公开(公告)号：US20150013155A1

公开(公告)日：2015-01-15

申请号：US14507201

申请日：2014-10-06

Applicant: Cray Inc.

Inventor： Hyunjun Kim ,  Jeffrey Scott Conger ,  Gregory Erwin Scott

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0225 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/42 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09609 ,  H05K2201/09618 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A multi-layer printed circuit board has a number of landing pads that are configured to engage a connector secured thereto. Between the landing pads associated with different signals is at least one micro via that is electrically connected to a ground plane on an outer surface of the multi-layer printed circuit board, and a ground plane on an inner layer of the multi-layer printed circuit board.

Abstract translation: 多层印刷电路板具有多个着陆焊盘，其被配置为接合固定到其上的连接器。 在与不同信号相关联的着陆垫之间是至少一个微通孔，其电连接到多层印刷电路板的外表面上的接地平面，以及多层印刷电路的内层上的接地平面 板。

公开(公告)号：US20140376201A1

公开(公告)日：2014-12-25

申请号：US13921550

申请日：2013-06-19

Applicant: Keithley Instruments, Inc.

Inventor： James A. Niemann ,  Gregory Sobolewski ,  Martin J. Rice ,  Wayne Goeke

IPC: H05K1/02 ,  H05K3/40 ,  H05K3/46 ,  H05K3/30

CPC classification number: H05K1/0213 ,  H05K1/0225 ,  H05K1/0256 ,  H05K1/142 ,  H05K1/145 ,  H05K3/306 ,  H05K3/4038 ,  H05K3/4697 ,  H05K2201/0792 ,  H05K2201/09063 ,  H05K2201/093 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09981 ,  Y10T29/49139

Abstract: A device with low dielectric absorption includes a printed circuit board (PCB), a component connection area including a first conductor layered on a top surface of the component connection area and a second conductor layered on a bottom surface of the component connection area, an aperture surrounding the component connection area, a low-leakage component connecting the component connection area to the PCB across the aperture, and a guard composed of a third conductor at least substantially surrounding the aperture on a top surface of the PCB and a fourth conductor at least substantially surrounding the aperture on a bottom surface of the PCB.

Abstract translation: 具有低介电吸收率的器件包括印刷电路板（PCB），包括层叠在部件连接区域的顶表面上的第一导体的部件连接区域和层叠在部件连接区域的底表面上的第二导体， 围绕部件连接区域，将部件连接区域连接到穿过孔的PCB的低泄漏部件以及由至少基本上围绕PCB顶表面上的孔的第三导体组成的防护件和至少 基本上围绕PCB的底表面上的孔。

公开(公告)号：US08911240B2

公开(公告)日：2014-12-16

申请号：US13843556

申请日：2013-03-15

Applicant: Samtec, Inc.

Inventor： Gary Ellsworth Biddle ,  Christopher Warren Shelly

IPC: H01R12/00 ,  H01R12/70 ,  H05K1/11

CPC classification number: H01R12/7005 ,  H01R24/50 ,  H05K1/0219 ,  H05K1/111 ,  H05K2201/09063 ,  H05K2201/09618 ,  H05K2201/10189 ,  Y02P70/611

Abstract: A connector includes a housing including a conductive material, a base connected to the housing and including a base center hole and a base groove extending from the base center hole to an edge of the base, a center pin including a first portion and a second portion extending perpendicular or substantially perpendicular to the first portion, and a dielectric. The dielectric includes a first portion extending through the base center hole and including a dielectric center hole through which the first portion of the center pin extends and a second portion extending perpendicular or substantially perpendicular to the first portion of the dielectric along the base groove and including a dielectric groove along which the second portion of the center pin extends.

