公开(公告)号：US08294561B2

公开(公告)日：2012-10-23

申请号：US12598890

申请日：2008-05-07

Applicant: Martin Strahm ,  Michael Geiser ,  Pierre Gandel ,  Guillaume Loussert

Inventor： Martin Strahm ,  Michael Geiser ,  Pierre Gandel ,  Guillaume Loussert

IPC: B60Q1/00

CPC classification number: H01R12/58 ,  H01R12/57 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03 ,  H05K3/325 ,  H05K3/3447 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10659

Abstract: The present invention relates to a dashboard indicator module comprising, in a casing, a rotary motor, an output shaft, mechanical reduction device associated with the motor, at least one electrical supply coil, electrical connection tabs linked to the coils leaving the casing and electrical contact elements, characterized in that the electrical contact elements can be fitted on the connection tabs in order to produce solderless connectors on the printed circuit or even removed from the connection tabs in order to allow the connection tabs of the motor to be soldered directly to the printed circuit.

Abstract translation: 本发明涉及一种仪表板指示器模块，其包括在壳体中的旋转马达，输出轴，与马达相关联的机械减速装置，至少一个供电线圈，连接到离开外壳的线圈的电连接翼片和电气 接触元件，其特征在于，电接触元件可以安装在连接接片上，以便在印刷电路上产生无焊接连接器，或者甚至从连接接线片上移除，以便允许电动机的连接接头直接焊接到 印刷电路

公开(公告)号：US20120217050A1

公开(公告)日：2012-08-30

申请号：US13139099

申请日：2010-11-16

Applicant: Tomohisa Kurita ,  Hideo Yumi ,  Tatsuya Nakamura ,  Kenji Konda ,  Hiroki Kitano

Inventor： Tomohisa Kurita ,  Hideo Yumi ,  Tatsuya Nakamura ,  Kenji Konda ,  Hiroki Kitano

IPC: H05K1/18

CPC classification number: H01R12/57 ,  H01R13/2442 ,  H01R13/245 ,  H01R43/205 ,  H05K1/0215 ,  H05K9/0016 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2203/0195 ,  Y02P70/611

Abstract: A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.

Abstract translation: 触点包括焊接部分，弹性接触部分和抽吸部分。 焊接接合部的下表面是要焊接到导体图案的焊料接合面。 弹性接触部分连接到焊接接合部分的一端并在焊接部分上弯曲。 当与导电构件接触时，弹性接触部分被弹性变形地压靠在导电构件上。 吸引部分独立于弹性接触部分连接到焊接接合部分。 吸引部分为自动安装机的吸嘴的吸附面，其顶端平行于弹性接触部分的导电部件侧的焊料接合部分的下表面。

公开(公告)号：US08123965B2

公开(公告)日：2012-02-28

申请号：US12170272

申请日：2008-07-09

Applicant: Yung-Yu Hsu ,  Shyi-Ching Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

Inventor： Yung-Yu Hsu ,  Shyi-Ching Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

IPC: B44C1/22 ,  C25F3/00 ,  C03C25/68

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/742 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/111 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/368 ,  H05K2201/10242 ,  H05K2201/10265 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic device; a second surface, connected to a device selected form the group consisting of the substrate and the electronic device; a supporting part, sandwiched between and interconnecting the first and the second surfaces while enabling the areas of the two ends of the supporting part to be small than those of the first and the second surfaces in respective; and a buffer, arranged surrounding the supporting part for absorbing and buffering stresses.

Abstract translation: 公开了具有应力缓冲能力的互连结构，其包括：第一表面，连接到由基板和电子器件组成的组中选择的器件; 第二表面，连接到从由所述基板和所述电子装置组成的组中选择的装置; 支撑部分，夹持在第一和第二表面之间并互相连接，同时使得支撑部分的两个端部的区域相对于第一和第二表面的面积小; 以及缓冲器，其布置成围绕所述支撑部分以吸收和缓冲应力。

公开(公告)号：US08112060B2

公开(公告)日：2012-02-07

申请号：US12494318

申请日：2009-06-30

Applicant: Kim-Yeung Sip

Inventor： Kim-Yeung Sip

IPC: H04B1/08

CPC classification number: H05K1/0239 ,  H05K1/144 ,  H05K2201/1003 ,  H05K2201/10083 ,  H05K2201/10265

Abstract: An electronic device includes a main body and an audio module. The main body includes a first circuit board and a first coil. The first circuit board is configured for processing electrical signals. The first coil is electrically connected with the first circuit board, and configured to convert electrical signals with electromagnetic waves. The audio module includes a second circuit, a speaker, a microphone, and a second coil. The second circuit board is configured for processing electrical signals. The speaker is electrically connected with the second circuit board, and produces a sound according to electrical signals. The microphone is electrically connected with the second circuit board and configured to detect sound wave and generate electrical signals. The second coil is electrically connected with the second circuit board, and configured to convert electromagnetic waves with electrical signal.

