Method for producing conductive segment
    23.
    发明授权
    Method for producing conductive segment 有权
    导电段的制造方法

    公开(公告)号:US09157783B2

    公开(公告)日:2015-10-13

    申请号:US13555396

    申请日:2012-07-23

    Abstract: A method for producing a conductive segment, includes: a step of printing a metal conductive paste on a substrate, and drying the paste; a step of printing other metal conductive paste on the metal conductive paste after drying, and drying the paste; and a step of burning the metal conductive paste after drying and the other metal conductive paste after drying, wherein the conductive metal paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd), and the other metal conductive paste is an Au conductive paste comprising gold (Au) as a main component; or the metal conductive paste is an Au conductive paste comprising gold (Au) as a main component, and the other metal conductive paste is an Ag—Pd conductive paste comprising silver (Ag) and palladium (Pd).

    Abstract translation: 一种导电段的制造方法,其特征在于,包括:在基板上印刷金属导电性糊剂,干燥所述糊料的工序; 干燥后在金属导电糊上印刷其它金属导电糊的步骤,干燥糊剂; 干燥后的金属导电糊的烧成工序和干燥后的其他金属导电膏,其特征在于,所述导电性金属糊是包含银(Ag)和钯(Pd)的Ag-Pd导电性膏,另一方的金属导电膏为 包含金(Au)作为主要成分的Au导电膏; 或金属导电浆料是以金(Au)为主要成分的Au导电膏,另一种金属导电膏为包含银(Ag)和钯(Pd)的Ag-Pd导电糊。

    Multilayer film and method for producing the same
    30.
    发明授权
    Multilayer film and method for producing the same 有权
    多层膜及其制造方法

    公开(公告)号:US08986828B2

    公开(公告)日:2015-03-24

    申请号:US13202064

    申请日:2010-02-16

    Abstract: A multilayer film (10) is provided with a hard coat layer (12) and a film base (11) formed from a polymer compound. A heat shrinkage factor of the film base (11) (170° C., 10 minutes) is in a range from 0.05% to 3.0%. The hard coat layer (12) is formed by applying a coating liquid (33) containing a compound represented by a general formula (1), tetraalkoxysilane, acid water with pH in a range from 2 to 6, and a water-soluble hardening agent. An amount of the acid water is in a range from 60 to 2000 pts. wt. relative to a total amount 100 pts. wt. of the compound represented by the general formula (1) and tetraalkoxysilane. In the general formula (1), “R1” is an organic group having 1 to 15 carbons and containing no amino group. “R2” is a methyl group or ethyl group, “R3” is an alkyl group having 1 to 3 carbons, and “n” is zero or 1. (1) R1R2nSi(OR3)3-n.

    Abstract translation: 多层膜(10)具有由高分子化合物形成的硬涂层(12)和薄膜基材(11)。 膜基(11)(170℃,10分钟)的热收缩率在0.05%〜3.0%的范围内。 硬涂层(12)通过涂布含有通式(1)表示的化合物,四烷氧基硅烷,pH为2〜6的酸性水和水溶性硬化剂 。 酸水的量在60〜2000点的范围内。 重量 相对于总计100点。 重量 的由通式(1)表示的化合物和四烷氧基硅烷。 通式(1)中,“R1”为碳原子数1〜15的不含氨基的有机基团。 “R2”为甲基或乙基,“R3”为碳数1〜3的烷基,“n”为0或1.(1)R1R2nSi(OR3)3-n。

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