公开(公告)号：US08125790B2

公开(公告)日：2012-02-28

申请号：US12197309

申请日：2008-08-24

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H05K7/10

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  H01L23/49555 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00013 ,  H05K1/111 ,  H05K3/3426 ,  H05K3/3436 ,  H05K2201/09418 ,  H05K2201/09781 ,  H05K2201/10234 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/2036 ,  H05K2203/0182 ,  H05K2203/0415 ,  H05K2203/0465 ,  H05K2203/048 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49117 ,  H01L2224/29099 ,  H01L2224/05647 ,  H01L2924/00014

Abstract: The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environmental conditions such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.

Abstract translation: 本发明公开了可用于增强电子设备的可靠性和延长使用寿命的设计概念和方法和方法，以及包含这种设备的组件以及衬底和/或PCB，特别是如果这样的组件暴露于恶劣的环境条件 作为热循环或动力循环。 本发明的主要目的是在附接的部件之间提供诸如柱之类的柔性接头，并且优选地定向这些接头，使得它们向组件的热中心或固定点呈现其最柔软的弯曲方向。 具有矩形或细长横截面的接头是优选的，并且它们应该被定向成使得每个接头的宽面将面向热中心，垂直于从热中心朝向每个相应接头的中心发出的热变形射线。 这些概念同样适用于无引线封装以及引线封装。

公开(公告)号：US08033877B2

公开(公告)日：2011-10-11

申请号：US12506974

申请日：2009-07-21

Applicant: Thomas H. Di Stefano

Inventor： Thomas H. Di Stefano

IPC: H01R11/22

CPC classification number: H05K3/32 ,  H01R12/52 ,  H01R13/11 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2201/10734 ,  Y02P70/613

Abstract: One embodiment is a connector for making electrical connection to a bulbous terminal, the connector including: a metal tube with a cylindrical wall extending from a mating end, wherein: (a) two or more slots perforate the wall and extend from the mating end along the tube; (b) two or more apertures perforate the wall and are disposed in a circumferential array disposed a distance from the mating end; and (c) each of the two or more slots transects one of the two or more apertures to divide the mating end of the tube into resilient prongs.

Abstract translation: 一个实施例是用于与球根端子进行电连接的连接器，该连接器包括：金属管，其具有从配合端延伸的圆柱形壁，其中：（a）两个或更多个狭缝在壁上穿孔并从配合端沿着 管子 （b）两个或更多个孔穿过该壁并设置在与配合端一定距离设置的圆周阵列中; 和（c）两个或更多个槽中的每一个横切两个或更多个孔中的一个，以将管的配合端分成弹性插脚。

公开(公告)号：US20110095431A1

公开(公告)日：2011-04-28

申请号：US12984707

申请日：2011-01-05

Applicant: Bruce K. Furman ,  Jae-Woong Nah

Inventor： Bruce K. Furman ,  Jae-Woong Nah

IPC: H01L23/52

CPC classification number: H01L21/6835 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10734 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2224/13099

Abstract: An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.

Abstract translation: 一种电气结构和形成方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构和第一焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 非焊接金属芯结构的第二部分被热压接合到第二导电焊盘。

公开(公告)号：US20100270364A1

公开(公告)日：2010-10-28

申请号：US12833191

申请日：2010-07-09

Applicant: Hideaki SAKAGUCHI ,  Kiyoaki IIDA

Inventor： Hideaki SAKAGUCHI ,  Kiyoaki IIDA

IPC: B23K1/20

CPC classification number: H01L24/742 ,  B23K3/0623 ,  B23K2101/36 ,  H01L21/4853 ,  H01L24/13 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13561 ,  H01L2224/1358 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2201/083 ,  H05K2201/10234 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/104 ,  H01L2924/014 ,  H01L2224/05599

Abstract: An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided.

Abstract translation: 用于布置磁性焊球的装置包括：用于在其上放置和固定基板的台; 磁体，其被并入所述平台中并且可与所述放置和固定的基板的下表面平行移动，以使磁力沿所述平台的向上方向作用; 以及能够定位在舞台上方的面罩框架。 还提供了一种使用该布置装置的布置方法。 用于布置磁性焊球的装置包括：用于在其上放置和固定基板的台; 能够定位在舞台上方的面罩框架; 以及可在掩模框架上方移动并使磁力作用在台架上的磁性发生器。 还提供了一种使用该布置装置的布置方法。

公开(公告)号：US07755200B2

公开(公告)日：2010-07-13

申请号：US12210920

申请日：2008-09-15

Applicant: Hau Nguyen

Inventor： Hau Nguyen

IPC: H01L23/48

CPC classification number: B23K3/0623 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/302 ,  B23K2101/40 ,  H05K3/3436 ,  H05K2201/10234 ,  H05K2201/10257 ,  Y02P70/613 ,  Y10T428/24612

Abstract: The present invention relates to methods and arrangements for forming a solder joint connection. One embodiment involves an improved solder ball. The solder ball includes a perforated, metallic shell with an internal opening. Solder material encases the shell and fills its internal opening. The solder ball may be applied to an electrical device, such as an integrated circuit die, to form a solder bump on the device. The solder bump in turn can be used to form an improved solder joint connection between the device and a suitable substrate, such as a printed circuit board. In some applications, a solder joint connection is formed without requiring the application of additional solder material to the surface of the substrate. The present invention also includes different solder bump arrangements and methods for using such arrangements to form solder joint connections between devices and substrates.

