公开(公告)号：US20040142154A1

公开(公告)日：2004-07-22

申请号：US10739156

申请日：2003-12-19

Inventor： Satoru Tomekawa ,  Tetsuyoshi Ogura ,  Hiroyoshi Tagi

IPC: B32B003/00

CPC classification number: B32B17/04 ,  B32B15/04 ,  H05K1/0237 ,  H05K1/0366 ,  H05K2201/029 ,  H05K2201/09281 ,  Y10S428/901 ,  Y10T428/24917

Abstract: There is provided a wiring board including an insulation substrate and a wiring layer which is located on at least one main surface of the insulation substrate wherein the insulation substrate comprises a woven fabric which is made of yarns and an organic resin with which the woven fabric is impregnated, and at least one wiring of wirings which form the wiring layer extends over the woven fabric except top portions of the yarns.

Abstract translation: 提供了一种布线板，其包括绝缘基板和布线层，该布线层位于绝缘基板的至少一个主表面上，其中绝缘基板包括由纱线制成的机织织物和机织织物 并且形成布线层的布线的至少一个布线在除了纱线顶部之外的机织织物上延伸。

公开(公告)号：US06441316B1

公开(公告)日：2002-08-27

申请号：US09504712

申请日：2000-02-16

Applicant: Masaaki Kusui

Inventor： Masaaki Kusui

IPC: H05K116

CPC classification number: H05K3/3452 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/10175 ,  H01L2224/16 ,  H01L2224/17104 ,  H01L2224/26175 ,  H01L2224/81385 ,  H01L2924/12044 ,  H05K1/0269 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09281 ,  H05K2201/0989 ,  H05K2201/10734 ,  H05K2203/163 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00012

Abstract: A printed-circuit board of the present invention, comprises a circuit substrate 1; a plurality of patterned wires 3 formed on a surface of said circuit substrate 1; a plurality of lands 2, each land 2 connected to at least one of said patterned wires 3 through an end portion 3a thereof; and a protection layer 6 with a plurality of openings 7, covering the surface of said circuit substrate 1, wherein said land 2 and said end portion 3a connected thereto are exposed in the associated opening 7 of said protection layer 6.

Abstract translation: 本发明的印刷电路板包括电路基板1， 形成在所述电路基板1的表面上的多个图案布线3; 多个焊盘2，每个焊盘2通过其端部3a连接到所述图案化焊丝3中的至少一个; 以及保护层6，其具有覆盖所述电路基板1的表面的多个开口7，其中，所述接地区2和与其连接的所述端部3a暴露在所述保护层6的相关开口7中。

公开(公告)号：US5965843A

公开(公告)日：1999-10-12

申请号：US911508

申请日：1997-08-14

Applicant: Eduard Schonberger ,  Stefan Gruber ,  Hermann Kasowski ,  Heinz Schmidt

Inventor： Eduard Schonberger ,  Stefan Gruber ,  Hermann Kasowski ,  Heinz Schmidt

IPC: H05K1/05 ,  H05K1/00 ,  H05K1/02 ,  H05K7/02 ,  H05K7/06 ,  H05K9/00

CPC classification number: H05K1/0256 ,  H05K1/0254 ,  H05K1/0278 ,  H05K1/028 ,  H05K9/0024 ,  H05K1/0218 ,  H05K1/0284 ,  H05K1/053 ,  H05K2201/0191 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09281 ,  Y10S174/34

Abstract: An injection-molded part (1) includes elevations (2) and/or depressions (12) arranged between integrated printed conductors (4). If the elevations (2) or depressions (12) are uncoated and thus electrically insulating, they increase the effective voltage clearances between the printed conductors (4) and the components (3) arranged next to the printed conductors (4). The geometric distances can then be reduced. Alternatively, by electroconductively coating the elevations (2), electric and magnetic shielding is achieved in a simple manner. A cover (6) is provided as a top of a box which uses elevations (2) as side walls. A tapering portion (5) connects coatings (7,7') of the cover (6) and elevations (2) via a printed conductor (8) running diagonally across the tapering portion (5).

