公开(公告)号：US08169071B2

公开(公告)日：2012-05-01

申请号：US13019562

申请日：2011-02-02

Applicant: KiYoun Jang ,  SungSoo Kim ,  YongHee Kang

Inventor： KiYoun Jang ,  SungSoo Kim ,  YongHee Kang

IPC: H01L23/04

CPC classification number: H01L23/49811 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49827 ,  H01L24/06 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K3/108 ,  H05K3/205 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/097 ,  H05K2201/09736 ,  H05K2203/049 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A semiconductor device includes a substrate, a first recessed conductive layer embedded and recessed into a first surface of the substrate, and a first raised conductive layer disposed above the first surface. A first vertical offset exists between an upper surface of the first recessed conductive layer and an upper surface of the first raised conductive layer. The device includes a second recessed conductive layer embedded and recessed into a second surface of the substrate. The second surface of the substrate is opposite the first surface. The device includes a second raised conductive layer disposed beneath the second surface and an interconnect structure disposed on the first recessed and raised conductive layers and the second recessed and raised conductive layers. A second vertical offset exists between a lower surface of the second recessed conductive layer and a lower surface of the second recessed conductive layer.

Abstract translation: 半导体器件包括衬底，嵌入并凹入到衬底的第一表面中的第一凹陷导电层和设置在第一表面上方的第一凸起导电层。 在第一凹陷导电层的上表面和第一凸起导电层的上表面之间存在第一垂直偏移。 该器件包括嵌入并凹入到衬底的第二表面中的第二凹陷导电层。 基板的第二表面与第一表面相对。 该装置包括设置在第二表面下方的第二凸起导电层和设置在第一凹入和凸起导电层上的互连结构和第二凹入和凸起导电层。 在第二凹陷导电层的下表面和第二凹陷导电层的下表面之间存在第二垂直偏移。

公开(公告)号：US08143720B2

公开(公告)日：2012-03-27

申请号：US12523029

申请日：2008-02-05

Applicant: Frank Lambrecht

Inventor： Frank Lambrecht

IPC: H01L23/48

CPC classification number: H01L23/48 ,  G11C5/025 ,  G11C5/04 ,  G11C7/1057 ,  G11C7/1084 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/097 ,  H05K2201/10159 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00

Abstract: The semiconductor module includes a plurality of memory die on a first side of a substrate and a plurality of buffer die on a second side of the substrate. Each of the memory die is disposed opposite and electrically coupled to one of the buffer die.

Abstract translation: 半导体模块包括在衬底的第一侧上的多个存储器管芯和在衬底的第二侧上的多个缓冲管芯。 每个存储器管芯相对设置并电耦合到缓冲管芯之一。

公开(公告)号：US08054643B2

公开(公告)日：2011-11-08

申请号：US12320641

申请日：2009-01-30

Applicant: Wataru Tsukada

Inventor： Wataru Tsukada

IPC: H05K7/02

CPC classification number: H05K1/181 ,  H05K2201/09245 ,  H05K2201/097 ,  H05K2201/10159 ,  H05K2201/10689 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A semiconductor module includes a plurality of rectangular shaped semiconductor devices which are arranged in two rows such that each pair of adjacent semiconductor devices is in orientations differed by 90 degrees from each other. A plurality of wirings connect the semiconductor devices included in one of the two rows to the semiconductor devices included in the other row such that the semiconductor devices arranged in the same orientations are connected to each other.

Abstract translation: 半导体模块包括多个矩形半导体器件，它们被布置成两行，使得每对相邻的半导体器件的取向彼此相差90度。 多个布线将包括在两行之一中的半导体器件连接到另一行中包括的半导体器件，使得以相同取向排列的半导体器件彼此连接。

公开(公告)号：US20110163823A1

公开(公告)日：2011-07-07

申请号：US12983073

申请日：2010-12-31

Applicant: Dae-Hyun PARK ,  Han Kim ,  Myung-Sam Kang

Inventor： Dae-Hyun PARK ,  Han Kim ,  Myung-Sam Kang

IPC: H04B3/28

CPC classification number: H05K1/0236 ,  H05K1/165 ,  H05K2201/09309 ,  H05K2201/09627 ,  H05K2201/097

Abstract: In an electromagnetic bandgap structure including a plurality of conductive plates and a stitching via part, in which the plurality of conductive plates are placed on a first planar surface, the stitching via part includes a first via having one end part connected to one of the two conductive plates, a second via having one end part connected to the other of the two conductive plates, a spiral connector forming a spirally-shaped serial link structure on at least one vertical planar surface that is perpendicular to the first planar surface, a first conductive pattern connecting one end part of the spiral connector and the other end part of the first via with each other and a second conductive connecting pattern connecting the other end part of the spiral connector and the other end part of the second via with each other.

