公开(公告)号：US4956221A

公开(公告)日：1990-09-11

申请号：US281304

申请日：1988-12-08

Applicant: Beth I. Gutek

Inventor： Beth I. Gutek

IPC: B05D3/06 ,  C08F299/08 ,  C08L83/08 ,  C09D183/08 ,  H05K3/28

CPC classification number: B05D3/06 ,  C08F299/08 ,  C08L83/08 ,  C09D183/08 ,  H05K3/287 ,  H05K2201/09872 ,  Y10T428/24364 ,  Y10T428/24521 ,  Y10T428/31725

Abstract: A conformal coating composition is made from a mixture of acrylamide functional polydimethylsiloxane, a methacrylate functional/dialkoxy polydiorganosiloxane, reactive diluent including isobornyl acrylate, cyclohexyl acrylate, and 2- ethylhexyl acrylate; a photoinitiator combination of 2-hydroxy- 2-methylphenylpropanone and 2-methyl-1-[4-(methylthio)phenyl]-2- morpholenopropanone, an amine including dimethylethanolamine and diisopropylethylamine, and an organic titantate. The composition has a viscosity of from 0.07 to 0.2 Pa.s at 25.degree. C. and cures by exposure to ultraviolet radiation and to atmospheric moisture, i.e. a dual curing composition. This composition cures too fast by exposure to ultraviolet radiation in the presence of nitrogen resulting in a distorted surface and therefore for coating printed circuit boards it is recommended that it be cured in air so that the rate of cure is reduced and no surface distortions are formed.

Abstract translation: 保形涂料组合物由丙烯酰胺官能的聚二甲基硅氧烷，甲基丙烯酸酯官能/二烷氧基聚二有机硅氧烷，包括丙烯酸异冰片酯，丙烯酸环己酯和丙烯酸2-乙基己酯的反应性稀释剂的混合物制成。 2-羟基-2-甲基苯基丙酮和2-甲基-1- [4-（甲硫基）苯基] -2-吗啉代丙酮的光引发剂组合，包括二甲基乙醇胺和二异丙基乙胺的胺和有机钛酸酯。 该组合物在25℃下的粘度为0.07至0.2Pa.s，并通过暴露于紫外线和大气水分（即双重固化组合物）固化。 该组合物在氮气存在下通过暴露于紫外线辐射而固化得太快，导致表面变形，因此为了涂布印刷电路板，建议在空气中固化，使得固化速率降低并且不形成表面变形 。

公开(公告)号：US4843520A

公开(公告)日：1989-06-27

申请号：US151904

申请日：1988-02-03

Applicant: Yoshio Nakatani ,  Tooru Tamura ,  Mikio Nozu ,  Takahiro Manabe

Inventor： Yoshio Nakatani ,  Tooru Tamura ,  Mikio Nozu ,  Takahiro Manabe

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/28 ,  H05K5/00

CPC classification number: H05K7/20518 ,  H05K1/0201 ,  H05K1/189 ,  H05K3/284 ,  H05K5/0056 ,  H05K1/05 ,  H05K1/118 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/062 ,  H05K2201/09445 ,  H05K2201/09872 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K3/0058

Abstract: An electronic circuit module comprises a case, first and second substrates disposed in the case on opposite inner walls with a gap therebetween and, a flexible film having a circuit pattern thereon and attached at a part to the first substrate and attached at another part to the second substrate. A first group of electronic components including a heat-generating component are mounted on the film part attached to the first substrate. A second group of electronic components including a low-heat-resistive component are mounted on the film part attached to the second substrate. The gap between the first and second substrates is filled with a resin layer, preferably a foam resin layer, having a low heat conductivity so as to prevent a heat transfer from the heat-generating part to the low-heat-resistive part.

Abstract translation: 电子电路模块包括壳体，第一和第二基板设置在壳体上的相对的内壁上，其间具有间隙;柔性膜，其上具有电路图案，并且在一部分处附接到第一基板并且在另一部分处附接到第一基板 第二基板。 包括发热部件的第一组电子部件安装在附接到第一基板的膜部上。 包括低热阻部件的第二组电子部件安装在附着于第二基板的膜部上。 第一和第二基板之间的间隙填充有导热性低的树脂层，优选泡沫树脂层，以防止从发热部分向低热阻部分的热传递。

公开(公告)号：US4830922A

公开(公告)日：1989-05-16

申请号：US834777

申请日：1986-02-28

Applicant: Bryan L. Sparrowhawk ,  John M. Redfield, Jr.

