公开(公告)号：US20130183475A1

公开(公告)日：2013-07-18

申请号：US13876670

申请日：2011-09-30

Applicant: Yoshitaka Yoshida ,  Hiroaki Yamamoto

Inventor： Yoshitaka Yoshida ,  Hiroaki Yamamoto

IPC: H05K1/03 ,  B32B3/30 ,  H05K3/00

CPC classification number: H05K1/0306 ,  B32B3/30 ,  H05K1/09 ,  H05K3/00 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09863 ,  Y10T156/10 ,  Y10T428/15

Abstract: A multi-piece-array formed by laminating a plurality of ceramic layers includes: a product region where a plurality of wiring board portions having a rectangular shape in plan view and including cavities are arranged in matrix; a redundant portion that is positioned along a periphery of the product region; and dividing grooves that are formed on a front surface and/or a back surface along a boundary between the wiring board portions and a boundary between the wiring board portion and the redundant portion. A deepest portion of the dividing groove has an arc shape and the dividing groove includes a middle portion, and a width of the deepest portion is greater than a width of the groove inlet and a width of the middle portion is equal to or less than the width of the groove inlet.

Abstract translation: 通过层叠多个陶瓷层而形成的多片阵列包括：在平面图中具有矩形形状并且包括空腔的多个布线板部分以矩阵布置的产品区域; 沿着产品区域的周边定位的冗余部分; 以及沿着布线板部分之间的边界和布线板部分和冗余部分之间的边界形成在前表面和/或后表面上的划分凹槽。 分隔槽的最深部分具有弧形，分隔槽包括中间部分，并且最深部分的宽度大于沟槽入口的宽度，并且中间部分的宽度等于或小于 槽入口宽度。

公开(公告)号：US20130078408A1

公开(公告)日：2013-03-28

申请号：US13699398

申请日：2011-05-28

Applicant: Noritaka Niino ,  Masaya Ochi

Inventor： Noritaka Niino ,  Masaya Ochi

IPC: H05K3/00 ,  B32B3/26 ,  H05K3/28 ,  B32B3/30

CPC classification number: H05K3/0052 ,  B32B3/263 ,  B32B3/30 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/285 ,  H05K2201/017 ,  H05K2201/0909 ,  H05K2201/09909 ,  H05K2203/107 ,  Y10T29/49124 ,  Y10T225/12 ,  Y10T428/15 ,  Y10T428/24488 ,  H01L2924/00

Abstract: A segmentable wiring board includes a ceramic base body, a conductor, a metal plating film and a glass layer, the glass layer having an upwardly-protruding convexity located on the metal plating film. The ceramic base body has a plurality of wiring substrate regions and dividing grooves located in boundaries among the plurality of wiring substrate regions. Moreover, the conductor is located in a periphery of each of the plurality of wiring substrate regions. Moreover, the metal plating film is located on the conductor. Further, the glass layer coveringly extends from an inner surface of each of the dividing grooves of the ceramic base body to the metal plating film.

Abstract translation: 可分割布线板包括陶瓷基体，导体，金属镀膜和玻璃层，玻璃层具有位于金属镀膜上的向上凸出的凸起。 陶瓷基体具有位于多个布线基板区域中的边界中的多个布线基板区域和分割槽。 此外，导体位于多个布线基板区域的每一个的周边。 此外，金属镀膜位于导体上。 此外，玻璃层从陶瓷基体的各分隔槽的内表面覆盖地延伸到金属镀膜。

公开(公告)号：US20120276758A1

公开(公告)日：2012-11-01

申请号：US13512573

申请日：2010-11-12

Applicant: Thomas Donauer ,  David Dussault ,  Harald Stoyan

Inventor： Thomas Donauer ,  David Dussault ,  Harald Stoyan

IPC: H01R12/72

CPC classification number: H05K1/117 ,  F21S4/24 ,  F21V19/003 ,  F21Y2115/10 ,  H05K1/118 ,  H05K3/0052 ,  H05K2201/0909 ,  H05K2201/10106 ,  H05K2201/10189

Abstract: A method for contacting a printed circuit board (1; 14, 15) provided with electrical contacts (8a-8d) on both sides (2, 5), wherein the electrical contacts (8a-8d) on both sides (2, 5) of the printed circuit board (1; 14) are at least partially contacted by at least one ZIF connector (10a, 10b; 13).

