公开(公告)号：US20130322034A1

公开(公告)日：2013-12-05

申请号：US13996051

申请日：2011-10-13

Applicant: Francois Lechleiter

Inventor： Francois Lechleiter

IPC: H05K3/34 ,  H05K1/02

CPC classification number: H05K3/341 ,  H05K1/0277 ,  H05K1/189 ,  H05K3/3484 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2203/0139 ,  H05K2203/063 ,  Y10T29/4913

Abstract: The inventions relates to a method of manufacturing a flexible surface mounted device, the method including bonding a main face of a conductive layer to an insulating layer; linking electrically and mechanically at least one electronic surface mounted component to the conductive layer; wherein the insulating layer is punched to produce through holes through which the electronic component is linked to said main face of the conductive layer.

Abstract translation: 本发明涉及制造柔性表面安装器件的方法，该方法包括将导电层的主面接合到绝缘层上; 将电子和机械的至少一个电子表面安装部件连接到所述导电层; 其中所述绝缘层被冲压以产生通孔，所述电子部件通过所述通孔连接到所述导电层的所述主面。

公开(公告)号：US08593823B2

公开(公告)日：2013-11-26

申请号：US12588728

申请日：2009-10-26

Applicant: Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida

Inventor： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida

IPC: H05K7/00

CPC classification number: G11B5/486 ,  G11B5/4853 ,  H05K1/056 ,  H05K1/181 ,  H05K3/06 ,  H05K3/445 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10545 ,  H05K2201/10727 ,  H05K2203/0323 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49167

Abstract: A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device.

Abstract translation: 具有电路的悬挂板包括导电图案。 导电图案包括设置在具有电路的悬挂板的前表面上并与磁头电连接的第一端子; 以及设置在具有电路的悬挂板的背面上并与电子设备电连接的第二端子。

公开(公告)号：US20130256004A1

公开(公告)日：2013-10-03

申请号：US13435372

申请日：2012-03-30

Applicant: Darryl COTTON ,  Samiul Md. HAQUE ,  Piers ANDREW

Inventor： Darryl COTTON ,  Samiul Md. HAQUE ,  Piers ANDREW

IPC: H05K1/02 ,  H05K3/20 ,  H05K3/24 ,  H05K3/10

CPC classification number: H05K3/0064 ,  H05K1/0283 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09045 ,  H05K2201/09109 ,  H05K2201/09263 ,  H05K2201/2036

Abstract: An apparatus and method wherein the apparatus comprises includes a deformable substrate; a conductive portion; and at least one support configured to couple the conductive portion to the deformable substrate so that the conductive portion is spaced from the deformable substrate.

Abstract translation: 一种装置和方法，其中所述装置包括可变形衬底; 导电部分; 以及至少一个支撑件，其构造成将所述导电部分耦合到所述可变形基板，使得所述导电部分与所述可变形基板间隔开。

公开(公告)号：US08525035B2

公开(公告)日：2013-09-03

申请号：US12905245

申请日：2010-10-15

Applicant: Gwun-Jin Lin ,  Chih-Heng Chuo ,  Kuo-Fu Su

Inventor： Gwun-Jin Lin ,  Chih-Heng Chuo ,  Kuo-Fu Su

IPC: H05K1/00

CPC classification number: H05K1/118 ,  H05K1/028 ,  H05K2201/0394 ,  H05K2201/052 ,  H05K2201/09063 ,  H05K2201/0949 ,  H05K2201/10598 ,  H05K2203/0228 ,  H05K2203/1572

Abstract: Disclosed is a double-side-conducting flexible-circuit flat cable with cluster section, which includes a flexible circuit substrate, a first electrical conduction path, a second electrical conduction path, a plurality of first and second conductive contact zones. The flexible circuit substrate has a first surface and a second surface and includes, in an extension direction, a first connection section, a cluster section, and at least one second connection section. The cluster section is composed of a plurality of clustered flat cable components formed by slitting in the extension direction. The first and second electrical conduction paths are respectively formed on the first and second surfaces of the flexible circuit substrate and each extends along one of the clustered flat cable components of the cluster section. The plurality of first and second conductive contact zones are respectively arranged on the first and second surfaces of the flexible circuit substrate at the first connection section. Each of the first and second conductive contact zones extends along one of the electrical conduction paths of the cluster section toward the second connection section.