Abstract translation: 连接器包括：壳体，其包括导电材料;基座，连接到所述壳体，并且包括基座中心孔和从所述基座中心孔延伸到所述基座的边缘的基部槽，所述中心销包括第一部分和第二部分 垂直于或基本上垂直于第一部分延伸的电介质。 电介质包括延伸穿过基座中心孔并且包括中心销的第一部分延伸的电介质中心孔的第一部分和沿着基底槽垂直或基本上垂直于电介质的第一部分延伸的第二部分，并且包括 电介质槽，中心销的第二部分沿其延伸。

公开(公告)号：US20140354900A1

公开(公告)日：2014-12-04

申请号：US13908280

申请日：2013-06-03

Applicant: Apple Inc.

Inventor： Amy Qian ,  Carl R. Peterson ,  Jeremy C. Franklin ,  Joseph F. Alverson ,  Kevin D. Gibbs

IPC: H05K1/11 ,  G06F3/041 ,  H05K1/03

CPC classification number: H05K1/0221 ,  G06F1/1658 ,  H05K1/028 ,  H05K1/147 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09236 ,  H05K2201/09618 ,  H05K2201/10128

Abstract: An electronic device contains electrical circuits. The circuits may include circuitry on printed circuit boards and components such as a touch screen display and buttons. Signal paths for routing signals between the electrical circuits may be formed from metal traces on flexible printed circuit cables. The flexible printed circuit cables may be bent around one or more bend axes. A flexible printed circuit cable may be formed from a flexible polymer substrate having one or more layers of polymer. Upper and lower ground layers may be supported by the flexible polymer substrate. The metal traces for the signal paths may lie between the upper and lower ground layers. Longitudinal slits within the flexible printed circuit may be formed that pass through the ground layers and the polymer layers. Vias may be formed that couple the ground layers together. The vias may run along the edges of the slits.

Abstract translation: 电子设备包含电路。 电路可以包括印刷电路板上的电路和诸如触摸屏显示器和按钮的部件。 用于在电路之间路由信号的信号路径可以由柔性印刷电路电缆上的金属迹线形成。 柔性印刷电路电缆可围绕一个或多个弯曲轴弯曲。 柔性印刷电路电缆可以由具有一层或多层聚合物的柔性聚合物基材形成。 上下接地层可以由柔性聚合物基底支撑。 用于信号路径的金属迹线可位于上层和下层之间。 可以形成柔性印刷电路内的纵向狭缝，其穿过接地层和聚合物层。 可以形成将接地层耦合在一起的通孔。 通孔可以沿着狭缝的边缘延伸。

公开(公告)号：US20140292451A1

公开(公告)日：2014-10-02

申请号：US14355900

申请日：2012-12-21

Applicant: Andrew LLC

Inventor： Martin Zimmerman

IPC: H03H7/00

CPC classification number: H03H7/004 ,  H01L2924/0002 ,  H01P5/028 ,  H01Q1/246 ,  H05K1/0225 ,  H05K1/0239 ,  H05K3/28 ,  H05K3/40 ,  H05K2201/0175 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/09872 ,  H01L2924/0001

Abstract: A blind-mate capacitive coupling interconnection between a main module enclosure one or more sub-module enclosures has coupling surfaces each with a ground portion and an aperture, an inner element provided in the aperture, spaced away from the ground portion. The coupling surfaces may be provided, for example, as traces on a printed circuit board. To accommodate a degree of mis-alignment, one of the inner elements may be provided larger than the other. Capacitive coupling between the coupling surfaces occurs when the coupling surfaces are mated together, retained in position, for example, by a mechanical fixture.

Abstract translation: 一个或多个子模块外壳之间的主模块外壳之间的盲配电容耦合互连具有各自具有接地部分和开口的耦合表面，设置在孔中的内部元件与接地部分间隔开。 耦合表面可以例如设置在印刷电路板上的迹线上。 为了适应一定程度的误配对，可以将内部元件中的一个设置得大于另一个。 耦合表面之间的电容耦合发生在耦合表面配合在一起时，例如通过机械夹具保持在适当的位置。

公开(公告)号：US20140254992A9

公开(公告)日：2014-09-11

申请号：US13935132

申请日：2013-07-03

Applicant: Sumitomo Electric Device Innovations, Inc.