Abstract translation: 在包括多个导电板和缝合通孔部分的电磁带隙结构中，其中多个导电板被放置在第一平坦表面上，该缝合通孔部分包括第一通孔，该第一通孔的一个端部连接到两个 导电板，具有连接到两个导电板中的另一个的一个端部的第二通孔，在垂直于第一平坦表面的至少一个垂直平面上形成螺旋形串联结构的螺旋形连接器，第一导电 螺旋连接器的一个端部和第一通孔的另一个端部彼此连接的图案，以及将螺旋形连接器的另一个端部和第二通孔的另一个端部彼此连接的第二导电连接图案。

公开(公告)号：US07940157B2

公开(公告)日：2011-05-10

申请号：US11754840

申请日：2007-05-29

Applicant: Wei-Ting Chen ,  Chang-Sheng Chen ,  Chin-Sun Shyu ,  Chang-Lin Wei

Inventor： Wei-Ting Chen ,  Chang-Sheng Chen ,  Chin-Sun Shyu ,  Chang-Lin Wei

IPC: H01C1/012

CPC classification number: H01C17/065 ,  H01C17/281 ,  H05K1/167 ,  H05K2201/097 ,  H05K2203/1453 ,  Y10T29/49082

Abstract: A resistor layout structure and a manufacture method thereof are provided. The resistor layout structure includes a substrate, a plurality of metals, and a plurality of resistor lumps. The plurality of metals is disposed on the substrate. The plurality of first resistor lumps is disposed on the substrate. The metals are used as a supporting structure during the disposing process. Besides, the metals are interlaced and connected in series connected with the resistor lumps to form the resistor. Therefore, the present invention decreases the resistance variability of the resistor.

Abstract translation: 提供电阻器布局结构及其制造方法。 电阻器布局结构包括衬底，多个金属和多个电阻器块。 多个金属设置在基板上。 多个第一电阻器块设置在基板上。 金属在配置过程中用作支撑结构。 此外，金属是交错的并且与电阻器块串联连接以形成电阻器。 因此，本发明降低了电阻器的电阻变化。

公开(公告)号：US07938311B2

公开(公告)日：2011-05-10

申请号：US11495214

申请日：2006-07-28

Applicant: Francois Marion

Inventor： Francois Marion

IPC: B23K31/02

CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/1403 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/81143 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/381 ,  H05K2201/094 ,  H05K2201/097 ,  H05K2203/0465 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00014

Abstract: The hybridization method provides a first component with first pads and a second component with second pads for accommodating protrusions of a fusible material, so that the first pads and second pads line up two by two in order to form pairs of pads to interconnect the two components when aligned. Then placing the first and second components one on top of the other to form an assembly where some of the protrusions of fusible material on the first and/or second pads respectively consist of at least three larger-sized protrusions, especially taller protrusions, so that before the temperature is increased to the hybridization temperature of the fusible material, the component only rests on the larger protrusions.

Abstract translation: 杂交方法提供了具有第一焊盘的第一部件和具有用于容纳可熔材料的突起的第二焊盘的第二部件，使得第一焊盘和第二焊盘两排二排，以便形成一对焊盘以互连两个部件 对齐时。 然后将第一和第二部件放置在另一个之上，以形成组件，其中第一和/或第二垫上的可熔材料的一些突起分别由至少三个较大尺寸的突起，特别是较高的突起组成，使得 在温度升高到易熔材料的杂交温度之前，该部件仅在更大的突起上。

公开(公告)号：US07936565B2

公开(公告)日：2011-05-03

申请号：US12615064

申请日：2009-11-09

Applicant: Kiyomi Muro ,  Sadahiro Tamai

Inventor： Kiyomi Muro ,  Sadahiro Tamai

IPC: H05K1/00

CPC classification number: H05K1/118 ,  G06F1/1616 ,  G06F1/1658 ,  H05K1/0215 ,  H05K1/028 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/097 ,  Y10T29/53157 ,  Y10T29/53261

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.