Abstract translation: 本发明涉及形成焊点连接的方法和装置。 一个实施例涉及一种改进的焊球。 焊球包括具有内部开口的穿孔金属外壳。 焊接材料包住外壳并填充其内部开口。 焊球可以被施加到诸如集成电路管芯的电气装置上，以在器件上形成焊料凸块。 焊料凸点又可用于在器件和合适的衬底（例如印刷电路板）之间形成改进的焊点连接。 在一些应用中，形成焊接接头，而不需要向衬底的表面施加额外的焊料。 本发明还包括不同的焊料凸块布置和使用这种布置来形成器件和衬底之间的焊接连接的方法。

公开(公告)号：US20100163289A1

公开(公告)日：2010-07-01

申请号：US12645191

申请日：2009-12-22

Applicant: Shoji ITO ,  Tomofumi Kitada ,  Tadanori Ominato

Inventor： Shoji ITO ,  Tomofumi Kitada ,  Tadanori Ominato

IPC: H05K1/02 ,  B29C65/00 ,  B29C65/48 ,  H05K1/11

CPC classification number: H05K3/4015 ,  B29C65/48 ,  B29C65/4815 ,  B29C65/483 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/472 ,  B29C66/474 ,  B29C66/8322 ,  B29K2027/18 ,  B29K2063/00 ,  B29K2077/10 ,  B29K2079/08 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2305/10 ,  B29K2305/14 ,  B29K2995/0005 ,  B29L2009/003 ,  B29L2031/3425 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/281 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/1189 ,  Y10T156/10

Abstract: A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.

Abstract translation: 一种印刷线路板，包括：绝缘基板; 设置在该绝缘基板一侧的导电电路; 覆盖绝缘基板和导电电路的覆盖层; 以及埋置在该覆盖层中的导电性粒子，其中，导电粒子被掩埋在覆盖层中，使得导电粒子与导电电路接触并从覆盖层突出; 并且导电粒子用作电接触点。

公开(公告)号：US20100096168A1

公开(公告)日：2010-04-22

申请号：US12626293

申请日：2009-11-25

Applicant: Tomonari Ohtsuki ,  Yasue Yamazaki ,  Hirofumi Daimon ,  Kozo Matsuo ,  Sachi Takami

Inventor： Tomonari Ohtsuki ,  Yasue Yamazaki ,  Hirofumi Daimon ,  Kozo Matsuo ,  Sachi Takami

IPC: H05K1/00

CPC classification number: C25D5/022 ,  B23K26/0661 ,  C25D5/10 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/002 ,  H05K3/0032 ,  H05K3/061 ,  H05K3/321 ,  H05K3/326 ,  H05K3/368 ,  H05K3/4015 ,  H05K3/42 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09081 ,  H05K2201/091 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2201/10234 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2203/0554 ,  H05K2203/0557 ,  H05K2203/0789 ,  H05K2203/0793 ,  Y10T29/49165 ,  Y10T29/49224 ,  H01L2924/00012

Abstract: A board consisting of a polyimide layer and copper foils is worked from one direction by etching to form through-holes, and the copper foils and inside of the through-holes are plated with copper, or the board is worked by etching or laser machining to form blind holes to expose the copper foils on the other side and through-holes simultaneously, and copper foils and insides of the blind holes and the through-holes are plated with copper. A metal ball plated with a noble metal is fixed on the copper foil by solidification of a metal paste to form an electric contact. Two superimposed plastic sheets are formed with holes each having a projection on inner wall of the hole, thereby vertically holding conductors by the projections of the holes of the superimposed plastic sheets. A laser beam machining method fabricates grooves or slits in a workpiece.