Inventor： Masahiro HIRAYAMA

IPC: H01P3/02 ,  G02B6/42

CPC classification number: H01P3/026 ,  G02B6/4279 ,  G02B6/4281 ,  G02B6/4292 ,  H05K1/0219 ,  H05K1/0227 ,  H05K1/025 ,  H05K1/0253 ,  H05K1/117 ,  H05K2201/09181 ,  H05K2201/09236 ,  H05K2201/09618 ,  H05K2201/0969

Abstract: A flexible circuit board includes: an insulative substrate having a first surface and a second surface opposite to the first surface; a microstrip line having a first signal line formed on the first surface and a first ground pattern formed on the second surface and located in an area opposite to the first signal line; a coplanar line having a second signal line formed on the first surface, and second ground patterns that are formed on the first surface and are spaced apart from both sides of the second signal line; a connection line that is formed on the first surface and connects the first signal line and the second signal line together, the connection line having an opening; and third ground patterns formed on the second surface and arranged in areas located at both sides of an area opposite to the connection line including the opening.

Abstract translation: 柔性电路板包括：具有第一表面和与第一表面相对的第二表面的绝缘基板; 具有形成在第一表面上的第一信号线和形成在第二表面上并位于与第一信号线相对的区域中的第一接地图案​​的微带线; 具有形成在第一表面上的第二信号线的共面线和形成在第一表面上并与第二信号线的两侧隔开的第二接地图案; 连接线，其形成在所述第一表面上并将所述第一信号线和所述第二信号线连接在一起，所述连接线具有开口; 以及形成在第二表面上并且布置在位于与包括开口的连接线相对的区域的两侧的区域中的第三接地图案。

公开(公告)号：US20140209370A1

公开(公告)日：2014-07-31

申请号：US14164320

申请日：2014-01-27

Applicant: Steven E. Minich

Inventor： Steven E. Minich

IPC: H05K1/02 ,  G09B19/00 ,  H05K3/42 ,  H05K1/11 ,  H05K3/10

CPC classification number: H05K1/0245 ,  G09B23/183 ,  H01R13/6471 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0222 ,  H05K1/0228 ,  H05K1/115 ,  H05K1/116 ,  H05K3/42 ,  H05K2201/09618 ,  Y10T29/49165

Abstract: In accordance with the various embodiments disclosed herein, an improved electrical connector footprints, such as printed circuit boards (printed circuit board), is described comprising one or more of, for example, a first linear array containing at least a first anti-pad extending along a first direction, a first electrical signal trace extending along the first direction and spaced from the first linear array along a second direction that is perpendicular to the first direction, a group of ground isolation vias containing at least one electrically conductive ground via arranged along a line extending parallel to the first direction and spaced from the first electrical signal trace along the second direction, and a second linear array containing at least a second anti-pad extending along the first direction spaced from the group of ground isolation vias along the second direction.

Abstract translation: 根据本文公开的各种实施例，描述了改进的电连接器封面，例如印刷电路板（印刷电路板），其包括例如第一线性阵列中的一个或多个，其包含至少第一防焊垫延伸 沿着第一方向沿着第一方向延伸并沿着垂直于第一方向的第二方向与第一线性阵列间隔开的第一电信号迹线，一组接地隔离通孔，其包含沿着第一方向布置的至少一个导电接地通孔 沿着第二方向平行于第一方向并与第一电信号迹线间隔开的线，以及第二线性阵列，其包含至少沿第一方向延伸的第二反焊盘，所述第二反焊盘沿着沿第二方向与第一电信号迹线组隔开， 方向。

公开(公告)号：US20140184360A1

公开(公告)日：2014-07-03

申请号：US14196301

申请日：2014-03-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru KATO

IPC: H01P3/08

CPC classification number: H01P3/082 ,  H01P3/08 ,  H05K1/0225 ,  H05K1/0253 ,  H05K2201/09618 ,  H05K2201/09727

