公开(公告)号：US20230180382A1

公开(公告)日：2023-06-08

申请号：US17577359

申请日：2022-01-17

Applicant: Unimicron Technology Corp.

Inventor： Chun-Lin LIAO ,  Pei-Chang HUANG

IPC: H05K1/02

CPC classification number: H05K1/0272 ,  H05K2201/10371 ,  H05K2201/0116

Abstract: A circuit board includes an insulation part, a support layer disposed on the insulation part, a metal case disposed in the insulation part, a heat-exchanging fluid distributed within the enclosed space, and a first porous material distributed within the enclosed space. The metal case is thermally coupled to the support layer and includes a first inner surface, a second inner surface opposite to the first inner surface and positioned between the first inner surface and the support layer, a third inner surface connecting the first inner surface and the second inner surface, and an enclosed space surrounded by the first inner surface, the second inner surface and the third inner surface. The first porous material is disposed on the first inner surface.

公开(公告)号：US20230180380A1

公开(公告)日：2023-06-08

申请号：US17956974

申请日：2022-09-30

Applicant: Qorvo US, Inc.

Inventor： Loizos Loizou ,  Domingo Farias ,  Vincenzo DiTommaso ,  Jean Briot

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0225 ,  H05K1/0296 ,  H05K1/181 ,  H05K2201/10371 ,  H05K2201/1006

Abstract: A module includes discontinuities, such as openings or slots, between regions of a conductive shield that correspond to circuits on a substrate. The discontinuities are provided to perturb current flow between the regions to reduce coupling between the circuits. The circuits may be transmit (TX) circuits and receive (RX) circuits, including acoustic filters on a printed circuit board.

公开(公告)号：US20230160946A1

公开(公告)日：2023-05-25

申请号：US17982266

申请日：2022-11-07

Applicant: Newpowerplasma Co., Ltd.

Inventor： Jinjoong KIM ,  Donggeun NOH

IPC: G01R31/28 ,  H05K1/02

CPC classification number: G01R31/2818 ,  H05K1/0237 ,  H05K2201/1003 ,  H05K2201/10022 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10371 ,  H05K2201/10409

Abstract: A module type sensor includes a casing including a casing upper surface, a first casing side surface which is bent downward from the casing upper surface and has a lower end upwardly separated from a path through which a transmission line passes, and a second casing side surface which is bent downward from the casing upper surface and has a fixing bracket extending by being outwardly bent; a body unit fixedly installed inside the casing, formed of an insulator, supported by the printed circuit board at a lower end, and having, at a center, an opening which is open toward the transmission line; and a sensing substrate unit fixedly installed on an upper portion of the body unit, and including a voltage sensing circuit which is capacitively coupled to the transmission line exposed through the opening and a current sensing circuit which is inductively coupled to the transmission line.

公开(公告)号：US20190254200A1

公开(公告)日：2019-08-15

申请号：US16386947

申请日：2019-04-17

Applicant: Microsoft Technology Licensing, LLC

Inventor： Kurt Allen Jenkins ,  Gary Russell McClary ,  Lincoln Matthew Ghioni

IPC: H05K9/00 ,  H05K1/11 ,  H05K1/02 ,  H05K1/16 ,  H05K3/10 ,  H01L23/552 ,  H05K1/18

CPC classification number: H05K9/0032 ,  B29C64/10 ,  B33Y10/00 ,  B33Y80/00 ,  H01L23/552 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/111 ,  H05K1/115 ,  H05K1/16 ,  H05K1/181 ,  H05K3/10 ,  H05K9/0024 ,  H05K2201/10098 ,  H05K2201/10128 ,  H05K2201/10371 ,  H05K2201/2018 ,  H05K2203/107

Abstract: Printed circuit boards include conductive metallic paths, such as vias, traces, and pads on the printed circuit board. One or more metal additive structures are additively manufactured onto the printed circuit boards in a manner that forms a continuous weld with at least one of the conductive metallic paths. As a result, the metal additive structures are continuous with the printed circuit board and do not require separate attachment mechanisms (e.g., soldering or mechanical fastening). The metal additive structures may include shield cans, frames, antennas, or heat sinks for the printed circuit board, for example.

公开(公告)号：US20190252756A1

公开(公告)日：2019-08-15

申请号：US16188709

申请日：2018-11-13

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Gye Won LEE ,  Nam Gyun YIM ,  Eun Bae PARK ,  Hong Seok LEE ,  Jong Yun KIM ,  Woo Sung JUNG ,  Mi Jung KIM ,  Chang Ju LEE ,  Hee Sun OH

IPC: H01Q1/02 ,  H01Q1/28 ,  H01Q1/42 ,  H01Q9/04

CPC classification number: H01L23/10 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/552 ,  H01L24/29 ,  H05K1/021 ,  H05K1/0216 ,  H05K1/141 ,  H05K2201/10371

Abstract: A module substrate includes a module substrate including a plurality of external connection electrodes disposed on a second surface thereof; communication elements mounted on the module substrate, the communication elements including one or more first communication elements mounted on a first surface of the module substrate and one or more second communication elements mounted on the second surface of the module substrate; a first heat radiation frame mounted on the first surface of the module substrate and configured to accommodate at least one of the one or more first communication elements; and a second heat radiation frame mounted on the second surface of the module substrate and configured to accommodate at least one of the one or more second communication elements. One or more of the external connection electrodes are disposed around the second heat radiation frame.

