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    Printed Circuit Board
    31.
    发明申请
    Printed Circuit Board 审中-公开
    印刷电路板

    公开(公告)号：US20150334841A1

    公开(公告)日：2015-11-19

    申请号：US14653228

    申请日：2013-12-12

    Applicant: AT&S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT

    Inventor： Gerhard SCHMID

    IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05K1/183 ,  H01L2224/16227 ,  H01L2924/15156 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/10727 ,  H05K2201/10734

    Abstract: A multilayer printed circuit board comprising conductive layers separated by dielectric insulation layers, at least one conductive layer being patterned and parts of conducting layers being interconnected by means of vias traversing insulation layers, and at least one component having terminals electrically connected with conducting layers is countersunk at least partly in a cavity having a floor and side walls, whereby a first component is completely countersunk in the cavity with its terminals connected face-down directly with contacts on the floor of the cavity and at least one further component is stacked above the first component, whereby an edge of the lower surface of the second component projecting over the upper surface area of the at least one further component is provided with terminals being connected directly face-down with contacts of the circuit board arranged on a level higher than the floor of the cavity.

    Abstract translation: 一种多层印刷电路板，包括由电介质绝缘层分隔的导电层，至少一个导电层被图案化，并且导电层的部分通过穿过绝缘层的通孔互连，并且具有与导电层电连接的端子的至少一个部件是埋头 至少部分地在具有地板和侧壁的空腔中，由此第一部件在空腔中完全沉入其中，其端子直接连接到空腔底板上的触点，并且至少一个另外的部件堆叠在第一 从而在所述至少一个另外的部件的上表面区域上突出的所述第二部件的下表面的边缘设置有直接面向下连接的端子，所述端子布置在高于所述底板的电平上的所述电路板的触点 的腔。

    Docking device for a hard disk
    32.
    发明授权
    Docking device for a hard disk 有权
    对接硬盘的设备

    公开(公告)号：US09190113B2

    公开(公告)日：2015-11-17

    申请号：US13377467

    申请日：2010-07-21

    Applicant: Didier Venom ,  Dominique Susini ,  Grégory Sonjon

    Inventor： Didier Venom ,  Dominique Susini ,  Grégory Sonjon

    IPC: H05K7/20 ,  G11B33/14 ,  G06F1/16

    CPC classification number: G11B33/1413 ,  G06F1/1658 ,  G11B33/142 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/20727 ,  H05K2201/09072

    Abstract: A docking device for a hard disk has a protective box housing an electronic unit including a printed circuit card and a fan arranged in or in the vicinity of an opening formed in a first wall of the protective box. The box also has a location for a hard disk. The fan is arranged in the vicinity of an edge of the printed circuit card so that the air stream driven by said fan sweeps over both main faces of the printed circuit card. The guide is designed to guide at least a portion of the air stream driven by the fan directly to the location for a hard disk.

    Abstract translation: 用于硬盘的对接装置具有容纳电子单元的保护盒，该电子单元包括布置在形成在保护盒的第一壁中的开口中或附近的印刷电路卡和风扇。 该盒子还有一个硬盘的位置。 风扇布置在印刷电路卡的边缘附近，使得由所述风扇驱动的空气流扫过印刷电路卡的两个主面。 引导件被设计成将由风扇驱动的空气流的至少一部分直接引导到用于硬盘的位置。

    SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
    33.
    发明申请
    SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF 审中-公开
    基板结构及其制造方法

    公开(公告)号：US20150296618A1

    公开(公告)日：2015-10-15

    申请号：US14287071

    申请日：2014-05-26

    Applicant: Yu-Chi Huang ,  Kuo-Tung Lin

    Inventor： Yu-Chi Huang ,  Kuo-Tung Lin

    IPC: H05K1/11 ,  H05K3/32 ,  B32B37/26 ,  H05K13/04 ,  B32B37/24 ,  B32B38/04 ,  H05K1/18 ,  H05K3/00

    CPC classification number: H05K3/007 ,  B32B2457/08 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85005 ,  H01L2924/15151 ,  H01L2924/15313 ,  H05K3/3421 ,  H05K2201/0154 ,  H05K2201/09072 ,  H05K2203/0156 ,  H01L2924/00014

    Abstract: A substrate structure including a carrier and a substrate is provided. The carrier includes a release layer, a dielectric layer and a metal layer. The dielectric layer is disposed between the release layer and the metal layer. The substrate includes a packaging region and a peripheral region. The peripheral region is connected to the packaging region and surrounds the packaging region. The peripheral region or the packaging region has a plurality of through holes. The substrate is disposed on the carrier. The release layer is located between the substrate and the dielectric layer. The release layer and the dielectric layer are filled in the through hole such that the substrate is separably attached to the carrier.