Abstract translation: 一种用于接触在两侧（2,5）上设置有电触点（8a-8d）的印刷电路板（1; 14,15）的方法，其中两侧（2,5）上的电触点（8a-8d） 印刷电路板（1; 14）至少部分地被至少一个ZIF连接器（10a，10b; 13）接触。

公开(公告)号：US08258411B2

公开(公告)日：2012-09-04

申请号：US12548933

申请日：2009-08-27

Applicant: Alan E. Wang ,  Kevin C. Olson

Inventor： Alan E. Wang ,  Kevin C. Olson

IPC: H05K1/11

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US20120174390A1

公开(公告)日：2012-07-12

申请号：US13423616

申请日：2012-03-19

Applicant: Yasuyuki YAMAMOTO ,  Kouichi YAMAMOTO ,  Masakatsu MAEDA

Inventor： Yasuyuki YAMAMOTO ,  Kouichi YAMAMOTO ,  Masakatsu MAEDA

IPC: H01R43/00

CPC classification number: H05K3/0052 ,  H01L23/13 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2203/0228 ,  Y10T29/49117 ,  Y10T29/49124 ,  H01L2924/00

Abstract: The present invention provides a method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 μm to 5 μm; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove.

Abstract translation: 本发明提供一种制造衬底芯片的方法，包括以下步骤：将设置在原始衬底上的金属布线图案单元的至少一部分的厚度设定为0.1μm至5μm; 形成用于沿着规划的切割线在陶瓷基板的表面中至少形成裂纹的槽，该切割线穿过金属布线图案单元的一部分，通过使用具有切割刀的切割轮，该切割轮具有大致V形截面 沿着盘旋转轮的圆周部分; 并通过从凹槽的后面施加载荷来切割原始基底。

公开(公告)号：US20120056210A1

公开(公告)日：2012-03-08

申请号：US13218677

申请日：2011-08-26

Applicant: Hideaki Kato ,  Yasutaka Higuchi

Inventor： Hideaki Kato ,  Yasutaka Higuchi

IPC: H01L27/15 ,  H05K1/11

CPC classification number: H05K3/0052 ,  F21V5/007 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K2201/0909 ,  H05K2201/10106

Abstract: A light emitting apparatus capable of increasing the number of substrates formed from one multi-surface pattern substrate and capable of reducing the manufacturing cost. The light emitting apparatus (100) includes a belt-like substrate (101), a light emitting element (102) mounted on the substrate (101), and a luminous flux control member (103) mounted on the substrate (101). The substrate (101) has a pair of fracture surfaces (121) formed at predetermined intervals along a lengthwise direction and formed at both ends in a widthwise direction between luminous flux control members (103) neighboring each other along the lengthwise direction, wherein dimensions W1 and W2 in the widthwise direction between the pair of fracture surfaces (121) are less than a dimension in the widthwise direction of the luminous flux control member (103), and the dimension W2 in the widthwise direction of a part overlapping the luminous flux control member (103) in a plan view is less than the dimension W1 in the widthwise direction between the pair of fracture surfaces.

Abstract translation: 一种能够增加由一个多表面图案基板形成的基板的数量并能够降低制造成本的发光装置。 发光装置（100）包括带状基板（101），安装在基板（101）上的发光元件（102）和安装在基板（101）上的光束控制部件（103）。 基板（101）具有沿长度方向以规定间隔形成的一对断裂面（121），沿着长度方向在彼此相邻的光束控制部件（103）的宽度方向的两端形成，其尺寸W1 并且在一对断裂面（121）之间的宽度方向的W2小于光束控制部件（103）的宽度方向的尺寸，并且与光束控制部重叠的部分的宽度方向的尺寸W2 平面图中的构件（103）小于一对断裂面之间的宽度方向上的尺寸W1。

公开(公告)号：US20120047727A1

公开(公告)日：2012-03-01

申请号：US13291134

申请日：2011-11-08

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K3/36

CPC classification number: H05K3/4691 ,  H05K1/028 ,  H05K1/142 ,  H05K3/0032 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/055 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09263 ,  H05K2201/09509 ,  H05K2201/096

Abstract: A method for manufacturing a flex-rigid wiring board, including preparing a flexible wiring board having a flexible base material and having a conductive layer over the flexible base material, making a cut in the flexible wiring board to form a cut portion, and folding at least one portion of the flexible wiring board using the cut portion to form one or more folding portions such that the flexible wiring board is extended in length, and connecting the flexible wiring board to a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material.

