公开(公告)号：US20090301766A1

公开(公告)日：2009-12-10

申请号：US12219441

申请日：2008-07-22

Applicant: Hwa Sun Park ,  Yul Kyo Chung ,  Jin Won Lee ,  Jin Soo Jeong

Inventor： Hwa Sun Park ,  Yul Kyo Chung ,  Jin Won Lee ,  Jin Soo Jeong

IPC: H05K1/03 ,  H01R43/00

CPC classification number: H05K1/185 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K3/4602 ,  H05K2201/0394 ,  H05K2201/10674 ,  H05K2201/10969 ,  Y10T29/49171

Abstract: Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified.

Abstract translation: 这里公开了包括嵌入其中的电子部件的印刷电路板，由于电子部件被支撑在芯基板的金属层上，因此支撑和辐射性能得到改善，生产成本降低，并且制造过程简化。

公开(公告)号：US07613009B2

公开(公告)日：2009-11-03

申请号：US11374994

申请日：2006-03-15

Applicant: Thomas M Young ,  Brian Kearns

Inventor： Thomas M Young ,  Brian Kearns

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H01P1/047 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K2201/09618 ,  H05K2201/10727 ,  H05K2201/10969 ,  H01L2924/00

Abstract: An RF electronic component for mounting on a substrate includes a housing; and at least one electronic device having an input and/or output incorporated in the housing. At least one input/output terminal connects to a connection pad on the substrate; and an electrical transition provides an electrical connection between the input/output terminal and an input/output of an electronic device incorporated in the electronic component. The electrical transition comprises a side termination at least partially located on an outer surface of the housing; and an array of conductive through holes formed inside the housing at an offset from the side termination. The array is arranged so that the axes of the through holes are substantially mutually parallel and coplanar, and the array of through holes is connected to form a ground plane at the offset from the side termination.

Abstract translation: 用于安装在基板上的RF电子部件包括壳体; 以及至少一个电子设备，其具有并入壳体中的输入和/或输出。 至少一个输入/输出端子连接到基板上的连接焊盘; 并且电转换提供输入/输出端子与结合在电子部件中的电子设备的输入/输出之间的电连接。 电转变包括至少部分地位于外壳的外表面上的侧端接件; 以及形成在壳体内部的与侧面终端偏移的导电通孔阵列。 阵列被布置成使得通孔的轴线基本上相互平行和共面，并且通孔阵列被连接以形成与侧面终端偏移的接地平面。

公开(公告)号：US20090147489A1

公开(公告)日：2009-06-11

申请号：US12259777

申请日：2008-10-28

Applicant: Masaaki TOGASHI

Inventor： Masaaki TOGASHI

IPC: H05K7/06

CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/35 ,  H05K1/0231 ,  H05K2201/09309 ,  H05K2201/09481 ,  H05K2201/10636 ,  H05K2201/10969 ,  Y02P70/611

Abstract: In a structure for mounting a first feedthrough capacitor and a second feedthrough capacitor on a mounting surface of a substrate, the first and second feedthrough capacitors are disposed so as to be substantially parallel and to face each other in their partial regions, and a current in the partial region of the first feedthrough capacitor flows in a direction opposite to that in the partial region of the second feedthrough capacitor.

Abstract translation: 在用于在基板的安装表面上安装第一馈通电容器和第二馈通电容器的结构中，第一和第二馈通电容器被布置为基本上平行并且在其部分区域中彼此面对，并且在 第一穿通电容器的部分区域沿与第二穿通电容器的部分区域相反的方向流动。

公开(公告)号：US20090129038A1

公开(公告)日：2009-05-21

申请号：US12065001

申请日：2006-08-30

Applicant: Sadamichi Takakusaki ,  Noriaki Sakamoto

Inventor： Sadamichi Takakusaki ,  Noriaki Sakamoto

IPC: H01R9/00 ,  H05K3/30

CPC classification number: H01L23/49861 ,  H01L23/3672 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/056 ,  H05K3/284 ,  H05K2201/1034 ,  H05K2201/1053 ,  H05K2201/10969 ,  Y10T29/49139 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: Provided is a simplified structure of a circuit device in which a power element generating a large amount of heat is incorporated. The circuit device according to the present invention includes: a circuit board whose surface is covered with an insulating layer; a conductive pattern formed on the surface of the insulating layer; a circuit element electrically connected to the conductive pattern; and a lead connected to a pad formed of the conductive pattern. Furthermore, a power element is fixed to the top surface of a land portion formed of a part of the lead. Accordingly, the land portion serves as a heat sink, thereby contributing to heat dissipation.

