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    Electronic component module and method for manufacturing the same
    11.
    发明授权
    Electronic component module and method for manufacturing the same 有权
    电子元件模块及其制造方法

    公开(公告)号：US08363422B2

    公开(公告)日：2013-01-29

    申请号：US12540721

    申请日：2009-08-13

    Applicant: Kaoru Sakinada ,  Yasuyuki Oda

    Inventor： Kaoru Sakinada ,  Yasuyuki Oda

    IPC: H05K7/14 ,  H05K7/18

    CPC classification number: H05K1/144 ,  H01L23/10 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/19105 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1071 ,  H05K2201/042 ,  H05K2201/09354 ,  H05K2201/10083 ,  H05K2201/10674 ,  H05K2201/10969 ,  H05K2203/1147 ,  H01L2224/0401

    Abstract: An electronic component module includes: an insulative substrate; a device chip mounted on a first surface of the insulative substrate in flip-chip mounting; a chip component connected to the insulative substrate; a lid provided above the insulative substrate and the device chip; a first metal pattern that is provided in edge portions on the first surface of the insulative substrate so as to surround the first surface of the insulative substrate; a second metal pattern that is provided in edge portions on a second surface of the lid opposite to the first surface so as to surround the second surface; and seal solder joining the first and second metal patterns so as to define a cavity that is formed in a region that is located between the insulative substrate and the lid and is not provided with the first and second metal patterns and is further formed between the insulative substrate and the device chip.

    Abstract translation: 电子部件模块包括：绝缘基板; 以倒装芯片安装在所述绝缘基板的第一表面上安装的器件芯片; 连接到所述绝缘基板的芯片部件; 设置在所述绝缘基板和所述器件芯片上方的盖; 第一金属图案，设置在绝缘基板的第一表面上的边缘部分中，以围绕绝缘基板的第一表面; 第二金属图案，设置在与第一表面相对的第二表面上的边缘部分中，以围绕第二表面; 以及密封焊料，其接合第一和第二金属图案，以便限定形成在位于绝缘基板和盖之间的区域中并且没有设置第一和第二金属图案并且进一步形成在绝缘体之间的空腔 基板和器件芯片。

    Circuit substrate including a plurality of signal lines and ground lines forming a 3-D grounding circuit loop
    12.
    发明授权
    Circuit substrate including a plurality of signal lines and ground lines forming a 3-D grounding circuit loop 有权
    电路基板包括形成3-D接地电路回路的多条信号线和接地线

    公开(公告)号：US08350637B2

    公开(公告)日：2013-01-08

    申请号：US12760557

    申请日：2010-04-15

    Applicant: Ting-Hao Yeh

    Inventor： Ting-Hao Yeh

    IPC: H01P3/08

    CPC classification number: H05K1/025 ,  H05K2201/09354 ,  H05K2201/09672 ,  H05K2201/0979

    Abstract: A circuit substrate includes a first pair of ground lines, a second pair of ground lines, a plurality of first connection lines, a plurality of second connection lines and a plurality of conductive pillars. The first and second pairs of ground lines are located on first and second surfaces of the substrate, respectively. The pillars are located in the substrate and vertically conducted between the first pair of ground lines and the second connection lines and between the second pair of ground lines and the first connection lines, and the first and second pairs of ground lines are conducted, so that a 3-D grounding circuit loop is formed. Moreover, a first pair of signal lines is disposed between the first connection lines for grounding and a second pair of signal lines is disposed between the second connection lines for grounding to get a better signal integrity.

    Abstract translation: 电路基板包括第一对接地线，第二对接地线，多个第一连接线，多个第二连接线和多个导电柱。 第一和第二对接地线分别位于基板的第一和第二表面上。 支柱位于基板中，并且在第一对接地线与第二连接线之间以及第二对接地线与第一连接线之间垂直传导，并且第一和第二对接地线被导通，使得 形成3-D接地电路回路。 此外，第一对信号线设置在用于接地的第一连接线之间，并且第二对信号线设置在第二连接线之间用于接地以获得更好的信号完整性。

    FLEXIBLE CABLE AND TRANSMISSION SYSTEM
    16.
    发明申请
    FLEXIBLE CABLE AND TRANSMISSION SYSTEM 有权
    柔性电缆和传输系统

    公开(公告)号：US20120020416A1

    公开(公告)日：2012-01-26

    申请号：US13260816

    申请日：2010-03-30

    Applicant: Takuma Shimura ,  Takashi Akita ,  Osamu Shibata

    Inventor： Takuma Shimura ,  Takashi Akita ,  Osamu Shibata

    IPC: H04B3/00 ,  H05K1/02

    CPC classification number: H01B7/0838 ,  H01B7/0861 ,  H01B11/1091 ,  H04B3/02 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09718

    Abstract: A flexible cable is provided in which a transmission characteristic can be ensured in a high frequency band, and electromagnetic noises can be suppressed. A flexible cable 11 includes a sheet-like base member (dielectric substance) 1; an adhesive (dielectric substance) 2 which bonds the base member 1 to a cover member (dielectric substance) 3; a shield member 4 which covers the cover member 3 and is bonded or printed to the cover member 3 to suppress electromagnetic noises to be radiated; and a top coating member 5 which covers the shield member 4 to protect the shield member 4. The flexible cable 11 has a differential signal wire group 7 including differential signal wires 6 through which differential signals pass and guard ground wires 9a which prevent the interference from other differential signals; a low-speed signal wire 8 through which a low-speed signal passes; a ground wire 9 used as a ground; and a shield ground wire 10 which is adapted to allow the electric potential of the shield member 4 to be identical to the electric potential of the ground, all of which are provided in the adhesive 2. The differential signal wires 6 are not covered with the shield member 4.

