公开(公告)号：US20150288390A1

公开(公告)日：2015-10-08

申请号：US14664954

申请日：2015-03-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MAKI NAKAMURA ,  SUGURU FUJITA

IPC: H04B1/03

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0216 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/043 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/10098 ,  H05K2201/10734 ,  H05K2203/041 ,  Y02P70/611 ,  Y10T29/4913

Abstract: There is provided a radio module including: a first substrate; a second substrate that has a side which is opposed to the first substrate and on which an electronic component is mounted; a conductive member that connects the first substrate and the second substrate and that transmits a signal between the first substrate and the second; at least one first pad that is disposed in the first substrate and connected to the conductive member; and at least one second pad that is disposed in the second substrate and connected to the conductive member, each of the at least one second pad being opposed to each of the at least one first pad and each of larger than the at least one first pad in area.

Abstract translation: 提供了一种无线电模块，包括：第一基板; 第二基板，其具有与第一基板相对的一侧，并且安装有电子部件; 导电构件，其连接所述第一基板和所述第二基板，并且在所述第一基板和所述第二基板之间传递信号; 至少一个第一衬垫，其设置在所述第一衬底中并连接到所述导电构件; 以及至少一个第二垫，其设置在所述第二基板中并连接到所述导电构件，所述至少一个第二垫中的每一个与所述至少一个第一垫中的每一个相对，并且每个第二垫大于所述至少一个第一垫 在区域。

公开(公告)号：US20150245466A1

公开(公告)日：2015-08-27

申请号：US14710670

申请日：2015-05-13

Applicant: Molex Incorporated

Inventor： Mark Alan Bugg

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H01R9/032 ,  H01R12/57 ,  H01R12/62 ,  H01R12/775 ,  H01R13/6474 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/112 ,  H05K1/117 ,  H05K3/3405 ,  H05K2201/09218 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09727 ,  H05K2201/10356

Abstract: A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged thereon in pairs. The contact pads of each pair are spaced apart from each other to provide a pair of points to which cable wire free ends may be terminated, such as by soldering. The spacing of the pads apart from each other in effect reduces to amount of capacitance in the cable wire termination area on the circuit board, thereby reducing the impedance and insertion loss in that area at high frequencies. The contact pads of each pair may be further interconnected together by a thin, conductive trace that extends lengthwise between the contact pads.

Abstract translation: 公开的用于将电子设备连接在一起的桨卡结构。 桨卡采取电路板的形式，其具有成对地布置在其上的多个导电接触垫。 每对的接触垫彼此间隔开以提供一对点，电缆线自由端可以通过焊接方式终止于该点。 彼此分开的焊盘的间隔实际上减少到电路板上的电缆线端接区域中的电容量，从而降低了在该区域在高频下的阻抗和插入损耗。 每对的接触垫可以通过在接触垫之间纵向延伸的薄导电迹线进一步互连在一起。

公开(公告)号：US09099630B2

公开(公告)日：2015-08-04

申请号：US14042123

申请日：2013-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Oh Ahn ,  Jin Se Kim ,  Chang Ho Shin ,  Seok Chan Hong

IPC: H01L33/38 ,  H01L33/62 ,  H05K1/11 ,  H01L33/48 ,  H05K3/34

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/48091 ,  H05K1/111 ,  H05K3/3431 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10106 ,  Y02P70/611 ,  H01L2924/00014

Abstract: The present application provides an electronic apparatus including a substrate including a first electrode pad, a second electrode pad and an intermediate pad each disposed on one surface of the substrate and separated from one another. An electronic device is disposed on the substrate and including a first electrode unit and a second electrode unit. The first electrode unit has an adhesion surface facing the first electrode pad and the intermediate pad. The second electrode unit has an adhesion surface facing the second electrode pad.

Abstract translation: 本申请提供了一种电子设备，包括：衬底，其包括第一电极焊盘，第二电极焊盘和中间焊盘，每个衬垫设置在衬底的一个表面上并彼此分离。 电子设备设置在基板上并且包括第一电极单元和第二电极单元。 第一电极单元具有面向第一电极焊盘和中间焊盘的粘合表面。 第二电极单元具有面向第二电极焊盘的粘附表面。

公开(公告)号：US09095073B2

公开(公告)日：2015-07-28

申请号：US13959949

申请日：2013-08-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuo Hattori ,  Isamu Fujimoto

IPC: H05K1/16 ,  H05K1/18 ,  H01G4/30 ,  H05K1/11 ,  H05K3/34 ,  H01G2/06 ,  H01G4/12 ,  H01G4/232

CPC classification number: H05K1/181 ,  H01G2/065 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09381 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2036 ,  H05K2201/2045 ,  Y02P70/611 ,  Y02P70/613

Abstract: A mounting land structure and a mounting structure include land patterns to be bonded to outer electrodes of a laminated ceramic capacitor. Each of the land patterns includes a first conductor pattern and a second conductor pattern separated from each other in a width direction and a third conductor pattern connecting the first conductor pattern and the second conductor pattern. The first conductor pattern and the second conductor pattern include respective portions to be bonded to first ridgeline portions of the laminated ceramic capacitor provided with the outer electrodes. The third conductor pattern is arranged at a position overlapping the corresponding outer electrode as viewed in a height direction, when the laminated ceramic capacitor is mounted.