Abstract translation: 提供了其中并入产生大量热量的功率元件的电路装置的简化结构。 根据本发明的电路装置包括：表面被绝缘层覆盖的电路板; 形成在所述绝缘层的表面上的导电图案; 电连接到所述导电图案的电路元件; 以及连接到由导电图案形成的焊盘的引线。 此外，功率元件固定到由引线的一部分形成的接地部的顶表面。 因此，陆部用作散热器，从而有助于散热。

公开(公告)号：US20090091902A1

公开(公告)日：2009-04-09

申请号：US12060969

申请日：2008-04-02

Applicant: Ju-yong KIM

Inventor： Ju-yong KIM

IPC: H05K1/18 ,  H05K7/10 ,  H04N5/00

CPC classification number: H05K1/0243 ,  H05K3/341 ,  H05K9/0054 ,  H05K2201/10128 ,  H05K2201/10189 ,  H05K2201/10969

Abstract: A display apparatus including a circuit board and a surface grounded portion which is disposed on an end portion of the circuit board and formed of a conductive layer. The display apparatus may include a signal receiver mounted on the circuit board, the signal receiver receiving a signal. The display apparatus may include a signal processor mounted on the circuit board, the signal processor processing signals received by the signal receiver.

Abstract translation: 一种显示装置，包括电路板和表面接地部分，其设置在电路板的端部并由导电层形成。 显示装置可以包括安装在电路板上的信号接收器，信号接收器接收信号。 显示装置可以包括安装在电路板上的信号处理器，信号处理器处理由信号接收器接收的信号。

公开(公告)号：US20090039721A1

公开(公告)日：2009-02-12

申请号：US12140417

申请日：2008-06-17

Applicant: Takahiro Takagi ,  Masato Nakamura

Inventor： Takahiro Takagi ,  Masato Nakamura

IPC: H02K7/06

CPC classification number: H02K7/061 ,  H02K5/225 ,  H05K3/341 ,  H05K2201/1009 ,  H05K2201/10969 ,  Y02P70/613

Abstract: A board mounted structure of a vibration motor which self aligns along with melting of cream solder even if deviation occurs in positioning of the flat bottom surface of a metal holder frame and a fastening pattern at the time of automatic mounting, that is, a board mounted structure having a vibration motor having a metal holder frame into which a motor case is fit and a pair of external terminal pieces attached to a plastic end cap and a printed circuit board having a fastening pattern shaped left-right symmetric about a center line and superposed with a bottom surface of the metal holder frame and power feed patterns adjoining this fastening pattern, arranged left-right symmetrical with respect to a center line, and superposed with corresponding external terminal pieces, the metal holder frame having front projecting pieces and a back projecting piece at its flat bottom surface, the fastening pattern having front extending pattern surfaces superposed with corresponding front projecting pieces and a back extending pattern surface superposed with the back projecting piece at its main fastening pattern surface.

Abstract translation: 即使在自动安装时金属保持架框架的平坦底面和紧固图案的定位中发生偏差，也可以将自动对准的振动马达的板安装结构与膏状焊料的熔融相结合，即，板安装 具有振动电动机的结构，所述振动电动机具有安装有电动机壳体的金属保持器框架和附接到塑料端盖的一对外部端子片和具有左右对称的紧固图案的印刷电路板， 金属保持架框架的底面和与该紧固图案相邻的供电图案相对于中心线左右对称配置，并且与对应的外部端子片重合，金属保持器框架具有前突出片和后突出 紧固图案具有与相应的前部突出部重叠的前部延伸图案表面 在其主紧固图案表面上与后突出片重叠的后延伸图案表面。

公开(公告)号：US07463115B2

公开(公告)日：2008-12-09

申请号：US11487494

申请日：2006-07-17

Applicant: Yuichiro Okuyama

Inventor： Yuichiro Okuyama

IPC: H01P5/12

CPC classification number: H05K1/0243 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2924/0002 ,  H01L2924/15313 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H04B1/006 ,  H04B1/0064 ,  H04B1/406 ,  H05K3/341 ,  H05K2201/10727 ,  H05K2201/10969 ,  H01L2924/00

Abstract: A high frequency electronic component comprises a layered substrate. On the bottom surface of the layered substrate, there are provided a plurality of functional terminals for inputting and outputting signals relating to functions of a circuit inside the layered substrate, a plurality of ground terminals, a plurality of terminals that are not connected to external circuits, and a conductor section for grounding. The conductor section for grounding includes: a center portion located in a region surrounded by a plurality of terminals; and a plurality of coupling portions for coupling the center portion to the terminals.