Abstract translation: 由聚酰亚胺层和铜箔构成的板通过蚀刻从一个方向加工形成通孔，铜箔和通孔内部镀有铜，或者通过蚀刻或激光加工对板进行加工 形成盲孔以同时露出另一侧的铜箔和通孔，盲孔和铜箔的铜箔和通孔用铜电镀。 镀有贵金属的金属球通过金属糊固化形成电接触而固定在铜箔上。 两个叠加的塑料片形成有孔，每个孔在孔的内壁上具有突起，由此通过叠加的塑料片的孔的突起垂直地保持导体。 激光束加工方法在工件中制造槽或狭缝。

公开(公告)号：US20100065962A1

公开(公告)日：2010-03-18

申请号：US12624622

申请日：2009-11-24

Applicant: Reinhold Bayerer ,  Thomas Hunger

Inventor： Reinhold Bayerer ,  Thomas Hunger

IPC: H01L23/15 ,  H05K1/03 ,  H05K3/10

CPC classification number: H01L23/3735 ,  H01L23/3731 ,  H01L23/3736 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/072 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/48699 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83825 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0256 ,  H05K1/0306 ,  H05K1/053 ,  H05K3/4046 ,  H05K3/4061 ,  H05K3/44 ,  H05K3/462 ,  H05K3/4629 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2201/0379 ,  H05K2201/09145 ,  H05K2201/09554 ,  H05K2201/09845 ,  H05K2201/10234 ,  H01L2224/8382 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2224/83205 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor module includes a multilayer substrate. The multilayer substrate includes a first metal layer and a first ceramic layer over the first metal layer. An edge of the first ceramic layer extends beyond an edge of the first metal layer. The multilayer substrate includes a second metal layer over the first ceramic layer and a second ceramic layer over the second metal layer. An edge of the second ceramic layer extends beyond an edge of the second metal layer. The multilayer substrate includes a third metal layer over the second ceramic layer.

Abstract translation: 半导体模块包括多层基板。 多层基板包括第一金属层和第一金属层上的第一陶瓷层。 第一陶瓷层的边缘延伸超过第一金属层的边缘。 多层基板包括在第一陶瓷层之上的第二金属层和在第二金属层上的第二陶瓷层。 第二陶瓷层的边缘延伸超过第二金属层的边缘。 多层基板包括在第二陶瓷层上的第三金属层。

公开(公告)号：US07624501B2

公开(公告)日：2009-12-01

申请号：US12068270

申请日：2008-02-05

Applicant: Yoshihiro Machida

Inventor： Yoshihiro Machida

IPC: H05K3/10

CPC classification number: H05K3/462 ,  H05K3/4647 ,  H05K2201/10234 ,  H05K2203/063 ,  H05K2203/0733 ,  H05K2203/1327 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: First, a plurality of wiring boards are fabricated at separate steps. The first wiring board includes a Cu post formed on a wiring layer on one surface of a substrate, and a first stopper layer formed at a desired position around the Cu post. The second wiring board includes a through hole for insertion of the Cu post therethrough, a connection terminal formed on a wiring layer on one surface of a substrate, and a second stopper layer that engages the first stopper layer and functions to suppress in-plane misalignment. The third wiring board includes a connection terminal formed on a wiring layer on one surface of a substrate. Then, the wiring boards are stacked up, as aligned with one another so that the wiring layers are interconnected via the Cu post and the connection terminals, to thereby electrically connect the wiring boards. Thereafter, resin is filled into gaps between the wiring boards.

Abstract translation: 首先，以分开的步骤制造多个布线板。 第一布线板包括形成在基板的一个表面上的布线层上的Cu柱和形成在Cu柱周围的期望位置的第一阻挡层。 第二布线板包括用于插入Cu柱的通孔，形成在基板的一个表面上的布线层上的连接端子和与第一阻挡层接合并用于抑制面内未对准的功能的第二阻挡层 。 第三布线板包括形成在基板的一个表面上的布线层上的连接端子。 然后，将布线基板彼此对准地堆叠起来，使得布线层经由铜柱和连接端子互连，从而电连接布线板。 此后，将树脂填充到布线板之间的间隙中。

公开(公告)号：US20090080111A1

公开(公告)日：2009-03-26

申请号：US11902253

申请日：2007-09-20

Applicant: MingGao Yao ,  YiRu Xie

Inventor： MingGao Yao ,  YiRu Xie

IPC: G11B5/60

CPC classification number: G11B5/4853 ,  G11B5/483 ,  H05K3/328 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/058 ,  H05K2201/10234

Abstract: The present bonded structure uses metal ball to bond or weld the respective bonding surfaces of electrical pads which are arranged to face the same direction. The structure can be controlled visually and thus enables a high connection quality of no short circuit. In addition, the bonding operation of the bonded structure is carried out without using pressure, thus it will not damage surroundings of the electrical components. Accordingly, the manufacture yield is significantly improved and the cost is prominently reduced. The present invention also discloses a bonding method and a head gimbal assembly and a head stack assembly and a drive unit using the bonded structure.

Abstract translation: 本发明的接合结构使用金属球来接合或焊接被设置为面向相同方向的电焊盘的各个接合表面。 该结构可以视觉控制，从而实现无短路的高连接质量。 此外，接合结构的接合操作在不使用压力的情况下进行，因此不会损坏电气部件的周围环境。 因此，制造成品率显着提高，成本显着降低。 本发明还公开了一种接合方法和头部万向节组件以及使用该结合结构的磁头组合组件和驱动单元。