Inventor： Bryan L. Sparrowhawk ,  John M. Redfield, Jr.

IPC: B05D5/00 ,  H05K3/28

CPC classification number: H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/0591 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K3/282 ,  Y10S428/901 ,  Y10T428/31504 ,  Y10T428/31855

Abstract: Easily removable conformable coatings having a controlled thickness with a predetermined minimum value are obtained by the application of a composition comprising a mixture of a viscous carrier material and small particles of a second material by any known method. When both the carrier material and the particulate material mixed therewith are selected to have high dielectric constants, the mixture may be used to obtain coatings suitable for protection of circuit boards supporting high impedance electrical circuits. A mixture of a commercially available grease, e.g., Amoco RYKON (TM), with glass microspheres comprising up to 50% of the volume and preferably in the size range 3-5 mils, provides excellent dielectric conformal coatings for high impedance circuit boards. By contrast, by selecting both the viscous carrier material and the particulate matter mixed therein to have high conductivity, electrically conductive coatings for particularized users may likewise be obtained according to this invention.

Abstract translation: 通过任何已知的方法，通过施加包含粘性载体材料和第二种材料的小颗粒的混合物的组合物来获得具有预定最小值的受控厚度的易于移除的适合涂层。 当载体材料和与其混合的颗粒材料都被选择为具有高介电常数时，该混合物可用于获得适于保护支持高阻抗电路的电路板的涂层。 可商购的润滑脂，例如Amoco RYKON TM与包含高达体积的50％，优选在3-5密尔的尺寸范围内的玻璃微球的混合物为高阻抗电路板提供优异的电介质保形涂层。 相反，通过选择粘性载体材料和混合在其中的颗粒物质以具有高导电性，根据本发明同样可以获得特定用户的导电涂层。

公开(公告)号：US09992875B2

公开(公告)日：2018-06-05

申请号：US14779731

申请日：2014-03-25

Applicant: Semblant Limited

Inventor： Elizabeth Williams-Duncan

IPC: H01L23/552 ,  H01L23/00 ,  H01L21/3213 ,  H05K3/28 ,  H05K1/18

CPC classification number: H05K3/282 ,  H01L21/32138 ,  H01L23/552 ,  H01L23/562 ,  H01L23/564 ,  H01L2224/80007 ,  H01L2224/81007 ,  H01L2224/82007 ,  H01L2224/83007 ,  H01L2224/84007 ,  H01L2224/85007 ,  H01L2224/86007 ,  H05K1/181 ,  H05K3/285 ,  H05K2201/09872 ,  H05K2203/095 ,  H05K2203/1322 ,  H05K2203/1333 ,  H05K2203/1377

Abstract: The present invention relates to an electrical assembly which has a conformal coating, wherein said conformal coating is obtainable by a method which comprises: (a) plasma polymerization of a compound of formula (I) and a fluorohydrocarbon, wherein the molar ratio of the compound of formula (I) to the fluorohydrocarbon is from 5:95 to 50:50, and deposition of the resulting polymer onto at least one surface of the electrical assembly: wherein: R1 represents C1-C3 alkyl or C2-C3 alkenyl; R2 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R3 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R4 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; R5 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl; and R6 represents hydrogen, C1-C3 alkyl or C2-C3 alkenyl, and (b) plasma polymerization of a compound of formula (I) and deposition of the resulting polymer onto the polymer formed in step (a).

公开(公告)号：US09992865B2

公开(公告)日：2018-06-05

申请号：US15045544

申请日：2016-02-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong Min ,  Myung-Sam Kang ,  Young-Gwan Ko ,  Min-Jae Seong

IPC: H05K7/00 ,  H05K1/02 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/00 ,  H05K1/113 ,  H05K3/4608 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09672 ,  H05K2201/09872 ,  H05K2201/10674

Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.

公开(公告)号：US09949377B2

公开(公告)日：2018-04-17

申请号：US14593614

申请日：2015-01-09

Applicant: HZO, INC.