    Abstract translation: 提供了包括载体和基板的基板结构。 载体包括释放层，电介质层和金属层。 介电层设置在剥离层和金属层之间。 基板包括封装区域和外围区域。 周边区域连接到包装区域并且围绕包装区域。 周边区域或包装区域具有多个通孔。 衬底设置在载体上。 释放层位于基底和电介质层之间。 释放层和电介质层填充在通孔中，使得基板可分离地附接到载体上。

    Wiring substrate
    35.
    发明授权
    Wiring substrate 有权
    接线基板

    公开(公告)号：US09119301B2

    公开(公告)日：2015-08-25

    申请号：US14018644

    申请日：2013-09-05

    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

    Inventor： Daisuke Takizawa

    IPC: H05K1/18 ,  H05K1/16 ,  H05K7/00 ,  H05K1/02 ,  H01L23/498 ,  H05K3/46 ,  H01L23/50 ,  H05K3/00 ,  H05K3/30

    CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16225 ,  H01L2924/1531 ,  H05K1/185 ,  H05K3/0026 ,  H05K3/005 ,  H05K3/303 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/09072 ,  H05K2201/09854 ,  H05K2201/10636 ,  Y02P70/611

    Abstract: A wiring substrate is provided with a substrate core including a first main surface, a second main surface, and a through hole. An electronic component is arranged in the through hole. A projection projects from a wall of the through hole toward a connection terminal of the electronic component. An insulator is filled between the wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The electronic component includes an electronic component body and the connection terminal formed on a side of the electronic component body. The connection terminal of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole.

    Abstract translation: 布线基板设置有包括第一主表面，第二主表面和通孔的基底芯。 电子部件布置在通孔中。 突起从通孔的壁朝向电子部件的连接端子突出。 绝缘体填充在通孔的壁和电子部件之间。 第一绝缘层覆盖电子部件和第一主表面。 第二绝缘层覆盖电子部件和第二主表面。 电子部件包括形成在电子部件主体侧的电子部件主体和连接端子。 电子部件的连接端子包括由突起形成的接合槽，并且沿着电子部件嵌入通孔的方向延伸。

    Grounding gasket and electronic apparatus
    36.
    发明授权
    Grounding gasket and electronic apparatus 有权
    接地垫片和电子设备

    公开(公告)号：US09078351B2

    公开(公告)日：2015-07-07

    申请号：US14015883

    申请日：2013-08-30

    Applicant: KABUSHIKI KAISHA TOSHIBA

    Inventor： Tomohiro Matano ,  Motoyuki Hirakata

    IPC: H05K1/02 ,  H05K9/00

    CPC classification number: H05K1/0213 ,  H05K1/0215 ,  H05K9/0015 ,  H05K9/0016 ,  H05K9/0039 ,  H05K9/0054 ,  H05K9/006 ,  H05K2201/09072 ,  H05K2201/2036 ,  H05K2203/306

    Abstract: According to one embodiment, a grounding gasket includes a main body and a projecting part. The main body is configured to be interposed between a ground part and a substrate and contact the ground part and the substrate. The projecting part projects from the main body. The projecting part is configured to extend through a through-hole which is opened in the substrate, project to a side opposite to a side on which the ground part is located, and contact a conductive component mounted on the substrate.

    Abstract translation: 根据一个实施例，接地垫片包括主体和突出部分。 主体被配置为插入在接地部和基板之间并与接地部和基板接触。 突出部分从主体突出。 突出部构造成延伸通过在基板中打开的通孔，突出到与接地部分所在的一侧相对的一侧，并且接触安装在基板上的导电部件。

    Organic light emitting diode and circuit board for control thereof
    38.
    发明授权
    Organic light emitting diode and circuit board for control thereof 有权
    有机发光二极管及其控制电路板

    公开(公告)号：US09054333B2

    公开(公告)日：2015-06-09

    申请号：US13067343

    申请日：2011-05-25

    Applicant: Jan Hesse ,  Christian Kirchhof ,  Udo Bechtloff ,  Kai Schmieder

    Inventor： Jan Hesse ,  Christian Kirchhof ,  Udo Bechtloff ,  Kai Schmieder

    IPC: H01J1/62 ,  H01L51/52 ,  H05K3/32 ,  H05K1/11

    CPC classification number: H01L51/5203 ,  H01L51/5243 ,  H01L2251/5361 ,  H05K1/112 ,  H05K3/321 ,  H05K2201/0108 ,  H05K2201/09072 ,  H05K2201/09363 ,  H05K2201/10106

    Abstract: The invention relates to a lighting element, wherein at least one organic light-emitting diode is formed at an optically transparent substrate as a layer structure. In the lighting element in accordance with the invention, at least one organic light-emitting diode is formed at an optically transparent substrate as a layer structure. The at least one organic light-emitting diode and the substrate are connected to a circuit board and electric contact elements for the connection of the electrodes of the organic light-emitting diode(s) are present at the surface of the circuit board. The surface of the circuit board facing in the direction of the organic light-emitting diode(s) is provided over its full area with a metallic coating as a permeation barrier. The metallic coating is only breached by electric insulators formed about the contact elements.

    Abstract translation: 本发明涉及一种照明元件，其中至少一个有机发光二极管形成在光学透明基板上作为层结构。 在根据本发明的照明元件中，至少一个有机发光二极管形成在光学透明基板上作为层结构。 至少一个有机发光二极管和基板连接到电路板，并且用于连接有机发光二极管的电极的电接触元件存在于电路板的表面。 电路板的面向有机发光二极管的方向的表面在其全部区域上设置有作为渗透屏障的金属涂层。 金属涂层仅由围绕接触元件形成的电绝缘体破坏。

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