Abstract translation: 电子设备包括主体和音频模块。 主体包括第一电路板和第一线圈。 第一个电路板被配置用于处理电信号。 第一线圈与第一电路板电连接，并且被配置为用电磁波转换电信号。 音频模块包括第二电路，扬声器，麦克风和第二线圈。 第二电路板被配置用于处理电信号。 扬声器与第二电路板电连接，并根据电信号产生声音。 麦克风与第二电路板电连接并被配置为检测声波并产生电信号。 第二线圈与第二电路板电连接，并且被配置为用电信号转换电磁波。

公开(公告)号：US08057248B1

公开(公告)日：2011-11-15

申请号：US12979687

申请日：2010-12-28

Applicant: Neil S. Sherman

Inventor： Neil S. Sherman

IPC: H01R13/62

CPC classification number: H01R12/714 ,  H01R12/585 ,  H01R12/7023 ,  H01R12/7064 ,  H01R13/639 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10598 ,  H05K2201/10628

Abstract: A connector for mounting to a circuit board for comprising a connector device with a body, a plurality of alignment members, and one or more contact elements, wherein the alignment members extend through a plurality of alignment holes of the printed circuit board from the first surface and past the second surface of the circuit board and wherein the contact elements engage one more contact pads on the first surface of the circuit board, and a separate retention device having a supporting element and a plurality of fixed sockets is positioned along the second surface of the printed circuit board to receive the alignment members of the connector device therein so that the circuit board is positioned between the body of the connector device and the retention device to temporarily or permanently retain the contact elements of the connector device in contact with the contact pads of the circuit board.

Abstract translation: 一种用于安装到电路板的连接器，包括具有本体的连接器装置，多个对准构件和一个或多个接触元件，其中对准构件从第一表面延伸穿过印刷电路板的多个对准孔 并且经过电路板的第二表面，并且其中接触元件与电路板的第一表面上的多个接触焊盘接合，并且具有支撑元件和多个固定插座的单独保持装置沿着第二表面 所述印刷电路板用于接收所述连接器装置的对准部件，使得所述电路板位于所述连接器装置的主体和所述保持装置之间，以暂时或永久性地将所述连接器装置的接触元件与所述接触垫接触 的电路板。

公开(公告)号：US08044303B2

公开(公告)日：2011-10-25

申请号：US12098661

申请日：2008-04-07

Applicant: Yu-Huan Qiu ,  Wen-Kang Fan

Inventor： Yu-Huan Qiu ,  Wen-Kang Fan

IPC: H05K1/03

CPC classification number: H05K3/222 ,  H05K1/0237 ,  H05K3/0005 ,  H05K2201/09236 ,  H05K2201/10265

Abstract: A trace carrier is provided. The trace carrier includes a first insulating tube, a second insulating tube, a trace pair, and a sealed hollow insulating cylinder. The trace pair is passing through the first insulating tube and the second insulating tube, and is coiled up in an inner space of the first insulating tube and the second insulating tube. The sealed hollow insulating cylinder encapsulates the first insulating tube, the second insulating tube, and the trace pair, but the four terminals of the trace pair are exposed to the outside of the sealed hollow insulating cylinder.

Abstract translation: 提供轨迹载体。 迹线载体包括第一绝缘管，第二绝缘管，迹线对和密封中空绝缘筒。 轨迹对通过第一绝缘管和第二绝缘管，并且被卷绕在第一绝缘管和第二绝缘管的内部空间中。 密封的中空绝缘圆柱体封装第一绝缘管，第二绝缘管和迹线对，但是迹线对的四个端子暴露于密封的中空绝缘筒的外部。

公开(公告)号：US20100321915A1

公开(公告)日：2010-12-23

申请号：US12740938

申请日：2008-11-03

Applicant: Ralf Wendler ,  Jorg Romahn ,  Annette Bolcke

Inventor： Ralf Wendler ,  Jorg Romahn ,  Annette Bolcke

IPC: H05K1/11

CPC classification number: H05K3/325 ,  H01R12/52 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/09381 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10265

Abstract: An arrangement including a first circuit board having a contact surface for contacting of a connecting element, a second circuit board, and a connecting element. The contact surface has a central contact point and a concentric ring surrounding the central contact point. The connecting element which is electrically contacted at a first side with the second circuit board and which at a second side in opposite relationship to the first side includes a first spring element at least one second spring element. The first spring element is electrically contacted with the central contact point of the first circuit board and the at least one second spring element is electrically contacted with the concentric ring of the first circuit board.

