to end-user devices and work area outlets, and integrated circuits to monitor the status of these end-user devices and outlets includes a pair of circuit boards. A plurality of connective jacks (31) are mounted on the first (36) of the two circuit boards, and are interconnected to other network devices. Wires from the jacks extend to and connect with network devices and the first circuit board has a plurality of first integrated circuits (45) mounted thereon which monitor the status of the network devices connected to the jacks. The second circuit board (49) is spaced apart from the first circuit board and it includes a plurality of second integrated circuits (52) that convey the status information obtained from the network work area outlets on the network to network devices, such as switches and scanners of the network (104).

    Abstract translation: 用于与利用与终端用户设备和工作区域出口相互连接的多条电缆的基础设施管理系统使用的接线板（100）以及用于监控这些终端用户设备和出口的状态的集成电路包括一对电路板 。 多个连接插座（31）安装在两个电路板的第一（36）上，并且互连到其他网络设备。 插座的电线延伸到网络设备并与其连接，并且第一电路板具有安装在其上的多个第一集成电路（45），其监测连接到插座的网络设备的状态。 第二电路板（49）与第一电路板间隔开，并且包括多个第二集成电路（52），其将从网络上的网络工作区域出口获得的状态信息传送到网络设备，诸如交换机和 网络扫描仪（104）。

    Patch Panel Assembly For Use With Data Networks
    12.
    发明申请
    Patch Panel Assembly For Use With Data Networks 有权
    用于数据网络的配线架组件

    公开(公告)号：US20110256738A1

    公开(公告)日：2011-10-20

    申请号：US13123036

    申请日：2009-10-07

    Applicant: Augusto P. Panella ,  Elliot a. Baines ,  Jeng-De Lin

    Inventor： Augusto P. Panella ,  Elliot a. Baines ,  Jeng-De Lin

    IPC: H01R29/00

    CPC classification number: H01R13/6658 ,  H01R12/67 ,  H01R24/64 ,  H01R25/006 ,  H01R2201/04 ,  H04L41/12 ,  H04Q1/136 ,  H05K1/118 ,  H05K1/144 ,  H05K1/147 ,  H05K3/326 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/091 ,  H05K2201/09445 ,  H05K2201/10189

    Abstract: A structure for use with data network management systems uses a plurality of cables interconnecting patch panels, network devices and end-user devices and further utilizes integrated circuits to monitor the status of these end-user devices. The structure includes respective primary (36) and secondary (45) circuit boards. A plurality of connective jacks (31) are mounted on the primary circuit board and these jacks are interconnected to switches and other patch panels within the network. Wires from the jacks extend to and connect with end-user devices and a secondary circuit board is spaced apart from the primary circuit board so as to define a hollow nest (42) within the patch panel assembly that houses and protects integrated circuits (45, 52) and the like.

    Abstract translation: 用于数据网络管理系统的结构使用互连接线板，网络设备和最终用户设备的多条电缆，并且还利用集成电路来监视这些终端用户设备的状态。 该结构包括相应的初级（36）和次级（45）电路板。 多个连接插座（31）安装在主电路板上，并且这些插孔与网络内的交换机和其他接线板互连。 插座的电线延伸到终端用户设备并与其连接，并且次级电路板与主电路板间隔开，以便在接线板组件内限定一个中空的座（42），该中空座（42）容纳和保护集成电路 52）等。

    Hybrid structure of multi-layer substrates and manufacture method thereof
    13.
    发明授权
    Hybrid structure of multi-layer substrates and manufacture method thereof 有权
    多层基板的混合结构及其制造方法

    公开(公告)号：US08023282B2

    公开(公告)日：2011-09-20

    申请号：US11856858

    申请日：2007-09-18

    Applicant: Chih-kuang Yang

    Inventor： Chih-kuang Yang

    IPC: H01R12/16

    CPC classification number: H05K1/147 ,  H01L23/13 ,  H01L23/5385 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/19107 ,  H05K1/142 ,  H05K3/4611 ,  H05K2201/058 ,  H05K2201/091 ,  H05K2201/09109 ,  H05K2201/0919 ,  H05K2201/09481 ,  Y10T29/417 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T428/24322 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer.

