公开(公告)号：US20230199947A1

公开(公告)日：2023-06-22

申请号：US18080897

申请日：2022-12-14

Applicant: TORAY ADVANCED MATERIALS KOREA INC.

Inventor： Jong Hun Cheon ,  Ha Soo Lee ,  Jong Yong Park

IPC: H05K1/03 ,  H05K3/38 ,  H05K3/02 ,  H05K1/09

CPC classification number: H05K1/0393 ,  H05K3/384 ,  H05K3/025 ,  H05K1/09 ,  H05K2201/0355 ,  H05K2201/0154

Abstract: Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes a fluorine-containing substrate, a tie layer disposed on the fluorine-containing substrate, and a copper layer disposed on the tie layer, wherein the tie layer may be a metal layer or metal alloy layer including a metal of a metal-oxygen (M-O) bond dissociation energy of 400 kJ/mol or more, and the tie layer may have a thickness of about 10 nm to about 100 nm.

公开(公告)号：US20230179922A1

公开(公告)日：2023-06-08

申请号：US17566701

申请日：2021-12-31

Applicant: AAC Microtech (Changzhou) Co., Ltd.

Inventor： Wei Song ,  Xin Jin ,  Ronglin Linghu

IPC: H04R9/06 ,  H05K1/02 ,  H05K1/09 ,  H04R1/02 ,  H04R9/02 ,  H04R3/00 ,  H04R9/04 ,  H04R7/18 ,  H04R7/12

CPC classification number: H04R9/06 ,  H05K1/028 ,  H05K1/09 ,  H04R1/025 ,  H04R9/025 ,  H04R3/00 ,  H04R9/045 ,  H04R7/18 ,  H04R7/12 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/10083 ,  H04R2400/11

Abstract: The present disclosure discloses a flexible circuit board and a speaker. The flexible circuit includes a substrate, a first cover film attached to a side of the substrate and including at least a silica gel layer, a second cover film attached to the other side of the substrate, and a copper foil layer sealed between the substrate and the first cover film or between the substrate and the second cover film. Compared with the related art, the flexible circuit disclosed by the present disclosure has a higher strength.

公开(公告)号：US20230173791A1

公开(公告)日：2023-06-08

申请号：US17924560

申请日：2021-05-17

Applicant: Blueshift Materials, Inc.

Inventor： Lawino KAGUMBA ,  Vitaly BENKIN ,  Garrett POE

IPC: B32B15/08 ,  B32B15/20 ,  B32B5/18 ,  B32B7/12 ,  B32B27/32 ,  B32B27/28 ,  B32B27/38 ,  B32B15/092 ,  B32B27/06 ,  B32B5/02 ,  B32B27/10 ,  B32B27/12 ,  H05K1/03 ,  H05K1/02 ,  H01Q1/38

CPC classification number: B32B15/08 ,  B32B5/18 ,  B32B5/022 ,  B32B5/024 ,  B32B7/12 ,  B32B15/20 ,  B32B15/092 ,  B32B27/10 ,  B32B27/12 ,  B32B27/38 ,  B32B27/065 ,  B32B27/281 ,  B32B27/322 ,  H01Q1/38 ,  H05K1/0243 ,  H05K1/0366 ,  B32B2266/102 ,  B32B2266/104 ,  B32B2266/126 ,  B32B2266/0214 ,  B32B2307/72 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/206 ,  B32B2307/546 ,  B32B2307/732 ,  B32B2457/08 ,  H05K2201/0154

Abstract: A laminate comprises one or more electrically-conductive layers and one or more electrically-insulative layers coupled to the electrically-conductive layer(s). Each of the electrically-conductive layer(s) can comprise at least 90% by weight of copper. Each of the electrically-insulative layer(s) can comprise a layer of polymeric aerogel. For at least one of opposing front and back surfaces of the laminate, at least a portion of the surface is defined by one of the electrically-conductive layer(s).