Abstract translation: 一种柔性刚性布线板的制造方法，其特征在于，在柔性基材上形成具有柔性基材的柔性布线基板，并且在柔性基材上形成导电层，在柔性布线基板上切断，形成切断部， 使用所述切割部分的所述柔性布线板的至少一部分形成一个或多个折叠部分，使得所述柔性布线板的长度延伸，并且将所述柔性布线板连接到包括刚性基底材料并具有导电性的刚性布线板 层叠在刚性基材上。

公开(公告)号：US20120030939A1

公开(公告)日：2012-02-09

申请号：US13317108

申请日：2011-10-11

Applicant: Yasunari Ooyabu ,  Jun Ishii ,  Kensuke Nishi

Inventor： Yasunari Ooyabu ,  Jun Ishii ,  Kensuke Nishi

IPC: H05K3/00

CPC classification number: H05K1/0269 ,  G11B5/486 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4644 ,  H05K2201/09063 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/163 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T428/24331

Abstract: A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil.

公开(公告)号：US08059855B2

公开(公告)日：2011-11-15

申请号：US12356628

申请日：2009-01-21

Applicant: Susumu Yamagami

Inventor： Susumu Yamagami

IPC: H04R1/02

CPC classification number: H05K1/141 ,  H04N5/642 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09954 ,  H05K2201/10083 ,  H05K2201/10287

Abstract: A speaker device includes a speaker and a connecting component. The speaker has a pair of input terminals spaced apart with a first predetermined distance therebetween. The connecting component electrically couples the speaker to a printed circuit board. The connecting component has a relay-use printed circuit board and a pair of lead wires. The relay-use printed circuit includes a pair of sub-board portions and a separation portion. The sub-board portions have a pair of terminal holes. The input terminals of the speaker are disposed through the terminal holes, respectively. The separation portion is disposed between the sub-board portions to couple the sub-board portions with a second predetermined distance between the terminal holes of the sub-board portions, and selectively separate the sub-board portions when the first predetermined distance between the input terminals of the speaker is different from the second predetermined distance between the terminal holes of the sub-board portions.

Abstract translation: 扬声器装置包括扬声器和连接部件。 扬声器具有一对输入端子，其间隔开第一预定距离。 连接部件将扬声器电耦合到印刷电路板。 连接部件具有继电器用印刷电路板和一对引线。 继电器用印刷电路包括一对子板部分和分离部分。 子板部分具有一对端子孔。 扬声器的输入端分别设置在端子孔中。 分离部分设置在子板部分之间，以在子板部分的端子孔之间以第二预定距离耦合子板部分，并且当输入之间的第一预定距离时，选择性地分离子板部分 扬声器的端子与子板部分的端子孔之间的第二预定距离不同。

公开(公告)号：US07977580B2

公开(公告)日：2011-07-12

申请号：US12473609

申请日：2009-05-28

Applicant: Seigo Ueno ,  Toshiya Asano

Inventor： Seigo Ueno ,  Toshiya Asano

IPC: H05K1/16

CPC classification number: H05K3/0052 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K3/007 ,  H05K3/4644 ,  H05K2201/0909 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2203/016 ,  Y10T29/49124 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals.

Abstract translation: 中间多层布线板产品包括：多个树脂绝缘层，第一导体层和第二导体层的叠层。 堆叠包括：产品形成区域，包括沿着堆叠的主表面布置的多个产品部分，多个产品部分中的每一个成为多层布线板的产品; 以及围绕产品形成区域的框架部分。 第一导体层形成在多个产品部分的每一个内的多个树脂绝缘层中的至少一个上。 第二导体层形成在框架部分内的多个树脂绝缘层中的至少一个上。 框架部分具有在其厚度方向上穿透框架部分的多个切口，多个切口以基本相等的间隔布置。