公开(公告)号：US20150334831A1

公开(公告)日：2015-11-19

申请号：US14809570

申请日：2015-07-27

Applicant: Invensas Corporation

Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Terrence Caskey ,  Reynaldo Co ,  Ellis Chau

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/11 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/528 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13101 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14135 ,  H01L2224/16105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/32225 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45101 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45624 ,  H01L2224/45655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0298 ,  H05K1/181 ,  H05K1/185 ,  H05K2201/10515 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014

Abstract: A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element.

公开(公告)号：US20150315436A1

公开(公告)日：2015-11-05

申请号：US14647178

申请日：2013-12-04

Applicant: TORAY INDUSTRIES, INC.

Inventor： Koichi FUJIMARU ,  Toshihisa NONAKA

IPC: C09J179/08 ,  H01L23/00

CPC classification number: H05K3/323 ,  C08K3/013 ,  C08L63/00 ,  C08L79/08 ,  C08L93/04 ,  C09J163/00 ,  C09J179/08 ,  C09J193/04 ,  C09J2479/083 ,  H01L21/6836 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/27003 ,  H01L2224/27334 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81907 ,  H01L2224/83132 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83907 ,  H01L2224/83948 ,  H01L2224/9211 ,  H01L2224/94 ,  H01L2924/01008 ,  H01L2924/01014 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/15787 ,  H01L2924/15788 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3489 ,  H05K2201/0154 ,  H05K2201/10977 ,  Y02P70/613 ,  C08K3/0033 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/27 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

Abstract: The present invention relates to an adhesive agent which can be used in the mounting of a semiconductor chip on a circuit board or the like. The present invention addresses the problem of providing an adhesive agent having both excellent storage stability and excellent connection reliability. A means for solving the problem is an adhesive agent comprising (a) a polyamide, (b) an epoxy compound and (c) an acid-modified rosin.

Abstract translation: 本发明涉及可用于将半导体芯片安装在电路板等上的粘合剂。 本发明解决了提供具有优异的储存稳定性和优异的连接可靠性的粘合剂的问题。 解决问题的手段是粘合剂，其包含（a）聚酰胺，（b）环氧化合物和（c）酸改性的松香。

公开(公告)号：US20150271920A1

公开(公告)日：2015-09-24

申请号：US14220913

申请日：2014-03-20

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel KIM ,  Jonghae KIM ,  Chengjie ZUO ,  Changhan Hobie YUN ,  Mario Francisco VELEZ ,  Robert Paul MIKULKA

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/30 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K3/303 ,  H01L23/48 ,  H01L23/5385 ,  H01L23/645 ,  H01L2924/0002 ,  H01L2924/19101 ,  H05K1/0243 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/141 ,  H05K1/144 ,  H05K1/165 ,  H05K1/18 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/4007 ,  H05K3/4015 ,  H05K2201/1003 ,  H05K2201/10477 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/1316 ,  Y10T29/4902 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  H01L2924/00

Abstract: Systems and methods relate to a semiconductor package comprising a first substrate or a 2D passive-on-glass (POG) structure with a passive component and a first set of one or more package pads formed on a face of a glass substrate. The semiconductor package also includes a second or laminate substrate with a second set of one or more package pads formed on a face of the second or laminate substrate. Solder balls are dropped, configured to contact the first set of one or more package pads with the second set of one or more package pads, wherein the first substrate or the 2D POG structure is placed face-up on the face of the second or laminate substrate. A printed circuit board (PCB) can be coupled to a bottom side of the second or laminate substrate.

Abstract translation: 系统和方法涉及包括第一衬底或2D无源玻璃（POG）结构的半导体封装，其具有无源部件和形成在玻璃衬底的表面上的一个或多个封装焊盘的第一组。 半导体封装还包括具有第二组一个或多个封装焊盘的第二或层压衬底，其形成在第二层压衬底的表面上。 焊球被落下，被配置为使第一组一个或多个封装焊盘与第二组一个或多个封装焊盘接触，其中第一基板或2D POG结构朝上放置在第二或层压板的表面上 基质。 印刷电路板（PCB）可以耦合到第二或层压基板的底侧。

公开(公告)号：US20150250054A1

公开(公告)日：2015-09-03

申请号：US14633864

申请日：2015-02-27

Applicant: IBIDEN CO., LTD.

Inventor： Kazuhiro YOSHIKAWA ,  Takashi KARIYA

IPC: H05K1/11 ,  H05K1/09 ,  H05K3/18 ,  H05K3/46 ,  H05K3/22 ,  H05K3/02 ,  H01L23/00 ,  H05K1/14

CPC classification number: H05K1/111 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/09 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H05K1/144 ,  H05K3/28 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/042 ,  H05K2201/068 ,  H05K2201/09745 ,  H05K2201/098 ,  H05K2201/10977 ,  H05K2201/2072 ,  H05K2203/0353 ,  H05K2203/0361 ,  H05K2203/0405 ,  H05K2203/0594 ,  H05K2203/0597 ,  H05K2203/1184 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A printed wiring board includes an uppermost insulating layer, first pads positioned to mount an IC chip on the insulating layer, second pads positioned to mount a second printed wiring board on the insulating layer, metal posts formed on the second pads, respectively, such that the metal posts mount the second board over the chip, and a solder resist layer formed on the uppermost insulating layer and having first and second openings such that the first openings exposes the first pads and that the second openings exposes the second pads, respectively. The metal posts are formed such that each of the metal posts has a diameter which is smaller than a diameter of each of the second opening portions, and the second opening portions are formed such that the diameter of each of the second opening portions is smaller than a diameter of each of the second pads.