Abstract translation: 注塑部件（1）包括布置在集成印刷导体（4）之间的凸起（2）和/或凹陷（12）。 如果高度（2）或凹陷（12）未涂覆并因此电绝缘，则它们增加印刷导体（4）和布置在印刷导体（4）旁边的部件（3）之间的有效电压间隙。 然后可以减小几何距离。 或者，通过电导涂敷高度（2），以简单的方式实现电磁屏蔽。 盖（6）被设置为使用高度（2）作为侧壁的盒的顶部。 锥形部分（5）通过横向跨越锥形部分（5）运行的印刷导体（8）连接盖（6）的涂层（7,7'）和凸起（2）。

公开(公告)号：US5719752A

公开(公告)日：1998-02-17

申请号：US596624

申请日：1996-02-05

Applicant: Hideo Mori ,  Hisao Tajima ,  Hiroshi Takabayashi ,  Toshiaki Itazawa ,  Masanori Takahashi ,  Kenji Niibori

Inventor： Hideo Mori ,  Hisao Tajima ,  Hiroshi Takabayashi ,  Toshiaki Itazawa ,  Masanori Takahashi ,  Kenji Niibori

IPC: G02F1/13 ,  H05K1/00 ,  H05K1/02 ,  H05K3/36 ,  H05K7/02 ,  G02F1/133

CPC classification number: H05K3/0058 ,  G02F1/13452 ,  H05K1/028 ,  H05K1/02 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/10136 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10681 ,  H05K3/361

Abstract: A liquid crystal apparatus is constituted by a display device for data display, a drive circuit unit for driving the display device, a unit substrate for supplying electric signals to the drive circuit unit, and a tape-form film carrier comprising an insulating substrate and a conductor covered with the insulating substrate for connecting the display device, the drive circuit unit and the unit substrate. A part of the film carrier is provided with a blank portion where the insulating substrate is locally removed to absorb a stress applied to the film carrier. A unit substrate constituting the drive circuit unit is screwed to a supporting member so as to allow a movement thereof relative to the supporting member by use of a space regulating means surrounding the screw shank.

公开(公告)号：US5285057A

公开(公告)日：1994-02-08

申请号：US826137

申请日：1992-01-27

Applicant: Masaru Murohara

Inventor： Masaru Murohara

IPC: B42D15/10 ,  G06K19/077 ,  H05K1/02 ,  H05K1/11 ,  G06K19/06

CPC classification number: G06K19/07703 ,  G06K19/07743 ,  H05K1/0271 ,  H05K1/111 ,  H05K2201/09245 ,  H05K2201/09281 ,  H05K2201/10674 ,  Y02P70/611

Abstract: An IC card has a contact portion which is exposed on one surface of a printed circuit board and has multiple terminals provided to electrically contact an external device. Wirings are arranged on the other surface of the printed circuit board at a position facing the contact portion with the printed circuit board in between, and are printed at least at positions opposite to gaps between the terminals. The arrangement of the wirings thus prevents that portion of the IC card at the gaps from becoming thinner than the other portion of the IC card.

Abstract translation: IC卡具有暴露在印刷电路板的一个表面上的接触部分，并且具有多个用于电接触外部设备的端子。 布线布置在印刷电路板的另一个表面上，位于与印刷电路板之间的接触部分的位置上，并且至少打印在与端子之间的间隙相对的位置处。 因此，布线的布置防止IC卡在间隙处的部分变得比IC卡的另一部分薄。

公开(公告)号：US11744011B2

公开(公告)日：2023-08-29

申请号：US17290304

申请日：2019-10-31

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kenichi Ogawa ,  Naoko Okimoto ,  Mitsutaka Nagae ,  Makiko Sakata ,  Toru Miyoshi

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/12

CPC classification number: H05K1/0283 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/0064 ,  H05K3/1208 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/2009

Abstract: A wiring board on which electronic components are mountable includes a stretchable portion having stretchability and having a first surface and a second surface opposite to the first surface, and an interconnection wire electrically connected to the electronic components mounted on the wiring board. The stretchable portion includes first regions lined up in each of a first direction and a second direction, a second region including first portions and second portions, and a third region surrounded by the second region. The first regions overlap the electronic components. The first portion extends from one of two first regions neighboring each other in the first direction to the other thereof. The second portion extends from one of two first regions neighboring each other in the second direction to the other thereof. The second region has a lower modulus of elasticity than the first region. The interconnection wire overlaps the second region.

公开(公告)号：US11688984B2

公开(公告)日：2023-06-27

申请号：US17351652

申请日：2021-06-18

Applicant: TE Connectivity Germany GmbH

Inventor： Dominik Heiss ,  Philipp Kowarsch ,  Tobias Meissner ,  Frank Wittrock

IPC: H01R4/36 ,  H01R27/02 ,  H01R13/50 ,  H01R13/52 ,  H01R13/66 ,  H01R43/20 ,  H01R43/24 ,  H05K1/18 ,  H01R12/57 ,  H01R12/58

CPC classification number: H01R27/02 ,  H01R13/50 ,  H01R13/521 ,  H01R13/6683 ,  H01R43/205 ,  H01R43/24 ,  H05K1/18 ,  H01R12/57 ,  H01R12/58 ,  H05K2201/09227 ,  H05K2201/09281 ,  H05K2201/10189 ,  H05K2201/10303 ,  H05K2201/2009

Abstract: A high-current contact device includes a first contact element transmitting electrical energy, a circuit carrier, a first data contact transmitting data, and a data interface. The first contact element extends through the circuit carrier along a mating axis at a feedthrough. A conductor track of the circuit carrier electrically connects the first data contact to the data interface. A carrier of the circuit carrier is injection-molded and mechanically supports the first data contact, the conductor track, and the data interface.