Abstract translation: 安装平台结构和安装结构包括与层压陶瓷电容器的外部电极接合的焊盘图案。 每个焊盘图案包括在宽度方向上彼此分离的第一导体图案和第二导体图案，以及连接第一导体图案和第二导体图案的第三导体图案。 第一导体图案和第二导体图案包括要被接合到设置有外部电极的层叠陶瓷电容器的第一脊线部分的各个部分。 当安装层叠陶瓷电容器时，第三导体图案被布置在与高度方向相对的相应的外部电极重叠的位置。

公开(公告)号：US09093767B2

公开(公告)日：2015-07-28

申请号：US13879883

申请日：2011-11-29

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H01R31/06 ,  H01R13/24 ,  H05K3/32 ,  H05K3/40 ,  H05K7/10 ,  H05K3/10 ,  H05K3/12 ,  H05K1/14

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A surface mount electrical interconnect adapted to provide an interface between solder balls on a BGA device and a PCB. The electrical interconnect includes a socket substrate with a first surface, a second surface, and a plurality of openings sized and configured to receive the solder balls on the BGA device. A plurality of electrically conductive contact tabs are bonded to the first surface of the socket substrate so that contact tips on the contact tabs extend into the openings. The contact tips electrically couple with the BGA device when the solder balls are positioned in the openings. Vias are located in the openings that electrically couple the contact tabs to contact pads located proximate the second surface of the socket substrate. Solder balls are bonded to the contact pad that are adapted to electrically and mechanically couple the electrical interconnect to the PCB.

Abstract translation: 适于在BGA器件上的焊球和PCB之间提供界面的表面贴装电互连。 电互连包括具有第一表面，第二表面和多个开口的插座基板，其尺寸和构造用于接收BGA器件上的焊球。 多个导电接触片接合到插座衬底的第一表面，使得接触片上的接触尖端延伸到开口中。 当焊球定位在开口中时，接触尖端与BGA器件电耦合。 通孔位于开口中，其将接触片电耦合到位于插座衬底的第二表面附近的接触垫。 焊球被接合到接触焊盘上，适于电连接和机械地将电互连件耦合到PCB。

公开(公告)号：US09055684B2

公开(公告)日：2015-06-09

申请号：US13575921

申请日：2011-01-17

Applicant: Bingbin Xie ,  Daocheng Pang

Inventor： Bingbin Xie ,  Daocheng Pang

IPC: H01R9/24 ,  H05K1/11 ,  H01R13/03 ,  H01R13/04 ,  H01R13/11

CPC classification number: H05K1/117 ,  H01R13/03 ,  H01R13/04 ,  H01R13/113 ,  H05K2201/09381 ,  H05K2201/09409 ,  H05K2201/09709

Abstract: A contact piece of a gold finger comprises: a first main body segment; a second main body segment; and a transition segment connected to the first main body segment and the second main body segment, respectively, in a vertical direction, in which an upper edge and a lower edge of the transition segment are inclined with respect to a lateral direction respectively. A gold finger and a connector comprising the same are also provided.

Abstract translation: 金手指的接触片包括：第一主体部分; 第二主体段; 以及分别沿着垂直方向连接到第一主体段和第二主体段的过渡段，其中过渡段的上边缘和下边缘分别相对于横向方向倾斜。 还提供了金手指和包括该金手指的连接器。

公开(公告)号：US20150109749A1

公开(公告)日：2015-04-23

申请号：US14243465

申请日：2014-04-02

Applicant: DELTA ELECTRONICS, INC.

Inventor： Ching-Ho Chou ,  Do Chen ,  Shang-Yu Li ,  Chun-Jen Chung

IPC: H05K1/11 ,  H05K3/10

CPC classification number: H05K1/116 ,  H01R4/02 ,  H01R12/53 ,  H01R12/58 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09381 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/10356 ,  Y10T29/49162 ,  Y10T29/532

Abstract: A circuit board assembly includes a printed circuit board, at least one wire, at least one wire fixing device, and a plurality of electronic components. A wire fixing method includes following steps. Firstly, the wire fixing device is inserted into a conductive hole of the printed circuit board. Then, the wire fixing device is fixed on the printed circuit board via a soldering material. Then, a conducting terminal of the wire is introduced into an accommodation space of the wire fixing device through the first opening of the wire fixing device. Then, at least one concave structure is formed in an external surface of a first conducting part of the wire fixing device by a jig. Consequently, the conducting terminal of the wire is fixed on the wire fixing device, and the wire is electrically connected with the printed circuit board through the wire fixing device.