Abstract: A high-frequency signal line includes an element assembly including a plurality of insulator layers, a linear signal line provided in or on the element assembly, a first ground conductor provided in or on the element assembly and extending along the signal line, and a plurality of floating conductors provided in or on the element assembly on a first side in a direction of lamination relative to the signal line and the first ground conductor, so as to be arranged along the signal line in an orientation crossing the signal line when viewed in a plan view in the direction of lamination. The floating conductors are opposite to the signal line and the first ground conductor with at least one of the insulator layers positioned therebetween, the floating conductors being connected to neither the signal line nor the first ground conductor. A capacitance is created between the first ground conductor and each of the floating conductors, and has a greater value than a capacitance created between the signal line and the floating conductor.

Abstract translation: 高频信号线包括元件组件，其包括多个绝缘体层，设置在元件组件中或其上的线性信号线，设置在元件组件中或其上并沿着信号线延伸的第一接地导体，以及多个 设置在所述元件组件中或所述元件组件上的相对于所述信号线和所述第一接地导体的层叠方向的第一侧上的浮动导体，以便沿着所述信号线以与所述信号线相交的方向布置在所述信号线上 在层叠方向的平面图。 浮动导体与信号线和第一接地导体相对，其中至少一个绝缘体层位于它们之间，浮动导体既不连接到信号线也不连接到第一接地导体。 在第一接地导体和每个浮动导体之间产生电容，并且具有比在信号线和浮动导体之间产生的电容更大的值。

公开(公告)号：US20140182893A1

公开(公告)日：2014-07-03

申请号：US14132118

申请日：2013-12-18

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： SHAO-YOU TANG ,  PO-CHUAN HSIEH

IPC: H05K1/02

CPC classification number: H05K1/0225 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/16 ,  H05K2201/09254 ,  H05K2201/09618 ,  H05K2201/09627

Abstract: A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots.

Abstract translation: 印刷电路板（PCB）包括接地层，第一层，第二层，连接器覆盖区和一对差分信号线。 连接器封装包括第一和第二焊盘。 PCB在由第一接合焊盘限定的空间的中心部分中限定第一信号通道，以及在由第二接合焊盘限定的空间的中心部分中的第二信号通孔。 第一接合焊盘上的多个第一接地通孔和第二接合焊盘上的多个第二接地通孔电连接到接地层。 围绕对应的第一接地通孔的第一环形槽限定在接地层中。 围绕相应的第二接地通孔的第二环形槽限定在接地层中。 连接槽限定在接地层中，并在第一环形槽和第二环形槽之间连通。

公开(公告)号：US08696378B2

公开(公告)日：2014-04-15

申请号：US13404862

申请日：2012-02-24

Applicant: Arash Behziz ,  Dustin Grant Rowe

Inventor： Arash Behziz ,  Dustin Grant Rowe

IPC: H01R12/24

CPC classification number: H01R12/53 ,  H01R9/034 ,  H05K1/0218 ,  H05K1/117 ,  H05K3/325 ,  H05K2201/09618 ,  H05K2201/09845 ,  H05K2201/10356

Abstract: An electrical connector assembly including a printed circuit board that has base and cover layers of dielectric material and first and second ground planes of conductive material. The base and cover layers are stacked relative to each other and located between the first and second ground planes. The base layer has a conductor-receiving portion that extends beyond the cover layer. The circuit board also includes signal traces that are exposed to an open space that exists above the conductor-receiving portion. The connector assembly also includes a compression component that is configured to be positioned in the open space to press wire-terminating ends of signal conductors onto the signal traces at the conductor-receiving portion.

Abstract translation: 一种电连接器组件，包括具有介电材料的基底和覆盖层以及导电材料的第一和第二接地平面的印刷电路板。 底层和覆盖层相对于彼此堆叠并位于第一和第二接地平面之间。 基层具有延伸超过覆盖层的导体接收部分。 电路板还包括暴露于存在于导体接收部分之上的开放空间的信号迹线。 连接器组件还包括被配置为定位在开放空间中的压缩部件，以将信号导体的线端部按压到导体接收部分处的信号迹线上。