公开(公告)号：US09838766B2

公开(公告)日：2017-12-05

申请号：US15004669

申请日：2016-01-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Il Nam Kim ,  Won Sang Park ,  Yi Joon Ahn ,  Byeong-Hee Won

IPC: H04R1/00 ,  H04R1/02 ,  G02B5/30 ,  H05K1/14

CPC classification number: H04R1/028 ,  G02B5/3033 ,  H04R1/025 ,  H04R2201/029 ,  H04R2499/15 ,  H05K1/147 ,  H05K2201/056 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: Provided is a speaker and microphone integrated display panel including: a display panel having a display area and a non-display area surrounding the display area; and a simultaneously convertible film type speaker or film type microphone which is mounted to correspond to an air hole in the non-display area, in which the display panel and the film type speaker or the film type microphone are at least partially integrated so as to be drive-connected.

公开(公告)号：US09781842B2

公开(公告)日：2017-10-03

申请号：US14142180

申请日：2013-12-27

Applicant: California Institute of Technology

Inventor： Yu-Chong Tai ,  Han-Chieh Chang

IPC: H01G2/12 ,  H05K3/40 ,  H01L23/31 ,  A61F9/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/4038 ,  A61F9/0017 ,  H01L23/3135 ,  H01L2224/73204 ,  H01L2924/0002 ,  H05K1/032 ,  H05K3/0041 ,  H05K3/281 ,  H05K3/282 ,  H05K3/284 ,  H05K3/285 ,  H05K3/381 ,  H05K2201/017 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/0139 ,  H05K2203/0514 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1338 ,  Y10T29/49165 ,  H01L2924/00

Abstract: The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

公开(公告)号：US09769934B2

公开(公告)日：2017-09-19

申请号：US14798859

申请日：2015-07-14

Applicant: Seiko Epson Corporation

Inventor： Tetsuro Miyao ,  Hideki Ishigami ,  Yukihiko Shiohara ,  Tetsuya Otsuki ,  Hidefumi Nakamura

IPC: B32B3/10 ,  H05K3/34 ,  H05K1/03

CPC classification number: H05K3/3463 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/0435 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package base includes a package base body and a bonding metal layer provided in a frame shape or a ring shape in plan view on the package base body, wherein the bonding metal layer contains a Ti—Ag—Cu-containing alloy and a metal belonging to Group 6 in the periodic table.

公开(公告)号：US20170219444A1

公开(公告)日：2017-08-03

申请号：US15417948

申请日：2017-01-27

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： MINSUNG KIM ,  THANHTIEN NGUYEN ,  KIJU IM

IPC: G01L1/22 ,  H01L27/32 ,  H05K1/02 ,  H01L41/09 ,  H05K1/18

CPC classification number: G01L1/2287 ,  G01L1/22 ,  G01L1/225 ,  G01L1/26 ,  G09F1/00 ,  H01L27/3225 ,  H01L27/3276 ,  H01L41/09 ,  H01L51/0097 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/10083 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: A display apparatus includes a substrate including a first area, a second area, and a bending area, the bending area disposed between the first area and the second area and bending about a bending axis running along a first direction; a first piezoelectric device disposed over the bending area; and a pressure sensor. The first piezoelectric device is configured to contract or expand according to a pressure variation sensed by the pressure sensor.

公开(公告)号：US09721599B2

公开(公告)日：2017-08-01

申请号：US14730557

申请日：2015-06-04

Applicant: NITTO DENKO CORPORATION

Inventor： Takatoshi Sakakura

IPC: H05K1/11 ,  H05K1/18 ,  G11B5/48 ,  H05K3/40 ,  H05K1/05

CPC classification number: G11B5/4853 ,  G11B5/483 ,  G11B5/486 ,  G11B5/4873 ,  H05K1/056 ,  H05K1/11 ,  H05K1/183 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/10083

Abstract: A suspension board with circuit includes a metal supporting board, an insulating base layer formed on one side of the metal supporting board in a thickness direction thereof, a conductive layer, and an insulating cover layer formed on the one side of the insulating base layer to cover the conductive layer. Either one of the insulating base layer and the insulating cover layer includes an opening extending therethrough in the thickness direction. The conductive layer includes a wire formed on the one side of the insulating base layer, and a connection terminal electrically connected to the wire and exposed from the opening to be capable of electrical connection to an electronic element. The suspension board with circuit further includes a protective layer for protecting the connection terminal exposed from the opening.

公开(公告)号：US09680445B2

公开(公告)日：2017-06-13

申请号：US14529394

申请日：2014-10-31

Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.

Inventor： Andrew Thomas Barfknecht ,  Klaus-Guenter Oppermann

IPC: H01L41/053 ,  H03H9/05 ,  H03H9/10 ,  H05K3/28

CPC classification number: H03H9/0523 ,  H03H9/059 ,  H03H9/1014 ,  H03H9/1071 ,  H05K3/284 ,  H05K2201/10083

Abstract: A device includes a substrate; a cavity package having a first surface attached to the substrate, the cavity package enclosing an electronic circuit; an elastic layer formed on a second surface of the cavity package, opposite the first surface; and a molding compound formed on the substrate, encasing the cavity package and the elastic layer. The elastic layer decouples stress between the cavity package and the molding compound encasing the cavity package, for maintaining structural integrity of the cavity package and for preventing separation of the cavity package from the substrate.