    Abstract translation: 提供一种灵活的电缆，其中可以在高频带中确保传输特性，并且可以抑制电磁噪声。 柔性电缆11包括片状基体（电介质）1; 将基材1与盖部件（电介质）3接合的粘合剂（电介质）2; 遮盖构件4，其覆盖盖构件3，并且被接合或印刷到盖构件3，以抑制要辐射的电磁噪声; 以及覆盖屏蔽构件4以保护屏蔽构件4的顶部涂覆构件5.柔性电缆11具有差分信号线组7，差分信号线组7包括差分信号通过的差分信号线6，并且防止接地线9a防止干扰 其他差分信号; 低速信号通过的低速信号线8; 用作地面的地线9; 以及屏蔽接地线10，其适于使屏蔽构件4的电位与地面的电位相同，所有这些都设置在粘合剂2中。差分信号线6不被覆盖 屏蔽员4。

    CIRCUIT SUBSTRATE
    18.
    发明申请
    CIRCUIT SUBSTRATE 有权
    电路基板

    公开(公告)号：US20110199165A1

    公开(公告)日：2011-08-18

    申请号：US12760557

    申请日：2010-04-15

    Applicant: Ting-Hao Yeh

    Inventor： Ting-Hao Yeh

    IPC: H01P3/08

    CPC classification number: H05K1/025 ,  H05K2201/09354 ,  H05K2201/09672 ,  H05K2201/0979

    Abstract: A circuit substrate includes a first pair of ground lines, a second pair of ground lines, a plurality of first connection lines, a plurality of second connection lines and a plurality of conductive pillars. The first and second pairs of ground lines are located on first and second surfaces of the substrate, respecteively. The pillars are located in the substrate and vertically conducted between the first pair of ground lines and the second connection lines and between the second pair of ground lines and the first connection lines, and the first and second pairs of ground lines are conducted, so that a 3-D grounding circuit loop is formed. Moreover, a first pair of signal lines is disposed between the first connection lines for grounding and a second pair of signal lines is disposed between the second connection lines for grounding to get a better signal integrity.

    Abstract translation: 电路基板包括第一对接地线，第二对接地线，多个第一连接线，多个第二连接线和多个导电柱。 第一和第二对接地线相对于衬底的第一和第二表面上。 支柱位于基板中，并且在第一对接地线与第二连接线之间以及第二对接地线与第一连接线之间垂直传导，并且第一和第二对接地线被导通，使得 形成3-D接地电路回路。 此外，第一对信号线设置在用于接地的第一连接线之间，并且第二对信号线设置在第二连接线之间用于接地以获得更好的信号完整性。

    METHOD FOR FORMING AN INTEGRAL ELECTROMAGNETIC RADIATION SHIELD IN AN ELECTRONIC PACKAGE
    20.
    发明申请
    METHOD FOR FORMING AN INTEGRAL ELECTROMAGNETIC RADIATION SHIELD IN AN ELECTRONIC PACKAGE 有权
    在电子封装中形成整体电磁辐射屏蔽的方法

    公开(公告)号：US20100051343A1

    公开(公告)日：2010-03-04

    申请号：US12617577

    申请日：2009-11-12

    Applicant: Ken Lam

    Inventor： Ken Lam

    IPC: H05K9/00 ,  B05D5/12

    CPC classification number: H01L23/552 ,  H01L21/561 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/16 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09354 ,  H01L2924/00

    Abstract: A method and system for fabricating an integral electromagnetic radiation shield for an electronics package is disclosed. Various embodiments include exposing a portion of at least one ground contact feature in an electronic package by removing a portion of the electronic package above the at least one ground contact feature to form at least one trench above the at least one ground contact feature; depositing electromagnetic radiation shield material in the at least one trench to substantially fill the at least one trench with a trench deposit; and depositing additional electromagnetic radiation shield material over a substantial portion of the electronic package, wherein the electromagnetic radiation shield material in the trench and over the substantial portion of the electronic package form an integral electromagnetic radiation shield which is electrically connected to the at least one ground contact feature.

    Abstract translation: 公开了一种用于制造电子封装的集成电磁辐射屏蔽的方法和系统。 各种实施例包括通过去除至少一个接地接触特征之上的电子封装的一部分来暴露电子封装中的至少一个接地接触特征的一部分，以在至少一个接地接触特征之上形成至少一个沟槽; 在所述至少一个沟槽中沉积电磁辐射屏蔽材料以基本上填充所述至少一个具有沟槽沉积物的沟槽; 以及在所述电子封装的主要部分上沉积附加的电磁辐射屏蔽材料，其中所述沟槽中的电磁辐射屏蔽材料和所述电子封装的主要部分上的电磁辐射屏蔽材料形成电气连接到所述至少一个地面的整体电磁辐射屏蔽 联系方式。

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