Inventor： Max Sorenson ,  Blake Stevens ,  Alan Rae ,  Marc Chason

IPC: H05K1/16 ,  H05K3/28 ,  H05K1/18 ,  H05K13/00

CPC classification number: H05K3/284 ,  H01L2224/16225 ,  H05K1/185 ,  H05K13/00 ,  H05K2201/09872 ,  Y10T29/49002 ,  Y10T29/49117

Abstract: A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.

公开(公告)号：US09935353B2

公开(公告)日：2018-04-03

申请号：US14862159

申请日：2015-09-23

Applicant: Intel Corporation

Inventor： Gong Ouyang ,  Shaowu Huang ,  Kai Xiao

IPC: H01P3/08 ,  H01P11/00 ,  H01P3/04 ,  H05K1/02

CPC classification number: H01P3/081 ,  H01P3/04 ,  H01P11/003 ,  H05K1/024 ,  H05K1/0243 ,  H05K1/0245 ,  H05K2201/09036 ,  H05K2201/09872

Abstract: A conductor in a laminar structure, such as a printed circuit board or thin-film stack, is closely flanked by at least one open trench filled with an ambient medium (e.g., air, another gas, vacuum) of a lower dielectric loss than the conductor's surrounding dielectric. The trench may be made by any suitably precise method such as laser scribing, chemical etching or mechanical displacement. A thin layer of dielectric may be left on the sides of the conductor to prevent oxidation or other reactions that may reduce conductivity. When the conductor carries a signal, part of an electric and/or magnetic field that would ordinarily travel through the surrounding dielectric encounters the low-loss ambient medium (e.g. air) in the trench. The effective dielectric loss surrounding the conductor is lowered, reducing signal attenuation and crosstalk, particularly at high frequencies.

公开(公告)号：US20180083662A1

公开(公告)日：2018-03-22

申请号：US15382241

申请日：2016-12-16

Applicant: Syed Taymur Ahmad ,  Bruce Acton

Inventor： Syed Taymur Ahmad ,  Bruce Acton

IPC: H04B1/3888 ,  H05K3/28 ,  H05K3/10 ,  H05K5/00 ,  H05K1/03 ,  H05K1/09 ,  H01R13/648

CPC classification number: H04B1/3888 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2203/1361 ,  H05K2203/1366

Abstract: Methods for protecting an electronic device from contaminants by applying different insulating and conducting materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying an electrically insulating material, such as isobutylene isoprene rubber, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying a polymer capable of carrying a charge, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with different materials. Electronic devices that are protected by such coatings are also disclosed, such as smart phones, computers, head phones, and gaming devices, all of which show improve protection from contaminants, especially liquid contaminants.

公开(公告)号：US09834686B2

公开(公告)日：2017-12-05

申请号：US14537250

申请日：2014-11-10

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Kyungjae Shin ,  Kiwoong Kim

IPC: H05K7/00 ,  C09D5/00 ,  H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  C08L83/04 ,  C08J3/24 ,  C08K5/00 ,  H01L23/29 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38

CPC classification number: C09D5/00 ,  C08J3/243 ,  C08K5/0025 ,  C08K2003/222 ,  C08K2003/2227 ,  C08K2003/2231 ,  C08K2003/2296 ,  C08K2003/282 ,  C08K2003/385 ,  C08L83/04 ,  H01L23/296 ,  H05K1/0259 ,  H05K1/18 ,  H05K3/0011 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10181

Abstract: An integrated silicone for protecting electronic devices includes a base resin, a thermal initiator, and a photoinitiator.

公开(公告)号：US20170287880A1

公开(公告)日：2017-10-05

申请号：US15470960

申请日：2017-03-28

Applicant: Infineon Technologies AG

Inventor： Edward Fuergut ,  Holger Doepke ,  Olaf Hohlfeld ,  Michael Juerss

IPC: H01L25/07 ,  H01L23/00 ,  H01L23/29 ,  H01L21/52 ,  H01L21/56

CPC classification number: H01L25/072 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/552 ,  H01L23/562 ,  H01L24/05 ,  H01L24/06 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K3/282 ,  H05K2201/09872 ,  H05K2203/1377 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A method for fabricating an electronic device package includes providing a carrier, disposing a semiconductor chip onto the carrier, the semiconductor chip having a contact pad on a main face thereof remote from the carrier, applying a contact element onto the contact pad, applying a dielectric layer on the carrier, the semiconductor chip, and the contact element, and applying an encapsulant onto the dielectric layer.