公开(公告)号：US11666092B2

公开(公告)日：2023-06-06

申请号：US16639020

申请日：2018-10-26

Applicant: KT&G CORPORATION

Inventor： Hwi Kyeong An

IPC: A24F13/00 ,  A24F40/42 ,  A24F40/90 ,  A24F40/46 ,  A24B15/167 ,  A24F40/20 ,  A24F40/30 ,  A24D3/17 ,  A24D1/20 ,  A24F40/60 ,  F21V3/00 ,  F21V5/00 ,  G02B19/00 ,  H05B3/54 ,  A24F40/485 ,  A24F40/10 ,  A24F40/44 ,  A24F40/40 ,  A24F40/57 ,  A24F40/65 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  A24F40/50 ,  A24F40/95 ,  A24F15/01 ,  A24F40/51 ,  F21Y115/10

CPC classification number: A24F40/42 ,  A24B15/167 ,  A24D1/20 ,  A24D3/17 ,  A24F15/01 ,  A24F40/10 ,  A24F40/20 ,  A24F40/30 ,  A24F40/40 ,  A24F40/44 ,  A24F40/46 ,  A24F40/485 ,  A24F40/50 ,  A24F40/57 ,  A24F40/60 ,  A24F40/65 ,  A24F40/90 ,  A24F40/95 ,  F21V3/00 ,  F21V5/00 ,  G02B19/0009 ,  G02B19/0061 ,  H05B3/54 ,  H05K1/0203 ,  H05K1/0277 ,  H05K1/148 ,  H05K1/181 ,  A24F40/51 ,  F21Y2115/10 ,  H05K2201/012 ,  H05K2201/0154 ,  H05K2201/10219

Abstract: Provided according to an exemplary embodiment is a heater for an aerosol generation device, the heater comprising a plurality of segments combined together to form an insertion portion into which an object-to-be-heated is inserted; one or more electrically conductive tracks printed on one surface of each of the plurality of segments and disposed toward the object-to-be-heated; and an elastic member configured to surround at least a part of the plurality of segments.

公开(公告)号：US11659652B2

公开(公告)日：2023-05-23

申请号：US17318265

申请日：2021-05-12

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Ryosuke Takada

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/46 ,  H01R12/62

CPC classification number: H05K1/028 ,  H05K1/0353 ,  H05K1/148 ,  H05K3/4688 ,  H01R12/62 ,  H05K2201/0112 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2203/065 ,  H05K2203/107

Abstract: A resin substrate includes an insulating base material including opposing first and second main surfaces, at least one of which is parallel or substantially parallel to each of an X-axis direction and a Y-axis direction. The insulating base material is divided into first and second sections arranged in the X-axis direction. The first section includes, when evenly divided into three in a Z-axis direction, a first region closest to the first main surface, a second region closest to the second main surface, and a third region between the first region and the second region. A degree of resin molecular orientation in the first region in the Y-axis direction is greater than a degree of resin molecular orientation in the second section of the insulating base material in the Y-axis direction.

公开(公告)号：US20230145378A1

公开(公告)日：2023-05-11

申请号：US18096613

申请日：2023-01-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takayuki SHIMAMURA ,  Tomohiro FURUMURA ,  Sunao FUKUTAKE

IPC: H05K1/03 ,  H05K1/02 ,  B32B7/02 ,  B32B15/20 ,  B32B27/36 ,  B32B27/32 ,  B32B27/28 ,  B32B27/20 ,  B32B27/08 ,  B32B15/085

CPC classification number: H05K1/036 ,  H05K1/0373 ,  H05K1/0237 ,  B32B7/02 ,  B32B15/20 ,  B32B27/36 ,  B32B27/322 ,  B32B27/281 ,  B32B27/20 ,  B32B27/08 ,  B32B15/085 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0209 ,  B32B2305/55 ,  B32B2307/206 ,  B32B2307/202 ,  B32B2457/08 ,  B32B2270/00 ,  B32B2305/30

Abstract: A circuit board includes, in order in a stacking direction, a first insulating layer, a second insulating layer in contact with the first insulating layer, and a conductor layer, the first insulating layer includes a liquid crystal polymer as a main component, and the second insulating layer includes a fluoropolymer including at least one of polytetrafluoroethylene and a perfluoroalkoxy alkane and includes a polyimide resin with an imidization rate of about 90% or more, the polyimide resin being present in an amount of about 0.5 parts or more by weight and less than about 20 parts by weight per 100 parts by weight of the fluoropolymer.