Abstract translation: 根据一个实施例，一种电子设备包括壳体，容纳在所述软管中的电路板，并且包括位于与所述第一表面相对的一侧的第一表面和第二表面，具有弹性的柔性印刷线路板，电连接到 所述电路板从所述电路板的所述第一表面提供到所述第二表面;以及按压部，所述按压部在弯曲时由柔性印刷布线板的一部分形成，并且将柔性印刷布线板朝向第一表面按压 使其与壳体的与电路板的第一表面相对的内表面接触。

公开(公告)号：US07842883B2

公开(公告)日：2010-11-30

申请号：US12262413

申请日：2008-10-31

Applicant: Jun Youl Lim

Inventor： Jun Youl Lim

IPC: H01B11/02 ,  H05K9/00 ,  H04B3/28

CPC classification number: H05K1/0228 ,  H05K1/0245 ,  H05K2201/09263 ,  H05K2201/097

Abstract: A power line arrangement includes a first power line and a second power line which crosses the first power line at least once. The first and second power lines are connected to a same power supply, and current in the first power line flows in a different direction from current in the second power line at an area where the first and second power lines cross.

Abstract translation: 电力线装置包括至少一次穿过第一电力线的第一电力线和第二电力线。 第一和第二电源线连接到相同的电源，并且第一电力线中的电流在第一和第二电力线交叉的区域沿与第二电力线中的电流不同的方向流动。

公开(公告)号：US20100254108A1

公开(公告)日：2010-10-07

申请号：US12604008

申请日：2009-10-22

Applicant: Seong-II KIM ,  Jung-Hoon KU ,  In-Han JEON ,  Jun-Ho HWANG ,  Eun-Jeong KIM ,  Choong-Hwa KIM ,  Ri-Na YOU

Inventor： Seong-II KIM ,  Jung-Hoon KU ,  In-Han JEON ,  Jun-Ho HWANG ,  Eun-Jeong KIM ,  Choong-Hwa KIM ,  Ri-Na YOU

IPC: H05K7/00 ,  H05K1/02

CPC classification number: H05K1/181 ,  G09G3/3696 ,  G09G2300/0426 ,  H05K1/0231 ,  H05K1/0271 ,  H05K2201/0949 ,  H05K2201/097 ,  H05K2201/10015 ,  H05K2201/10128 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A display device includes a display panel on which an image is displayed, and a driving board. The driving board includes a substrate, a first multi-layer ceramic condenser disposed on the substrate and to which a first current is supplied, and a second multi-layer ceramic condenser disposed substantially parallel with the first multi-layer ceramic condenser and to which a second current is supplied. The first current and the second current are supplied to the first multi-layer ceramic condenser and the second multi-layer ceramic condenser, respectively, in opposite directions.

Abstract translation: 显示装置包括显示图像的显示面板和驱动板。 驱动板包括基板，设置在基板上并且第一电流被供应的第一多层陶瓷电容器和与第一多层陶瓷电容器基本平行的第二多层陶瓷电容器， 提供第二电流。 第一电流和第二电流分别以相反的方向提供给第一多层陶瓷电容器和第二多层陶瓷电容器。

公开(公告)号：US20100226103A1

公开(公告)日：2010-09-09

申请号：US12615064

申请日：2009-11-09

Applicant: Kiyomi MURO ,  Sadahiro TAMAI

Inventor： Kiyomi MURO ,  Sadahiro TAMAI

IPC: H05K1/00

CPC classification number: H05K1/118 ,  G06F1/1616 ,  G06F1/1658 ,  H05K1/0215 ,  H05K1/028 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/09081 ,  H05K2201/09172 ,  H05K2201/097 ,  Y10T29/53157 ,  Y10T29/53261

Abstract: According to one embodiment, an electronic apparatus includes a housing, a circuit board accommodated in the hosing and including a first surface and a second surface located on an opposite side to the first surface, a flexible printed wiring board having an elasticity, electrically connected to the circuit board and provided from the first surface of the circuit board over to the second surface, and a pressing portion formed from a part of the flexible printed wiring board as it is bent, and pressing the flexible printed wiring board towards the first surface as it is brought into contact with the inner surface of the housing, which opposes the first surface of the circuit board.

Abstract translation: 根据一个实施例，一种电子设备包括壳体，容纳在所述软管中的电路板，并且包括位于与所述第一表面相对的一侧的第一表面和第二表面，具有弹性的柔性印刷线路板，电连接到 所述电路板从所述电路板的所述第一表面提供到所述第二表面;以及按压部，所述按压部在弯曲时由柔性印刷布线板的一部分形成，并且将柔性印刷布线板朝向第一表面按压 使其与壳体的与电路板的第一表面相对的内表面接触。