公开(公告)号：US20170164470A1

公开(公告)日：2017-06-08

申请号：US15368862

申请日：2016-12-05

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshito FUJIMURA

IPC: H05K1/05 ,  G11B5/48 ,  H05K1/18 ,  H05K3/00 ,  H05K1/11 ,  H05K1/03

CPC classification number: H05K1/056 ,  G11B5/483 ,  G11B5/4853 ,  H05K1/0313 ,  H05K1/111 ,  H05K1/181 ,  H05K3/0023 ,  H05K2201/10083

Abstract: A suspension board with circuit includes a metal supporting board, a conductor layer having a terminal capable of being electrically connected to the piezoelectric element and disposed above the metal supporting board at spaced intervals thereto, a first insulating layer disposed between the metal supporting board and the conductor layer so as to support the conductor layer, and a second insulating layer disposed on the first insulating layer and the conductor layer so as to expose the terminal. The first insulating layer includes a first portion including the terminal viewed from a thickness direction of the metal supporting board and a second portion disposed in a position different from that of the first portion viewed from the thickness direction. The thickness of the first portion is thinner than that of the second portion.

公开(公告)号：US09635769B2

公开(公告)日：2017-04-25

申请号：US13858279

申请日：2013-04-08

Applicant: Seiko Epson Corporation

Inventor： Yukihiro Hashi

IPC: H05K5/00 ,  H05K3/10 ,  H05K1/11 ,  H05K1/18 ,  H05K3/34 ,  H05K1/02 ,  H05K3/24 ,  H05K3/32

CPC classification number: H05K5/0091 ,  H01L2924/16152 ,  H01L2924/16195 ,  H05K1/0284 ,  H05K1/111 ,  H05K1/183 ,  H05K3/10 ,  H05K3/108 ,  H05K3/243 ,  H05K3/321 ,  H05K3/3494 ,  H05K2201/10083 ,  H05K2201/10371 ,  H05K2203/107 ,  Y02P70/611 ,  Y10T29/49155

Abstract: An electronic device has a package and a piezoelectric element accommodated in an accommodating space formed inside the package. The package has a frame-like metallization layer bonding a base substrate and a lid together and electrodes formed on and in the base substrate and electrically connected with the piezoelectric element. The metallization layer is insulated from the electrodes.

公开(公告)号：US09578217B2

公开(公告)日：2017-02-21

申请号：US14692662

申请日：2015-04-21

Applicant: MEMS DRIVE, INC.

Inventor： Roman Gutierrez ,  Guiqin Wang ,  Xiaolei Liu

IPC: H04N5/228 ,  H04N5/225 ,  H05K1/18

CPC classification number: H04N5/2253 ,  H05K1/182 ,  H05K2201/10083 ,  H05K2201/10121 ,  Y10T29/4913

Abstract: A moving image sensor package is provided that may be used to provide optical image stabilization (OIS) in the same form factor as non-OIS enabled image sensors utilized in portable/mobile devices. The moving image sensor package includes an image sensor attached to a MEMS actuator mounted within a cutout in a circuit board, wherein the MEMS actuator has substantially the same thickness as the circuit board.

Abstract translation: 提供了一种运动图像传感器封装，其可用于以与便携式/移动设备中使用的非OIS启用的图像传感器相同的形状因数提供光学图像稳定（OIS）。 运动图像传感器封装包括附接到安装在电路板中的切口内的MEMS致动器的图像传感器，其中MEMS致动器具有与电路板基本相同的厚度。

公开(公告)号：US09561657B2

公开(公告)日：2017-02-07

申请号：US15138997

申请日：2016-04-26

Applicant: STMicroelectronics, Inc. ,  STMicroelectronics S.r.l. ,  STMicroelectronics Asia Pacific Pte Ltd

Inventor： Simon Dodd ,  Joe Scheffelin ,  Dana Gruenbacher ,  Roberto Brioschi ,  Teck Khim Neo ,  Dave Hunt ,  Faiz Sherman

IPC: B41J2/14 ,  B41J2/175 ,  B41J2/16 ,  B05B15/00 ,  B05B1/14 ,  H01L23/00 ,  H05K3/30 ,  H01L41/113 ,  H05K1/02 ,  H05K1/09 ,  B05B11/00 ,  H05K1/18

CPC classification number: B41J2/1623 ,  B05B1/14 ,  B05B11/0054 ,  B05B15/40 ,  B41J2/14024 ,  B41J2/14145 ,  B41J2/1433 ,  B41J2/162 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L41/1132 ,  H01L2224/2732 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48096 ,  H01L2224/48097 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/19106 ,  H05K1/0272 ,  H05K1/09 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/10083 ,  H05K2201/10515 ,  H05K2201/10545 ,  Y02P70/613 ,  Y10T156/1089 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Embodiments are directed to microfluidic refill cartridges and methods of assembling same. The microfluidic refill cartridges include a microfluidic delivery member that includes a filter for filtering fluid passed therethrough. The filter may be configured to block particles above a threshold size to prevent blockage in the nozzles. For instance, particles having a dimension that is larger than the diameter of the nozzles can block or reduce fluid flow through the nozzle.

Abstract translation: 实施例涉及微流体补充盒及其组装方法。 微流体补充盒包括微流体递送构件，其包括用于过滤通过其中的流体的过滤器。 过滤器可以被配置为阻挡高于阈值尺寸的颗粒以防止喷嘴中的堵塞。 例如，具有大于喷嘴直径的尺寸的颗粒可以阻挡或减少通过喷嘴的流体流动。