公开(公告)号：US20160333194A1

公开(公告)日：2016-11-17

申请号：US14710216

申请日：2015-05-12

Applicant: GM Global Technology Operations LLC

Inventor： Herman K. PHLEGM ,  Mahmoud H. ABD ELHAMID ,  Edgar P. CALDERON ,  Sami A. SYED

IPC: C09D5/18 ,  H05K3/28

CPC classification number: C09D5/185 ,  H05K3/284 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/10181

Abstract: A coated electronic device that is fire resistant includes an electronic component and an intumescent layer disposed over the electronic component. The intumescent layer includes sodium silicate having formula Na2SiO3, pentaerythitol, a resin that is cross-linked by melamine, boron nitride particles, and triammonium phosphate.

Abstract translation: 耐火涂层的电子设备包括电子部件和布置在电子部件上的膨胀层。 膨胀层包括具有式Na2SiO3的硅酸钠，季戊四醇，通过三聚氰胺交联的树脂，氮化硼颗粒和磷酸三铵。

公开(公告)号：US20160323998A1

公开(公告)日：2016-11-03

申请号：US14698635

申请日：2015-04-28

Applicant: Fameson Technology Co., Ltd.

Inventor： Rong-Seng CHANG

IPC: H05K1/03

CPC classification number: H05K1/0373 ,  H05K3/424 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0792 ,  H05K2201/093

Abstract: The present invention proposes substrate material favoring via hole electroplating to overcome the conventional problem that the polymer-based printed circuit board is hard to conduct electricity and likely to have poor electroplating quality. The present invention adds a conductive material to a polymeric material and controls the proportions and structure thereof to form a substrate material so as to improve the affinity of the substrate material to the metal electroplated inside the via hole with the resistance of the substrate material remaining in an allowable range. Thereby is increased yield and efficiency and saved time and cost in fabricating printed circuit boards. Further, the present invention reduces the proportion of the polymeric material with the mechanical strength remaining in an allowable range so as to decrease the overall expansion rate and obtain a fire-proof effect. Therefore, the substrate material can be used to fabricate precision products.

Abstract translation: 本发明提出了有利于通孔电镀的基板材料，以克服聚合物基印刷电路板难以导电并且可能具有差的电镀质量的常规问题。 本发明将导电材料添加到聚合物材料中并控制其比例和结构以形成基底材料，以便提高衬底材料对通孔内部电镀的金属的亲和性，其中衬底材料的电阻保持在 允许范围。 从而提高了产量和效率，并节省了制造印刷电路板的时间和成本。 此外，本发明将机械强度保持在容许范围内的聚合物材料的比例降低，从而降低整体膨胀率并获得防火效果。 因此，基板材料可用于制造精密产品。

公开(公告)号：US20160319129A1

公开(公告)日：2016-11-03

申请号：US15105301

申请日：2014-12-17

Applicant: BLUE CUBE IP LLC

Inventor： Xiaomei Song ,  Hongyu Chen ,  Tianhui Xiao ,  Yonghua Gong ,  Michael J. Mullins

IPC: C08L71/12 ,  H05K1/03 ,  C08L25/10 ,  C09D125/10 ,  C09D171/12 ,  C08J5/24

CPC classification number: C08L71/126 ,  C08J5/24 ,  C08J2309/06 ,  C08J2363/04 ,  C08J2371/12 ,  C08J2409/06 ,  C08J2471/12 ,  C08L9/06 ,  C08L25/10 ,  C08L2201/02 ,  C08L2203/20 ,  C09D125/10 ,  C09D171/12 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/012 ,  C08L71/12 ,  C08L63/04 ,  C08L63/00

Abstract: A composition comprising: a) a vinyl poly(phenylene) ether; b) a styrene-butadiene copolymer; c) optionally a vinyl-benzyl ether of napthol novolac; and d) a free radical initiator, a method for making the composition, and end uses for the composition are disclosed.

Abstract translation: 一种组合物，其包含：a）乙烯基聚（亚苯基）醚; b）苯乙烯 - 丁二烯共聚物; c）任选的萘酚酚醛清漆的乙烯基 - 苄基醚; 和d）公开了一种自由基引发剂，该组合物的制备方法和该组合物的最终用途。

公开(公告)号：US20160244611A1

公开(公告)日：2016-08-25

申请号：US15027353

申请日：2014-03-21

Applicant: SHENGYI TECHNOLOGY CO., LTD.