Abstract translation: 电路板组件包括印刷电路板，至少一根导线，至少一个导线固定装置和多个电子部件。 线固定方法包括以下步骤。 首先，将线固定装置插入到印刷电路板的导电孔中。 然后，电线固定装置通过焊接材料固定在印刷电路板上。 然后，通过线固定装置的第一开口将导线的导电端子导入线固定装置的容纳空间。 然后，通过夹具在线固定装置的第一导电部分的外表面中形成至少一个凹形结构。 因此，导线的导电端子固定在线固定装置上，并且导线通过线固定装置与印刷电路板电连接。

公开(公告)号：US09012787B2

公开(公告)日：2015-04-21

申请号：US13626229

申请日：2012-09-25

Applicant: STMicroelectronics S.r.l.

Inventor： Cristiano Gianluca Stella ,  Rosalba Cacciola

IPC: H05K1/16 ,  H05K3/34 ,  H05K1/11 ,  H05K3/30

CPC classification number: H05K3/3468 ,  H01L2224/73203 ,  H01L2924/13091 ,  H05K1/111 ,  H05K3/305 ,  H05K2201/09381 ,  H05K2201/09472 ,  H05K2201/09745 ,  H05K2203/044 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for mounting to the board includes insulating windows that define gluing sites within one or more pins. An electronic system is formed by one or more of such surface mount technology electronic devices mounted to electronic board. The devices are attached using a wave soldering technique that flows through channels formed by the sunken conductive traces.

Abstract translation: 电子板包括具有相对于板的胶合表面至少部分凹陷的上表面的导电迹线。 用于安装到板上的表面贴装技术电子器件包括限定一个或多个引脚内的胶合位置的绝缘窗。 电子系统由安装到电子板的一种或多种这样的表面贴装技术电子装置形成。 这些装置使用波峰焊技术连接，该技术流过由凹陷的导电迹线形成的通道。

公开(公告)号：US20150059162A1

公开(公告)日：2015-03-05

申请号：US14477178

申请日：2014-09-04

Applicant: Nitto Denko Corporation

Inventor： Terukazu IHARA ,  Kouji ICHINOSE

IPC: G01R31/28 ,  H05K3/40 ,  H05K3/10 ,  G01R27/08 ,  G01R1/073

CPC classification number: H05K3/4038 ,  G01R31/2805 ,  G01R31/2813 ,  G11B5/455 ,  G11B5/484 ,  H05K1/0268 ,  H05K1/115 ,  H05K1/116 ,  H05K3/4685 ,  H05K2201/09381 ,  H05K2201/0939 ,  Y10T29/49004

Abstract: First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.

Abstract translation: 第一和第二测量探针分别与第一和第二电极焊盘接触，第三和第四测量探针分别与第一和第二电极焊盘接触。 A电流在包括第一和第二电极焊盘的电流路径和通过第一和第二测量探针的多条线路中流动。 测量当前路径中的电流值，并测量第三和第四测量探针之间的电压值。 基于电流的测量值和电压的测量值检查第一和第二电极焊盘之间的电导率。

公开(公告)号：US20150049444A1

公开(公告)日：2015-02-19

申请号：US14292829

申请日：2014-05-31

Applicant: Sridharan Venk ,  Earl Alfred Picard, JR. ,  Qi Dai ,  Richard Garner

Inventor： Sridharan Venk ,  Earl Alfred Picard, JR. ,  Qi Dai ,  Richard Garner

IPC: H05K1/11 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/111 ,  F21S4/22 ,  F21V21/005 ,  G06K19/07749 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L24/97 ,  H01L33/385 ,  H01L33/44 ,  H01L33/62 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32227 ,  H01L2224/48227 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/12044 ,  H01L2924/1421 ,  H05K1/0209 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/118 ,  H05K1/189 ,  H05K3/0097 ,  H05K3/02 ,  H05K3/28 ,  H05K3/30 ,  H05K2201/051 ,  H05K2201/09381 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/09872 ,  H05K2201/099 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10522 ,  H05K2203/1545 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A conductor pad and a flexible circuit including a conductor pad are provided. The conductor pad includes a first contact region, a second contact region, and a body portion configured to establish a conductive path between the first contact region and the second contact region. The body portion includes a perimeter edge having at least a first convex segment and a second convex with a first non-convex segment disposed between the first convex segment and the second convex segment. A method of constructing a flexible circuit to facilitate roll-to-roll manufacturing of the flexible circuit is also provided.

Abstract translation: 提供导体焊盘和包括导体焊盘的柔性电路。 导体焊盘包括第一接触区域，第二接触区域和被配置成在第一接触区域和第二接触区域之间建立导电路径的主体部分。 主体部分包括具有至少第一凸起部分的周边边缘和设置在第一凸起部分和第二凸起部分之间的具有第一非凸起部分的第二凸起部分。 还提供了一种构建柔性电路以便于柔性电路的卷对卷制造的方法。