Abstract translation: 一种装置，包括具有用于接触连接元件，第二电路板和连接元件的接触表面的第一电路板。 接触表面具有中心接触点和围绕中心接触点的同心环。 在第一侧与第二电路板电接触并且在与第一侧相反的第二侧的连接元件包括至少一个第二弹簧元件的第一弹簧元件。 第一弹簧元件与第一电路板的中心接触点电接触，并且至少一个第二弹簧元件与第一电路板的同心环电接触。

公开(公告)号：US07810701B2

公开(公告)日：2010-10-12

申请号：US12411254

申请日：2009-03-25

Applicant: Shinichi Nagano ,  Shin Yoshida

Inventor： Shinichi Nagano ,  Shin Yoshida

IPC: B23K1/00 ,  B23K31/02

CPC classification number: H01R43/0214 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81201 ,  H01L2224/81206 ,  H01L2224/81222 ,  H01L2224/81234 ,  H01L2224/81385 ,  H01L2224/81464 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/19042 ,  H01R13/2421 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/42 ,  H05K2201/0311 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T156/10 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2224/83851 ,  H01L2924/00

Abstract: A connection electrode that is formed of solder on an electronic component side and a tip portion of an elastic contact each other at a contact portion. Regarding the elastic contact, a resistive layer is formed in the tip portion, and the tip portion is placed in a clearance of an induction coil. When a predetermined high-frequency current is passed through the induction coil, electromagnetic induction causes the resistive layer to generate heat. Solder that forms the connection electrode is melt, and flows onto the tip portion of the elastic contact. Thus, the tip portion of the elastic contact and the connection electrode can be strongly bonded together at the contact portion that is a single point therebetween.

Abstract translation: 在电子部件侧由焊料形成的连接电极和在接触部分处弹性接触的前端部。 关于弹性接触，在前端部形成电阻层，将前端部配置在感应线圈的间隙内。 当预定的高频电流通过感应线圈时，电磁感应使电阻层产生热量。 形成连接电极的焊料熔化，并流到弹性接触件的前端部。 因此，弹性接触件的顶端部分和连接电极可以在它们之间的单点的接触部分处牢固地结合在一起。

公开(公告)号：US20100164497A1

公开(公告)日：2010-07-01

申请号：US12649425

申请日：2009-12-30

Applicant: Klaus Huber ,  Stefan Pott

Inventor： Klaus Huber ,  Stefan Pott

IPC: G01R33/44 ,  H01F7/06

CPC classification number: H05K1/141 ,  G01R33/34007 ,  G01R33/36 ,  H01F17/02 ,  H01F21/04 ,  H01F27/292 ,  H01F41/045 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/049 ,  H05K2201/10265 ,  H05K2203/162 ,  H05K2203/171 ,  Y10T29/4902

Abstract: In a device and method to install a coil in a circuit, the coil is installed on a substrate and the inductance value of the coil installed on the substrate is adjusted with a test circuit board. The substrate is then installed in the circuit. This enables an efficient installation of the coil.

Abstract translation: 在将线圈安装在电路中的装置和方法中，将线圈安装在基板上，并且用测试电路板调整安装在基板上的线圈的电感值。 然后将衬底安装在电路中。 这使得能够有效地安装线圈。

公开(公告)号：US07708584B2

公开(公告)日：2010-05-04

申请号：US11756072

申请日：2007-05-31

Applicant: Martin Hierholzer ,  Patrick Baginski ,  Michael Hornkamp ,  Uwe Jansen

Inventor： Martin Hierholzer ,  Patrick Baginski ,  Michael Hornkamp ,  Uwe Jansen

IPC: H01R13/00

CPC classification number: H05K3/325 ,  H01L23/051 ,  H01L23/4006 ,  H01L24/72 ,  H01L25/072 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K2201/10265 ,  H05K2201/10409 ,  H01L2924/00

Abstract: A semiconductor circuit arrangement is disclosed. In one embodiment, a semiconductor module is attached to a board using a screw, with a mechanical and electrical contact being made between module contacts on the semiconductor module and associated board contacts on the board at the same time by attachment using the screw.

Abstract translation: 公开了一种半导体电路装置。 在一个实施例中，使用螺钉将半导体模块附接到板上，通过使用螺钉的附接，在半导体模块上的模块触点和板上的相关板触点之间同时进行机械和电接触。