    Abstract translation: 多层基板的混合结构包括第一多层基板和第二多层基板。 第一多层基板交替地堆叠第一金属层，第一介电层并具有VIA。 第一金属层的边界区域与相应的第一介电层的边界区域连接。 边界区域与相邻的第一金属层和相邻的第一介电层分离。 第二多层基板交替堆叠第二金属层和第二电介质层。 第二金属层的边界区域与相应的第二电介质层的边界区域连接。 边界区域与相邻的第二金属层和相邻的第二介电层分离。 VIA位于第一电介质层的边界区，并且每个VIA具有导电体，以将一个第一金属层与一个第二金属层连接。

    FEMALE CIRCUIT BOARD AND CONNECTOR ASSEMBLY
    15.
    发明申请
    FEMALE CIRCUIT BOARD AND CONNECTOR ASSEMBLY 有权
    女性电路板和连接器总成

    公开(公告)号：US20110212631A1

    公开(公告)日：2011-09-01

    申请号：US13034066

    申请日：2011-02-24

    Applicant: Mituru IIDA

    Inventor： Mituru IIDA

    IPC: H01R12/79

    CPC classification number: H01R12/62 ,  H01R12/52 ,  H01R12/55 ,  H05K1/141 ,  H05K3/3442 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/09181 ,  H05K2201/1059 ,  H05K2201/2009

    Abstract: A female circuit board for use with a male circuit board has electrically conductive projections. The female circuit board includes a flexible insulating film. The flexible insulating film includes insertion portions into which the conductive projections of the male circuit board are allowed to be inserted. Each of the insertion portions includes a plurality of slits communicating with each other at the center of each of the insertion portions. The flexible insulating film further includes electrically conduction portions for making contact with the conductive projections to come into conduction with the male circuit board. The conduction portions are disposed around the insertion portions on the surface of the female circuit board facing the male circuit board when the female circuit board is in contact with the male circuit board. The conduction portions conform in shape to the insertion portions.

    Abstract translation: 与阳电路板一起使用的母电路板具有导电突起。 阴电路板包括柔性绝缘膜。 柔性绝缘膜包括允许插入阳电路板的导电突起的插入部分。 每个插入部分包括在每个插入部分的中心处彼此连通的多个狭缝。 柔性绝缘膜还包括用于与导电突起接触以与阳电路板导通的导电部分。 当阴电路板与阳电路板接触时，导电部分设置在阴电路板的面对阳电路板的表面上的插入部分周围。 导电部分的形状与插入部分一致。

    Connection structure of electronic component and wired circuit board, wired circuit board assembly, and method for testing electronic component
    16.
    发明申请
    Connection structure of electronic component and wired circuit board, wired circuit board assembly, and method for testing electronic component 有权
    电子元件和有线电路板的连接结构，有线电路板组装，电子元器件测试方法

    公开(公告)号：US20110128033A1

    公开(公告)日：2011-06-02

    申请号：US12926441

    申请日：2010-11-18

    Applicant: Tetsuya Ohsawa ,  Hitoki Kanagawa

    Inventor： Tetsuya Ohsawa ,  Hitoki Kanagawa

    IPC: G01R31/304 ,  H05K1/00 ,  H05K3/30

    CPC classification number: H05K3/326 ,  G11B5/455 ,  G11B5/486 ,  H05K1/056 ,  H05K1/118 ,  H05K3/305 ,  H05K3/4092 ,  H05K2201/091

    Abstract: In a connection structure of an electronic component and a wired circuit board, the electronic component includes a plurality of external terminals. The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, and a conductive pattern formed on the insulating base layer. The conductive pattern includes a plurality of terminal portions for connection with the plurality of external terminals. The electronic component and the wired circuit board are disposed such that the plurality of external terminals and the plurality of terminal portions face each other. The wired circuit board is bent such that the conductive pattern is warped, and by the reaction force of the warping, the terminal portions and the external terminals are abutted, and the electronic component and the wired circuit board are electrically connected.