Inventor： Hu Yang ,  Yueshan He

IPC: C08L79/04 ,  H05K1/02 ,  H05K1/09 ,  C09D179/04 ,  H05K1/03

CPC classification number: C08L79/04 ,  B32B5/022 ,  B32B5/024 ,  B32B5/26 ,  B32B7/10 ,  B32B15/098 ,  B32B15/14 ,  B32B15/18 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/10 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/732 ,  B32B2457/08 ,  C08G14/06 ,  C08G14/12 ,  C08K3/00 ,  C08K3/36 ,  C08K5/14 ,  C08K5/49 ,  C08K5/5399 ,  C08L9/06 ,  C08L25/10 ,  C08L71/12 ,  C08L71/126 ,  C08L79/085 ,  C09D179/04 ,  C09J161/34 ,  H05K1/0298 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/012 ,  H05K2201/0355

Abstract: The present invention relates to a halogen-free resin composition, a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises, based on the weight parts of organic solids, (A) from 40 to 80 parts by weight of allyl-modified benzoxazine resin, (B) from 10 to 20 parts by weight of hydrocarbon resin, (C) from 10 to 40 parts by weight of allyl-modified polyphenyl ether resin, (D) from 10 to 20 parts by weight of allyl-modified bismaleimide resin, (E) from 0.01 to 3 parts by weight of an initiator, (F) from 10 to 100 parts by weight of a filler, and (G) from 0 to 80 parts by weight of a phosphorus-containing flame retardant. The prepreg and laminate prepared from the halogen-free resin composition have lower dielectric constant and dielectric loss tangent value, higher peel strength, high glass transition temperature, excellent thermal resistance and better flame retardant effect.

Abstract translation: 本发明涉及无卤素树脂组合物，预浸料和由其制备的层压材料。 无卤素树脂组合物包含基于有机固体重量份的（A）40至80重量份的烯丙基改性的苯并恶嗪树脂，（B）10至20重量份的烃树脂，（C ）10〜40重量份烯丙基改性聚苯醚树脂，（D）10〜20重量份烯丙基改性双马来酰亚胺树脂，（E）0.01〜3重量份引发剂，（F） 10〜100重量份的填料，（G）0〜80重量份的含磷阻燃剂。 由无卤素树脂组合物制备的预浸料和层压材料具有较低的介电常数和介电损耗角正切值，更高的剥离强度，高玻璃化转变温度，优异的耐热性和更好的阻燃效果。

公开(公告)号：US20160244471A1

公开(公告)日：2016-08-25

申请号：US15027369

申请日：2014-06-13

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yueshan HE

IPC: C07F9/6581 ,  C08L79/02 ,  C08L75/00 ,  H05K1/03 ,  C08L63/08 ,  C08J5/24 ,  C08J5/04 ,  C09K21/14 ,  C08G59/30 ,  C08L71/00

CPC classification number: C07F9/65812 ,  C07F9/65815 ,  C08G59/304 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/08 ,  C08J2371/00 ,  C08J2375/00 ,  C08J2379/00 ,  C08J2379/02 ,  C08J2435/06 ,  C08J2463/08 ,  C08K5/5399 ,  C08L63/08 ,  C08L71/00 ,  C08L75/00 ,  C08L79/02 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/03 ,  C09K21/12 ,  C09K21/14 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209

Abstract: The present invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The phenoxycyclotriphosphazene active ester comprises at least 65 mol. % of a substance having the following structural formula. The halogen-free resin composition comprises 5-50 parts by weight of a phenoxycyclotriphosphazene active ester, 15-85 parts by weight of a thermosetting resin, 1-35 parts by weight of a curing agent, 0-5 parts by weight of a curing accelerator and 0-100 parts by weight of an inorganic filler. The present invention discloses introducing phenoxycyclotriphosphazene active ester into a thermosetting resin, reacting active esters with thermosetting resins, such as epoxy resin, without producing hydroxy groups, which not only satisfies the requirements on being halogen-free and flame retardancy, but also improves the electrical properties (decreasing and stabilizing Dk and Df) of the system, so as to make non-halogenation of high frequency and high speed substrate materials possible.

