Abstract:
According to one embodiment, a storage device includes a housing, a circuit board, and a module. The circuit board is located in the housing, and includes a first surface and a second surface located opposite the first surface. The module is provided on at least one of the first surface and the second surface of the circuit board. The circuit board is provided with a first notch and a connection portion to be connected to the housing at the periphery. The first notch is provided with a second notch extending toward an area between the connection portion and a module fixation area where the module is fixed on the circuit board.
Abstract:
A printed circuit board (PCB) secured to a carrier, the carrier comprising at least one hook for securing the PCB, the PCB includes a first surface and a second surface opposite to the first surface. At least one recessed portion in the rim of the first surface receives at least one hook so there are no protrusions above the upper surface of the PCB. A carrier for securing the PCB is also provided.
Abstract:
According to one embodiment, a ceramic substrate for mounting a device is provided. The ceramic substrate includes a through-hole and a recessed portion provided on at least one edge surface thereof.
Abstract:
A liquid crystal display device includes first and second substrates facing each other and attached to each other with a cell-gap therebetween, gate lines and data lines arranged horizontally and vertically on the first substrate, first lines formed on the first substrate, connected to the gate lines or the data lines, and each having a link bending point and bent at an angle, a TCP electrically attached to the first substrate, and second lines formed on the TCP and electrically connected to the first lines respectively. At least one link bending point is positioned at a region of the TCP.
Abstract:
A solid printed circuit board is manufactured by bonding upper and lower printed circuit boards having different shapes and provided with wirings formed on surfaces thereof. A bonding layer is made of insulating material containing thermosetting resin and inorganic filler dispersed therein, and has a via-conductor made of conductive paste filling a through-hole perforated in a predetermined position of the bonding layer. This circuit board provides a packaging configuration achieving small size and thickness and three-dimensional mounting suitable for semiconductors of high performance and multiple-pin structure.
Abstract:
Polymer materials are useful as electrode array bodies for neural stimulation. They are particularly useful for retinal stimulation to create artificial vision, cochlear stimulation to create artificial hearing, and cortical stimulation, and many related purposes. The pressure applied against the retina, or other neural tissue, by an electrode array is critical. Too little pressure causes increased electrical resistance, along with electric field dispersion. Too much pressure may block blood flow. Common flexible circuit fabrication techniques generally require that a flexible circuit electrode array be made flat. Since neural tissue is almost never flat, a flat array will necessarily apply uneven pressure. Further, the edges of a flexible circuit polymer array may be sharp and cut the delicate neural tissue. By applying the right amount of heat to a completed array, a curve can be induced. With a thermoplastic polymer it may be further advantageous to repeatedly heat the flexible circuit in multiple molds, each with a decreasing radius. Further, it is advantageous to add material along the edges. It is further advantageous to provide a fold or twist in the flexible circuit array. Additional material may be added inside and outside the fold to promote a good seal with tissue.
Abstract:
An electronic expansion module which has at least one circuit board, that has a contact region with contacts for mechanical and electrical contact-making with mating contacts connected to the circuit board of the expansion module and a circuit board recess formed such that, with the expansion module inserted into an opening formed on a side of the housing of an electrical field device for use in industrial control, the circuit board of the expansion module does not have any conductive connection to the electrical field device except in the contact region so that reliable electrical isolation between the interior of the device and the user is ensured.
Abstract:
In the field of opto-electronic technology, a three-dimensional (3D) light-emitting diode (LED) light-emitting plate is described. The 3D LED light-emitting plate includes an aluminum substrate. The aluminum substrate is vertically disposed. Notches are formed on an upper side of the aluminum substrate in a thickness direction. LED chips are mounted in the notches. A flexible circuit layer is disposed on a surface of the aluminum substrate. Each LED chip is connected to a circuit of the flexible circuit layer by a gold wire. A fluorescent colloid light-emitting shell is disposed outside each LED chip correspondingly. A cavity is formed between the LED chip and the fluorescent colloid light-emitting shell. A lower portion of the fluorescent colloid light-emitting shell is fixed on the aluminum substrate. The 3D LED light-emitting plate effectively improves the luminous brightness and efficiency of an LED and enlarges an effective light-emitting angle, and alleviates the problem of non-uniform light pattern and light color, such that an LED white light lamp can achieve the luminous effect of a tungsten lamp. The fluorescent colloid light-emitting shell wraps the LED chip, which not only protects the LED chip from dust and produces white light, but is also suitable for use in a severe environment. Moreover, the production cost is reduced due to the simple structure.
Abstract translation:在光电技术领域,描述了三维(3D)发光二极管(LED)发光板。 3D LED发光板包括铝基板。 铝基板垂直设置。 在铝基板的厚度方向的上侧形成有切口。 LED芯片安装在凹口中。 柔性电路层设置在铝基板的表面上。 每个LED芯片通过金线连接到柔性电路层的电路。 荧光胶体发光壳相应地设置在每个LED芯片的外侧。 在LED芯片和荧光胶体发光壳体之间形成腔体。 荧光胶体发光壳的下部固定在铝基板上。 3D LED发光板有效地提高了LED的发光亮度和效率,并且扩大了有效的发光角度,并且减轻了不均匀的光图案和浅色的问题,使得LED白光灯可以实现 钨灯的发光效果。 荧光胶体发光壳封装LED芯片,不仅可以保护LED芯片免受灰尘的干扰,还可以产生白光,同时也适用于恶劣环境。 此外,由于结构简单,生产成本降低。
Abstract:
A card (1) to be mechanically connected with a socket (21,22,23,24,25) of an interface bus of a type selectable from among a plurality of bus widths. The card (1) includes an electrical connection portion (150) to be electrically connected with the socket of the interface bus, and a connection reinforcing portion (170) to reinforce a mechanical connection with the socket of the interface bus, wherein the connection reinforcing portion (170) is at least partially removable.
Abstract:
A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.