    Abstract translation: 在电子部件和布线电路基板的连接结构中，电子部件包括多个外部端子。 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层和形成在绝缘基底层上的导电图案。 导电图案包括用于与多个外部端子连接的多个端子部分。 电子部件和布线电路基板被配置为使得多个外部端子和多个端子部彼此面对。 弯曲布线电路板使得导电图案翘曲，并且通过翘曲的反作用力使端子部分和外部端子抵接，并且电子部件和布线电路板电连接。

    Multilayer ceramic substrate and method for manufacturing the same
    19.
    发明授权
    Multilayer ceramic substrate and method for manufacturing the same 有权
    多层陶瓷基板及其制造方法

    公开(公告)号：US07911801B2

    公开(公告)日：2011-03-22

    申请号：US12691782

    申请日：2010-01-22

    Applicant: Yuichi Iida ,  Osamu Chikagawa

    Inventor： Yuichi Iida ,  Osamu Chikagawa

    IPC: H05K1/18 ,  H05K7/14

    CPC classification number: H05K1/186 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/091 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T156/1002 ,  Y10T428/24322 ,  Y10T428/24612 ,  Y10T428/24926 ,  Y10T428/24942

    Abstract: A laminate includes base material layers and interlayer constraining layers disposed therebetween. The base material layers are formed of a sintered body of a first powder including a glass material and a first ceramic material, and the interlayer constraining layer includes a second powder including a second ceramic material that will not be sintered at a temperature for melting the glass material, and is in such a state that the second powder adheres together by diffusion or flow of a portion of the first powder including the glass material included in the base material layer at the time of baking. The incorporated element is in such a state that an entire periphery thereof is covered with the interlayer constraining layer.

    Abstract translation: 层压体包括基材层和设置在其间的层间约束层。 所述基材层由包含玻璃材料和第一陶瓷材料的第一粉末的烧结体形成，所述中间层约束层包括第二粉末，所述第二粉末包括在用于熔化所述玻璃的温度下不被烧结的第二陶瓷材料 并且处于这样的状态，即第二粉末通过在烘烤时包含在基材层中的包含玻璃材料的第一粉末的一部分的扩散或流动而粘附在一起。 所引入的元件处于其整个外围被层间限制层覆盖的状态。

    Circuit board including stubless signal paths and method of making same
    20.
    发明授权
    Circuit board including stubless signal paths and method of making same 有权
    电路板包括无铅信号路径及其制作方法

    公开(公告)号：US07907418B2

    公开(公告)日：2011-03-15

    申请号：US12628778

    申请日：2009-12-01

    Applicant: Pascal Meier ,  Sanjay Dabral

    Inventor： Pascal Meier ,  Sanjay Dabral

    IPC: H05K7/00

    CPC classification number: H05K3/4611 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/112 ,  H05K1/147 ,  H05K3/0064 ,  H05K3/4084 ,  H05K2201/091 ,  H05K2201/09318 ,  H05K2201/10734 ,  Y10T29/49126

    Abstract: A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.

    Abstract translation: 电路板可以包括第一和第二侧，在侧面之间的多个电路板层和位于相应的电路板层中的多个信号迹线。 电路板层和信号迹线可以从电路板的第一侧的第一部件连接区域延伸到电路板的第一侧的第二部件连接区域。 因此，信号迹线可以在组件连接区域之间形成通过电路板的不连续的信号路径。 当然，在不偏离本实施例的情况下，可以进行许多替代，变化和修改。

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