公开(公告)号：US20190237549A1

公开(公告)日：2019-08-01

申请号：US16374893

申请日：2019-04-04

Applicant: Mitsubishi Electric Corporation

Inventor： Kohei EBIHARA ,  Hiroshi WATANABE

IPC: H01L29/16 ,  H01L29/66 ,  H01L23/24 ,  H01L29/872 ,  H01L23/31 ,  H01L29/861 ,  H01L29/06 ,  H01L29/78 ,  H01L29/40

CPC classification number: H01L29/1608 ,  H01L23/24 ,  H01L23/3171 ,  H01L23/3185 ,  H01L29/0615 ,  H01L29/0619 ,  H01L29/402 ,  H01L29/6606 ,  H01L29/66068 ,  H01L29/7395 ,  H01L29/78 ,  H01L29/7811 ,  H01L29/8611 ,  H01L29/872 ,  H01L2924/01014 ,  H01L2924/10253 ,  H05K2201/0154

Abstract: Supposing x is defined as a position of an end of a depletion layer extending when a rated voltage V [V] is applied to a rear surface electrode, W1 is defined as a distance between the position x and an outer peripheral edge of a surface electrode in an outer peripheral direction, W2 is defined as a distance between the position x and an outer peripheral edge of a field insulating film in the outer peripheral direction, t [μm] is defined as a film thickness t [μm] of the field insulating film, a layout of a terminal part is defined so that an electrical field in the field insulating film at the position x expressed as W2V/t(W1+W2) is 3 MV/cm or smaller.

公开(公告)号：US20190229449A1

公开(公告)日：2019-07-25

申请号：US16371708

申请日：2019-04-01

Applicant: CelLink Corporation

Inventor： Kevin Michael Coakley ,  Malcolm Brown ,  Jose Juarez ,  Dongao Yang

IPC: H01R12/59 ,  H01R12/69 ,  H01B7/08 ,  H05K1/02 ,  B60J5/04 ,  H01B7/04 ,  B60R16/02 ,  H01B7/00 ,  H01R43/20

CPC classification number: H01R12/592 ,  B60J5/0413 ,  B60R16/0215 ,  B60Y2410/115 ,  H01B7/0045 ,  H01B7/04 ,  H01B7/08 ,  H01B7/421 ,  H01B13/01254 ,  H01R12/69 ,  H01R43/205 ,  H01R2201/26 ,  H05K1/0201 ,  H05K1/028 ,  H05K1/118 ,  H05K3/0052 ,  H05K3/28 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/041 ,  H05K2201/052 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2203/0228

Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.

公开(公告)号：US20190217573A1

公开(公告)日：2019-07-18

申请号：US16248972

申请日：2019-01-16

Applicant: Postech Academy-Industry Foundation ,  Center for Advanced Soft Electronics

Inventor： Yoonyoung CHUNG ,  Kilwon CHO ,  Seongmin PARK ,  Hyuk PARK

IPC: B32B7/022 ,  H05K1/03 ,  B32B27/08 ,  B32B27/28 ,  B32B37/00 ,  B32B37/24

CPC classification number: B32B7/022 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B37/025 ,  B32B37/24 ,  B32B2037/243 ,  B32B2250/03 ,  B32B2250/24 ,  B32B2305/72 ,  B32B2307/54 ,  B32B2307/546 ,  B32B2309/02 ,  B32B2379/08 ,  B32B2383/00 ,  B32B2457/08 ,  H05K1/036 ,  H05K2201/0154 ,  H05K2201/0162

Abstract: Provided is a flexible substrate. The flexible substrate includes a first film having a first Young's modulus, a second film on the first film and having a second Young's modulus, and a third film between the first film and the second film and having a third Young's modulus. The third Young's modulus is less than each of the first Young's modulus and the second Young's modulus.

公开(公告)号：US20190215963A1

公开(公告)日：2019-07-11

申请号：US16354556

申请日：2019-03-15

Applicant: FUJITSU LIMITED

Inventor： Tomoyuki Akahoshi ,  Hideaki Nagaoka ,  Daisuke Mizutani

IPC: H05K1/16 ,  H05K1/18 ,  H05K1/11 ,  H05K3/46 ,  H01G4/33

CPC classification number: H05K1/162 ,  B32B7/02 ,  B32B17/00 ,  B32B27/00 ,  B32B27/38 ,  H01G2/06 ,  H01G4/12 ,  H01G4/33 ,  H01L23/12 ,  H01L23/49816 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/115 ,  H05K1/181 ,  H05K3/46 ,  H05K3/4644 ,  H05K2201/0154 ,  H05K2201/09827

Abstract: A circuit board includes a first capacitor that includes a first dielectric layer, a first conductor layer disposed on a first surface of the first dielectric layer, and a second conductor layer disposed on a second surface of the first dielectric layer opposite to the first surface, a first insulating layer that is bonded to the first surface side with a first adhesive layer and has a higher elastic modulus than the first adhesive layer, and a second insulating layer that is bonded to the second surface side with a second adhesive layer and has a higher elastic modulus than the second adhesive layer.