Abstract translation: 高频电子部件包括层状基板。 在层叠基板的底面设置有多个功能端子，用于输入和输出与层叠基板内的电路的功能相关的信号，多个接地端子，多个未连接到外部电路的端子 ，以及用于接地的导体部分。 用于接地的导体部分包括：位于由多个端子包围的区域中的中心部分; 以及用于将中心部分连接到端子的多个联接部分。

公开(公告)号：US07432450B2

公开(公告)日：2008-10-07

申请号：US11181097

申请日：2005-07-14

Applicant: Kyoung-Soo Kim ,  Jin-Ho Park

Inventor： Kyoung-Soo Kim ,  Jin-Ho Park

IPC: H05K1/03

CPC classification number: H05K1/183 ,  G02F1/13452 ,  H05K1/114 ,  H05K3/341 ,  H05K3/429 ,  H05K2201/09072 ,  H05K2201/09518 ,  H05K2201/09627 ,  H05K2201/10189 ,  H05K2201/10969 ,  H05K2201/2072

Abstract: A printed circuit board on which a connector is mounted includes a conductive layer, insulating layers, and a supporting member. A part of the conductive layer is exposed on a top surface of the PCB in order to form a connecting pad portion for connecting the connector. The insulating layers are disposed proximate to both sides of the conductive layer. The supporting member is connected to the conductive layer and covers a surface of a hole formed by opening an orifice through the conductive layer and the insulating layer. The hole is disposed adjacent to the connecting pad portion.

Abstract translation: 其上安装有连接器的印刷电路板包括导电层，绝缘层和支撑构件。 导电层的一部分露出在PCB的顶表面上，以便形成用于连接连接器的连接焊盘部分。 绝缘层靠近导电层的两侧设置。 支撑构件连接到导电层并覆盖通过导电层和绝缘层打开孔而形成的孔的表面。 孔邻近连接焊盘部分设置。

公开(公告)号：US20080203510A1

公开(公告)日：2008-08-28

申请号：US11933749

申请日：2007-11-01

Applicant: Atsushi KAWAMURA

Inventor： Atsushi KAWAMURA

IPC: H01L23/498

CPC classification number: H01L31/0203 ,  H01L25/167 ,  H01L31/0232 ,  H01L33/483 ,  H01L2224/45144 ,  H01L2224/48091 ,  H05K1/0243 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10121 ,  H05K2201/10568 ,  H05K2201/10969 ,  H05K2201/2036 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optical module of the present invention includes: a semiconductor device 14; a grounded metal member 10 for mounting the semiconductor device 14 thereon; a substrate 16 for mounting the grounded metal member 10 thereon; and a lead pin 18 fixed to and insulated from the grounded metal member 10 and soldered to the substrate 16, the lead pin 18 being used to supply power to the semiconductor device 14; wherein the grounded metal member 10 has a protrusion on a surface thereof facing the substrate 16; and wherein the protrusion of the grounded metal member 10 is in contact with the substrate 16.

Abstract translation: 本发明的光模块包括：半导体器件14; 用于在其上安装半导体器件14的接地金属部件10; 用于将接地的金属构件10安装在其上的基板16; 以及与接地的金属构件10固定并绝缘并焊接到基板16的引脚18，引脚18用于向半导体器件14供电; 其中接地金属构件10在其面向基板16的表面上具有突起; 并且其中接地的金属构件10的突起与衬底16接触。

公开(公告)号：US07405106B2

公开(公告)日：2008-07-29

申请号：US11439016

申请日：2006-05-23

Applicant: John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

Inventor： John J. Maloney ,  Robert M. Smith ,  Charles H. Wilson

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L23/49548 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15747 ,  H01L2924/181 ,  H05K3/341 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10969 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A QFN package with improved joint solder thickness for improved second level attachment fatigue life. The copper leadframe of a QFN chip carrier is provided with rounded protrusions in both the chip attach pad region and the surrounding lead regions before second level attachment. The rounded stand-off protrusions are formed from the copper itself of the copper of the leadframe. This may be achieved by punching dimples into one surface of the copper plate of the leadframe before plating to form protrusions on the opposing surface. This method of forming the rounded protrusions simplifies the process of forming stand-offs. The protrusions provide a structure that increases wetting area and allows the use of a larger quantity of solder for increased solder joint thickness and better die paddle solder joint area coverage. As a result of the increased solder joint thickness, second level fatigue life is significantly improved. As a result of the improved die paddle solder joint area coverage, improved thermal performance of the chip carrier is also significantly improved.

Abstract translation: QFN封装，具有改进的焊点厚度，可提高二级附着疲劳寿命。 QFN芯片载体的铜引线框架在第二级附接之前在芯片连接焊盘区域和周围的引线区域中设置有圆形突起。 圆形的突出突起由引线框架的铜的铜本身形成。 这可以通过在电镀之前将凹坑冲压到引线框架的铜板的一个表面中以在相对表面上形成突起来实现。 形成圆形突起的这种方法简化了形成支座的过程。 突起提供了增加润湿面积的结构，并且允许使用更大量的焊料以增加焊接接​​头厚度和更好的焊盘焊接区域覆盖。 由于焊接接头厚度的增加，二级疲劳寿命显着提高。 由于焊盘焊接区域覆盖率的提高，芯片载体的热性能也得到了显着提高。