公开(公告)号：US20190239946A1

公开(公告)日：2019-08-08

申请号：US16246695

申请日：2019-01-14

Applicant: NIPPON MEKTRON, LTD.

Inventor： Akio YOSHIDA ,  Ryoichi TOYOSHIMA ,  Mitsunori SASAKI ,  Hiroyasu HASEGAWA

IPC: A61B18/14 ,  H05K1/18 ,  H05K1/11 ,  H05K3/06 ,  H05K3/18

CPC classification number: A61B18/1492 ,  A61B2018/00351 ,  A61B2018/00577 ,  A61B2018/00636 ,  H05K1/118 ,  H05K1/18 ,  H05K3/061 ,  H05K3/188 ,  H05K2201/09027 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09827 ,  H05K2201/10151 ,  H05K2203/0117 ,  H05K2203/0723 ,  H05K2203/1545

Abstract: A catheter flexible printed wiring board which includes: a long flexible insulating base member having a tip end portion and a base end portion; and a conductive pattern formed on the flexible insulating base member and extending from the base end portion to the tip end portion, wherein the conductive pattern at the base end portion is wider than the conductive pattern at the tip end portion and thicker than the conductive pattern at the tip end portion.

公开(公告)号：US20160156087A1

公开(公告)日：2016-06-02

申请号：US15017812

申请日：2016-02-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro BABA ,  Kuniaki YOSUI

IPC: H01P3/08

CPC classification number: H01P3/082 ,  H01P3/06 ,  H01P3/085 ,  H05K1/0225 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/147 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/10189

Abstract: A high-frequency signal transmission line includes an element, a linear signal line provided at the element and including a first end and a second end, and at least one ground conductor provided at the element and extending along the signal line. The element includes stacked insulating layers. The ground conductor is positioned opposite to the signal line with the insulating layer positioned therebetween. The ground conductor is a contiguous conductor. The signal line, the ground conductor, and the element generate a characteristic impedance. The signal line includes a first section and a second section. The first section is an uninterrupted section generating a characteristic impedance greater than or equal to a first characteristic impedance at the first end and including the first end. The second section generates a characteristic impedance less than the first characteristic impedance and is adjacent to the first section. The second section is longer than the first section. The signal line is wider in the second section than in the first section.

Abstract translation: 高频信号传输线包括元件，设置在元件处并包括第一端和第二端的线性信号线，以及设置在元件处并沿信号线延伸的至少一个接地导体。 元件包括堆叠的绝缘层。 接地导体与信号线相对设置，绝缘层位于它们之间。 接地导体是连续导体。 信号线，接地导体和元件产生特性阻抗。 信号线包括第一部分和第二部分。 第一部分是不间断部分，其在第一端产生大于或等于第一特征阻抗的特征阻抗并且包括第一端。 第二部分产生小于第一特征阻抗的特性阻抗，并且与第一部分相邻。 第二部分比第一部分长。 信号线在第二部分比第一部分宽。

公开(公告)号：US09288905B2

公开(公告)日：2016-03-15

申请号：US14076667

申请日：2013-11-11

Applicant: Seagate Technology LLC

Inventor： Prapan Aparimarn ,  Chaovalit Chiyatan ,  Piriyakorn Jirawattanakasem ,  Joompondej Bamrungwongtaree

IPC: H05K1/00 ,  H05K1/11 ,  G11B5/48 ,  H05K1/05 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/111 ,  G11B5/486 ,  H05K1/0296 ,  H05K1/056 ,  H05K1/11 ,  H05K3/3436 ,  H05K2201/09236 ,  H05K2201/09281 ,  H05K2201/09727 ,  Y02P70/611

Abstract: A printed circuit substrate may be configured with at least one internal lead designed and shaped to reduce solder bridging. The printed circuit substrate can have a plurality of internal leads that each has a continuously curvilinear boundary that defines an isolation channel. The isolation channel may be configured with a uniform distance that separates a first internal lead from an adjacent second internal lead.

Abstract translation: 印刷电路基板可以配置有至少一个设计和成形以减少焊料桥接的内部引线。 印刷电路基板可以具有多个内部引线，每个内部引线具有限定隔离通道的连续曲线边界。 隔离通道可以配置有将第一内部引线与相邻的第二内部引线分开的均匀距离。