Abstract translation: 本发明公开了一种苯氧基环三磷腈活性酯，一种无卤树脂组合物及其应用。 苯氧基环三磷腈活性酯包含至少65mol。 ％具有以下结构式的物质。 无卤素树脂组合物包含5-50重量份苯氧基环三磷腈活性酯，15-85重量份热固性树脂，1-35重量份固化剂，0-5重量份固化剂 促进剂和0-100重量份的无机填料。 本发明公开了将苯氧基环三磷腈活性酯引入热固性树脂中，使活性酯与环氧树脂等热固性树脂反应而不产生羟基，不仅满足无卤素和阻燃性的要求，而且改善了电 性能（降低和稳定Dk和Df），从而使高频和高速基板材料的非卤化成为可能。

公开(公告)号：US20160237352A1

公开(公告)日：2016-08-18

申请号：US15142067

申请日：2016-04-29

Applicant: International Business Machines Corporation

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Timothy C. Mauldin

IPC: C09K21/14 ,  C08G79/04

CPC classification number: C09K21/14 ,  C08G79/04 ,  C08G81/00 ,  C08K3/00 ,  C08K5/00 ,  C08K7/00 ,  H01R13/527 ,  H05K1/0373 ,  H05K2201/012

Abstract: A flame retardant block copolymer is prepared from renewable content. In an exemplary synthetic method, a bio-derived flame retardant block copolymer is prepared by a ring opening polymerization of a biobased cyclic ester and a phosphorus-containing polymer. In some embodiments, the biobased cyclic ester is lactide. In some embodiments, the phosphorus-containing polymer is a hydroxyl-telechelic flame retardant biopolymer prepared by a polycondensation reaction of a biobased diol (e.g., isosorbide) and a phosphorus-containing monomer (e.g., phenylphosphonic dichloride). In other embodiments, the phosphorus-containing polymer is synthesized from a dioxaphospholane monomer.

公开(公告)号：US09403981B2

公开(公告)日：2016-08-02

申请号：US14732121

申请日：2015-06-05

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Chen Yu Hsieh

IPC: C08L7/02 ,  C08L77/06 ,  H05K1/03 ,  C08G73/10 ,  C08L79/08

CPC classification number: C08L77/06 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1082 ,  C08K3/36 ,  C08K5/14 ,  C08K5/5399 ,  C08L23/00 ,  C08L63/00 ,  C08L79/04 ,  C08L79/08 ,  C08L79/085 ,  C08L2201/02 ,  C08L2203/20 ,  C08L2205/03 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/0358

Abstract: A resin composition, including (A) a polyimide resin; (B) a pre-polymerized maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4′-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerized maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.

Abstract translation: 一种树脂组合物，其包含（A）聚酰亚胺树脂; （B）预聚合的马来酰亚胺树脂; （C）热固性树脂; 和（D）阻燃剂。 用于合成聚酰亚胺树脂的反应物包括酸酐和二胺，二胺包括4,4'-二氨基二苯基甲烷及其类似化合物和聚醚二胺。 树脂组合物具有以下优点：由树脂组合物制成的树脂膜或预浸料包含由特定结构的二胺和预聚合的马来酰亚胺树脂合成的聚酰亚胺树脂，以获得令人满意的电路层压材料的特性， 例如低介电常数，低损耗因数，高耐热性和高粘合性，以用于制造金属包覆层压板和印刷电路板。

公开(公告)号：US20160177182A1

公开(公告)日：2016-06-23

申请号：US14909419

申请日：2013-07-31

Applicant: EMPIRE TECHNOLOGY DEVELOPMENT LLC

Inventor： William Brenden CARLSON ,  Gregory D. PHELAN

IPC: C09K21/14 ,  H05K1/02 ,  C08B37/00 ,  H05K1/03 ,  C08B15/00 ,  C08B31/00

CPC classification number: C09K21/14 ,  C08B15/005 ,  C08B31/003 ,  C08B37/0045 ,  C09K21/00 ,  H05K1/0201 ,  H05K1/0313 ,  H05K1/0326 ,  H05K1/0353 ,  H05K2201/012

Abstract: Printed circuit boards, or PCBs, may include cross-linked oligomers that have been modified to prevent corrosion and have reduced flammability. The oligomers may be functionalized to include cross-linkable moieties and a flame retardant. The modified materials are more environmentally benign and less toxic than current fiberglass technologies used to manufacture PCBs.