Abstract translation: 公开了一种具有集束部分的双面导电柔性电路扁平电缆，其包括柔性电路基板，第一导电路径，第二导电通路，多个第一和第二导电接触区域。 柔性电路基板具有第一表面和第二表面，并且在延伸方向上包括第一连接部分，集束部分和至少一个第二连接部分。 集群部分由沿着延伸方向切割形成的多个群集扁平电缆部件组成。 第一和第二导电路径分别形成在柔性电路基板的第一和第二表面上，并且每个沿着集束部分的群集扁平电缆部件之一延伸。 多个第一和第二导电接触区域分别设置在第一连接部分处的柔性电路基板的第一和第二表面上。 第一和第二导电接触区域中的每一个沿着群集部分的导电路径中的一个朝向第二连接部分延伸。

公开(公告)号：US08310057B2

公开(公告)日：2012-11-13

申请号：US12963887

申请日：2010-12-09

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L21/486 ,  H01L21/563 ,  H01L23/13 ,  H01L23/16 ,  H01L23/24 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/8385 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15151 ,  H01L2924/15183 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/112 ,  H05K3/3457 ,  H05K3/386 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0394 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05647 ,  H01L2224/05099 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A substrate includes an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film. A wiring pattern is adhered to the first surface of the insulating film by an adhesive material. A first portion of the wiring pattern is formed over the penetrating hole, and a part of the adhesive material is formed on an internal wall surface forming the penetrating hole so as not to stop up the penetrating hole. An external electrode contacts the first portion of the wiring pattern and projects through the penetrating hole and extends beyond the second surface of the insulating film.

Abstract translation: 基板包括绝缘膜，其中形成有穿透孔，所述穿透孔在绝缘膜的第一表面和绝缘膜的与绝缘膜的第一表面相对的第二表面之间延伸。 通过粘合剂材料将布线图案粘附到绝缘膜的第一表面。 布线图案的第一部分形成在穿透孔的上方，并且粘合材料的一部分形成在形成穿透孔的内壁表面上，以便不停止穿透孔。 外部电极与布线图案的第一部分接触并且穿过该穿孔延伸出绝缘膜的第二表面。

公开(公告)号：US08309853B2

公开(公告)日：2012-11-13

申请号：US12526917

申请日：2008-02-15

Applicant: Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

Inventor： Yoshio Oka ,  Takashi Kasuga ,  Jinjoo Park ,  Kouki Nakama

IPC: H05K1/00

CPC classification number: H05K3/4685 ,  H05K1/0393 ,  H05K1/095 ,  H05K1/118 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4664 ,  H05K2201/0394 ,  H05K2201/10363 ,  H05K2203/1581

Abstract: A flexible printed wiring board includes a substrate, conductor wirings, a coverlay film, a jumper wiring, and through holes. The conductor wirings are disposed on a first surface of the substrate. The coverlay film covers at least part of the conductor wirings. The jumper wiring electrically connects the conductor wirings to each other. The through holes are formed in the substrate and respectively open to the surfaces of the conductor wirings. The jumper wiring is composed of a hardened material of a conductive paste and is formed so that a second surface of the substrate is continuous with respective surfaces of the conductor wirings to which the through holes open.

Abstract translation: 柔性印刷电路板包括基板，导体布线，覆盖膜，跳线布线和通孔。 导体布线设置在基板的第一表面上。 覆盖膜覆盖导体布线的至少一部分。 跳线将导体布线彼此电连接。 通孔形成在基板中并分别向导体配线的表面开口。 跳线布线由导电浆料的硬化材料构成，并且形成为使得基板的第二表面与通孔打开的导体布线的各个表面连续。

公开(公告)号：US08274634B2

公开(公告)日：2012-09-25

申请号：US12485624

申请日：2009-06-16

Applicant: Harutoshi Oikawa ,  Kiyohiro Kimura

Inventor： Harutoshi Oikawa ,  Kiyohiro Kimura

IPC: G02F1/1345

CPC classification number: H05K3/361 ,  G06F3/045 ,  H05K3/281 ,  H05K3/323 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/097 ,  H05K2201/0979 ,  H05K2203/1572

Abstract: A flexible printed circuit includes: a first wiring layer and a second wiring layer being in contact with one surface of a flexible substrate, a third wiring layer and a fourth wiring layer on the other surface of the flexible substrate, a first conductive member being formed on surfaces in proximity to a through hole of the second wiring layer and the fourth wiring layer; a second conductive member being formed on surfaces in proximity to the first end section of the first wiring layer and the third wiring layer; and an insulating layer being formed in a space between the first wiring layer and the second conductive member, and the second wiring layer and the first conductive member and a space between the third wiring layer and the second conductive member, and the fourth wiring layer and the first conductive member.