公开(公告)号：US20190098803A1

公开(公告)日：2019-03-28

申请号：US16141898

申请日：2018-09-25

Applicant: Audio Precision, Inc,

Inventor： William Bunnell ,  Fredrick Capell, JR. ,  William Noelcke

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/0032 ,  H05K1/0216 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: Apparatuses, systems and methods associated isolation to avoid interference from wireless signals in a circuit assembly are disclosed herein. In embodiments, a wireless signal isolation assembly may include an outer shield enclosure, the outer shield enclosure to enclose circuitry of a circuit board that is to be isolated from interference, wherein the outer shield enclosure is to attenuate wireless signals. The wireless signal isolation assembly may further include a first inner shield enclosure located within the outer shield enclosure, the first inner shield enclosure to enclose first circuitry, wherein the first inner shield enclosure is to attenuate wireless signals. The wireless signal isolation assembly may further include a second inner shield enclosure located within the outer shield enclosure, the second inner shield enclosure to enclose second circuitry, wherein the second inner shield enclosure is to attenuate wireless signals. Other embodiments may be described and/or claimed.

公开(公告)号：US20180350757A1

公开(公告)日：2018-12-06

申请号：US16045880

申请日：2018-07-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： James A. BUSBY ,  Silvio DRAGONE ,  Michael A. GAYNES ,  Kenneth P. RODBELL ,  William SANTIAGO-FERNANDEZ

IPC: H01L23/00 ,  H05K3/30 ,  H01L21/48 ,  H01L23/08 ,  H05K1/03 ,  H05K1/18 ,  G06F21/87 ,  H01L23/053

CPC classification number: H01L23/576 ,  G06F21/87 ,  H01L21/4803 ,  H01L23/053 ,  H01L23/08 ,  H01L23/573 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/8385 ,  H01L2924/0665 ,  H01L2924/1434 ,  H01L2924/15192 ,  H01L2924/16251 ,  H01L2924/16588 ,  H05K1/0275 ,  H05K1/0284 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/303 ,  H05K3/46 ,  H05K2201/09036 ,  H05K2201/0999 ,  H05K2201/10159 ,  H05K2201/10371

Abstract: Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).

公开(公告)号：US20180350751A1

公开(公告)日：2018-12-06

申请号：US15973541

申请日：2018-05-08

Applicant: MEDIATEK INC.

Inventor： Ruey-Bo Sun ,  Wen-Chou Wu

IPC: H01L23/552 ,  H01L23/373 ,  H01L23/06 ,  H01L23/64 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L23/552 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/0216 ,  H05K7/20454 ,  H05K9/0032 ,  H05K2201/09972 ,  H05K2201/10371 ,  H05K2201/1056

Abstract: A microelectronic assembly includes a substrate and a first microelectronic component mounted on the substrate. The first microelectronic component includes a digital/analog IP block and a RF IP block. A shielding case is mounted on the substrate. The shielding case includes a plurality of sidewalls, one intermediate wall, and a lid. A thermal interface material (TIM) layer is situated between the lid and the first microelectronic component. A noise suppressing structure is interposed between the TIM layer and the first microelectronic component.

公开(公告)号：US20180338395A1

公开(公告)日：2018-11-22

申请号：US15540247

申请日：2016-11-28

Applicant: Gan CHEN

Inventor： Gan CHEN

IPC: H05K9/00

CPC classification number: H05K9/0032 ,  H05K1/181 ,  H05K2201/10371 ,  H05K2201/10424

Abstract: Disclosed is a shielding case frame. The shielding case frame comprises a frame main body and a suction structure connected with the frame main body through at least one precut structure, wherein the precut structure comprises extension parts arranged on the suction structure, a pressing part connected with the extension parts, and a precut part; the pressing part is connected with the frame main body through the precut part, and the bottom surface or/and the top surface of the precut part is provided with a precut groove. The suction structure can be removed rapidly and conveniently by pressing the pressing parts with fingers without a special tool; the structure is simple, machining is convenient, and production cost is low; the shielding case frame is high in overall strength and not prone to deformation.

公开(公告)号：US20180310441A1

公开(公告)日：2018-10-25

申请号：US15847947

申请日：2017-12-20

Applicant: Chin-Hsien Chang ,  Shang-Chu Chien ,  Ting-Tuan Chang ,  Chi-Chu Chen

Inventor： Chin-Hsien Chang ,  Shang-Chu Chien ,  Ting-Tuan Chang ,  Chi-Chu Chen

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K9/0024 ,  H05K1/0243 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10371

Abstract: An electronic assembly with RFI shielding including a circuit board, a high frequency electromagnetic radiation device, and a shielding cover is provided. The circuit board includes a connector. The high frequency electromagnetic radiation device is detachably inserted to the connector of the circuit board to be electrically connected with the circuit board. The shielding cover is detachably assembled to the connector to be opened or closed relative to the circuit board. The shielding cover shields high frequency radiation generated by the high frequency electromagnetic radiation device when the shielding cover is in a closed state, and at least a portion of the shielding cover contacts the circuit board in the closed state, and the shielding cover is electrically connected to a grounding portion of the circuit board via the connector.