Abstract translation: 印刷电路板或PCB可以包括已经被改性以防止腐蚀并具有降低的可燃性的交联低聚物。 低聚物可以被官能化以包括可交联部分和阻燃剂。 改性材料比目前用于制造PCB的玻璃纤维技术更环保，毒性更低。

公开(公告)号：US20160111803A1

公开(公告)日：2016-04-21

申请号：US14896420

申请日：2014-05-15

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Konrad Wagner ,  Jürgen Holz

IPC: H01R13/405 ,  H05K7/02 ,  H05K1/03 ,  H01R4/24 ,  H01R24/58 ,  H05K1/18 ,  H01R12/71

CPC classification number: H01R13/405 ,  H01R4/2404 ,  H01R4/2479 ,  H01R12/718 ,  H01R24/58 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/056 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/325 ,  H05K3/368 ,  H05K7/02 ,  H05K2201/012 ,  H05K2201/0129 ,  H05K2201/041 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10409

Abstract: An optoelectronic arrangement includes a first circuit board, a second circuit board, and an optoelectronic semiconductor chip arranged on the first circuit board, wherein a first electrical contact surface and a second electrical contact surface are formed on a surface of the first circuit board, a first mating contact surface and a second mating contact surface are formed on a surface of the second circuit board, and the first circuit board and the second circuit board connect to one another such that the surface of the first circuit board faces toward the surface of the second circuit board, and the first mating contact surface electrically conductively connects to the first contact surface and the second mating contact surface electrically conductively connects to the second contact surface.

Abstract translation: 光电布置包括布置在第一电路板上的第一电路板，第二电路板和光电子半导体芯片，其中第一电接触表面和第二电接触表面形成在第一电路板的表面上， 第一配合接触表面和第二配合接触表面形成在第二电路板的表面上，并且第一电路板和第二电路板彼此连接，使得第一电路板的表面面向 第二电路板，并且第一配合接触表面导电地连接到第一接触表面，并且第二配合接触表面导电地连接到第二接触表面。

公开(公告)号：US20150359093A1

公开(公告)日：2015-12-10

申请号：US14831235

申请日：2015-08-20

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Hiroaki FUJIWARA ,  Masao IMAI ,  Yuki KITAI

IPC: H05K1/03 ,  C08K5/06 ,  C08K5/03 ,  C08K5/3417 ,  C09D163/00 ,  C08J5/24

CPC classification number: H05K1/0373 ,  C08G59/4014 ,  C08J5/24 ,  C08J2363/00 ,  C08J2371/12 ,  C08K5/0025 ,  C08K5/0066 ,  C08K5/03 ,  C08K5/06 ,  C08K5/315 ,  C08K5/3417 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04 ,  C09D163/00 ,  H05K1/0353 ,  H05K2201/012 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31529 ,  C08L2666/14 ,  C08L2666/22

Abstract: It is an object of the present invention to provide an epoxy resin composition containing an epoxy compound, a low-molecular-weight phenol-modified polyphenylene ether and a cyanate compound as essential components, the epoxy resin composition having excellent dielectric characteristics and exhibiting high heat resistance while maintaining flame retardancy. To achieve this, the epoxy resin composition of the present invention is a thermosetting resin composition composed of a resin varnish containing (A) an epoxy compound having a number-average molecular weight of 1000 or less and containing at least two epoxy groups in the molecule without containing any halogen atoms, (B) a polyphenylene ether having a number-average molecular weight of 5000 or less, (C) a cyanate ester compound, (D) a curing catalyst and (E) a halogen flame retardant, all of the components (A) to (C) are dissolved in the resin varnish, while component (E) is dispersed without being dissolved in the resin varnish.

Abstract translation: 本发明的目的是提供一种含有环氧化合物，低分子量苯酚改性聚苯醚和氰酸酯化合物作为必要组分的环氧树脂组合物，该环氧树脂组合物具有优异的介电特性并表现出高热 阻力同时保持阻燃性。 为了实现这一点，本发明的环氧树脂组合物是由包含（A）数均分子量为1000以下且在分子中含有至少两个环氧基的环氧化合物的树脂清漆组成的热固性树脂组合物 不含任何卤素原子，（B）数均分子量为5000以下的聚苯醚，（C）氰酸酯化合物，（D）固化催化剂和（E）卤素阻燃剂，全部为 组分（A）至（C）溶解在树脂清漆中，而组分（E）分散而不溶解在树脂清漆中。