Abstract translation: 柔性印刷电路包括：第一布线层和与柔性基板的一个表面接触的第二布线层，在柔性基板的另一个表面上的第三布线层和第四布线层，形成第一导电部件 在第二布线层和第四布线层的通孔附近的表面上; 第二导电构件形成在靠近第一布线层和第三布线层的第一端部的表面上; 以及在所述第一布线层和所述第二导电构件之间的空间中形成绝缘层，以及所述第二布线层和所述第一导电构件以及所述第三布线层和所述第二导电构件之间的空间，以及所述第四布线层和 第一导电构件。

公开(公告)号：US08258620B2

公开(公告)日：2012-09-04

申请号：US12673409

申请日：2008-08-08

Applicant: Mayumi Nakasato ,  Ryosuke Usui ,  Kiyoshi Shibata

Inventor： Mayumi Nakasato ,  Ryosuke Usui ,  Kiyoshi Shibata

IPC: H01L23/053 ,  H01L23/12

CPC classification number: H01L23/145 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L29/0657 ,  H01L2221/68345 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83101 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/113 ,  H05K3/002 ,  H05K3/305 ,  H05K3/4007 ,  H05K2201/0209 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1152 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2224/05599

Abstract: A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved.

Abstract translation: 电路装置包括：绝缘基体，设置有与纤维填料混合的树脂层，设置在绝缘基底中的凸起，用作连接用电极，倒装芯片安装的半导体器件，以及填充半导体之间的间隙的底部填充物 设备和绝缘基座。 通过使通过树脂层的上表面突出的纤维状填料与底部填充剂接触，提高了底部填充剂和绝缘基材之间的粘合强度。

公开(公告)号：US20120208411A1

公开(公告)日：2012-08-16

申请号：US13381263

申请日：2010-05-19

Applicant: Hans-Joachim Krokoszinski ,  Martin Zippel

Inventor： Hans-Joachim Krokoszinski ,  Martin Zippel

IPC: H01R13/02 ,  H01R43/00 ,  H01R43/16

CPC classification number: H05K3/041 ,  B32B37/02 ,  B32B38/1841 ,  B32B2038/047 ,  B32B2457/12 ,  H01L31/0516 ,  H05K3/202 ,  H05K3/281 ,  H05K3/341 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2203/1545 ,  Y02E10/50 ,  Y10T29/49117 ,  Y10T29/4921

Abstract: In a method for manufacturing a foil-like electrical connector for connecting solar cells to form modules, an insulating carrier film sheet is initially provided in a width which essentially corresponds to the width of the solar cells to be connected. Furthermore, a conductive foil sheet having a width that is matched to the carrier film is provided. In addition, comb structures as subsequent electrical connection fingers are formed. The conductive foil sheet is positioned on the carrier film with the aid of pin-shaped extensions of a transport belt or a transport roller. The carrier film is subsequently joined to the conductive foil sheet, preferably via an adhesive bond. In the next step, an insulating cover film is applied, in particular laminated.

Abstract translation: 在用于制造用于连接太阳能电池以形成模块的箔状电连接器的方法中，绝缘载体膜片片最初设置为基本上对应于待连接的太阳能电池的宽度的宽度。 此外，提供具有与载体膜匹配的宽度的导电箔片。 此外，形成作为随后的电连接指的梳结构。 借助于输送带或输送辊的销状延伸部分，导电箔片位于载体膜上。 载体膜随后通过粘结剂结合在导电箔片上。 在下一步中，涂覆绝缘覆盖膜，特别是层压。

公开(公告)号：US20120199389A1

公开(公告)日：2012-08-09

申请号：US13442921

申请日：2012-04-10

Applicant: Toshiki FURUTANI ,  Takeshi Furusawa

Inventor： Toshiki FURUTANI ,  Takeshi Furusawa

IPC: H05K1/11

CPC classification number: H05K1/113 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0269 ,  H05K3/0035 ,  H05K3/107 ,  H05K3/205 ,  H05K3/421 ,  H05K3/423 ,  H05K3/428 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0542 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method for manufacturing a printed wiring board, in which filled vias with a reduction in faulty connections are formed, and providing such a printed wiring board. After an electroless plated film is formed on an inner wall of a via opening, electrolytic plating is performed on insulative resin base material; the via opening is filled with plating metal and a filled via is formed. Therefore, during electrolytic plating, a plating metal is deposited from electroless plated film on the side wall of the via opening as well as from the bottom of the via opening. As a result, the via opening may be completely filled through electrolytic plating, forming a filled via with a reduction in faulty connections.

Abstract translation: 一种制造印刷线路板的方法，其中形成了具有减少连接故障的填充过孔，并且提供了这种印刷线路板。 在通孔开口的内壁上形成无电镀膜后，对绝缘性树脂基材进行电解电镀; 通孔开口填充有电镀金属，并形成填充的通孔。 因此，在电解电镀期间，电化学金属由通孔开口的侧壁以及通孔开口的底部的无电镀膜沉积。 结果，通孔开口可以通过电解电镀完全填充，形成填充的通孔，同时减少连接错误。