Abstract translation: 印刷布线板包括最上层的绝缘层，位于绝缘层上的IC芯片安装的第一焊盘，位于绝缘层上的第二印刷电路板安装的第二焊盘，分别形成在第二焊盘上的金属柱，使得 金属柱将第二板安装在芯片上，以及形成在最上层绝缘层上并具有第一和第二开口的阻焊层，使得第一开口暴露第一焊盘，并且第二开口分别暴露第二焊盘。 金属柱形成为使得每个金属柱的直径小于每个第二开口部的直径，并且第二开口部形成为使得每个第二开口部的直径小于 每个第二垫的直径。

公开(公告)号：US09044135B2

公开(公告)日：2015-06-02

申请号：US13457211

申请日：2012-04-26

Applicant: Norihiro Ishii ,  Takahiro Sugai

Inventor： Norihiro Ishii ,  Takahiro Sugai

IPC: A61B1/00 ,  H01L23/053 ,  A61B1/12 ,  H05K1/11 ,  H05K3/34 ,  H01L23/498

CPC classification number: A61B1/00004 ,  A61B1/0011 ,  A61B1/121 ,  H01L23/053 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16195 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/094 ,  H05K2201/10719 ,  H05K2201/10977 ,  H01L2924/00

Abstract: According to one exemplary embodiment, an endoscope apparatus includes: an insertion unit that is an object to be disinfected by boiling; an operation unit connected to the insertion part; a main unit connected to the operation unit; a first circuit board embedded in the main unit; a first electronic component electrically connected to the first circuit board via a first solder; a second circuit board embedded in at least any one of the insertion unit and the operation unit; a second electronic component electrically connected to the second circuit board via a second solder having higher stress resistance than that of the first solder; and a bonding member bonded to the second electronic component and the second circuit board, the bonding member having a glass transition point higher than that of the second circuit board.

Abstract translation: 根据一个示例性实施例，一种内窥镜装置包括：作为被煮沸消毒的物体的插入单元; 连接到插入部的操作单元; 连接到操作单元的主单元; 嵌入在主单元中的第一电路板; 经由第一焊料与第一电​​路板电连接的第一电子部件; 插入到所述插入单元和所述操作单元中的至少任一个中的第二电路板; 第二电子部件经由具有比第一焊料的耐应力高的第二焊料电连接到第二电路板; 以及接合构件，其结合到所述第二电子部件和所述第二电路板，所述接合部件具有比所述第二电路板的玻璃化转变点高的玻璃化转变点。

公开(公告)号：US09036357B2

公开(公告)日：2015-05-19

申请号：US13064145

申请日：2011-03-08

Applicant: Min-Cheol Kim

Inventor： Min-Cheol Kim

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K1/189 ,  H05K3/281 ,  H05K2201/052 ,  H05K2201/10128 ,  H05K2201/10977

Abstract: A method of manufacturing a display device includes preparing a display panel that has a display region where an image is displayed and a non-display region adjacent to the display region, and disposing a power supply flexible printed circuit board (FPCB) in a lower surface of the display panel and in the non-display region of an upper surface of the display panel. The method includes disposing a tape on the display panel to cover an upper side of the power supply FPCB disposed on the upper surface of the display panel, and attaching the tape to the display panel by performing a thermal hardening process on the tape to fix the power supply FPCB to the display panel.

Abstract translation: 一种制造显示装置的方法包括：制备具有显示图像的显示区域和与显示区域相邻的非显示区域的显示面板，以及将电源柔性印刷电路板（FPCB）设置在下表面 和显示面板的上表面的非显示区域。 该方法包括在显示面板上布置带以覆盖布置在显示面板的上表面上的电源FPCB的上侧，并且通过对带进行热硬化处理将带附着到显示面板上， 电源FPCB到显示面板。

公开(公告)号：US08975528B2

公开(公告)日：2015-03-10

申请号：US13590470

申请日：2012-08-21

Applicant: Shuuichi Kariyazaki

Inventor： Shuuichi Kariyazaki

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K1/11 ,  H05K7/00 ,  B23K31/02 ,  H01L23/498 ,  H01L23/50 ,  H05K1/02

CPC classification number: H05K1/111 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/16105 ,  H01L2224/16106 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/17051 ,  H01L2224/17104 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/82385 ,  H01L2924/15311 ,  H05K1/0268 ,  H05K2201/09663 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/611 ,  H01L2924/00

Abstract: Even in an electronic device where electrodes are coupled electrically using a solder, sections to which electrodes of an electronic component are coupled are switched by a method other than changing circuits of the electronic component or changing circuits of a wiring substrate.The electronic device includes: a wiring substrate having two or more first electrodes over one surface thereof; and an electronic component having, over one surface thereof, two or more second electrodes arranged corresponding to the two or more first electrodes, respectively. At least one of the first electrodes is a specific electrode divided into two or more divided portions, and the divided portions are coupled to different wirings, respectively. Further, at least one of the divided portions is coupled to a corresponding second electrode through a solder.

Abstract translation: 即使在使用焊料电极电连接的电子装置中，电子部件的电极所连接的部分也可以通过除了电子部件的电路或配线基板的改变电路之外的方法进行切换。 电子设备包括：在其一个表面上具有两个或更多个第一电极的布线基板; 以及电子部件，在其一个表面上分别具有对应于两个或更多个第一电极排列的两个或更多个第二电极。 第一电极中的至少一个是分为两个或更多个分割部分的特定电极，并且分割部分分别耦合到不同的布线。 此外，分割部分中的至少一个通过焊料耦合到对应的第二电极。

公开(公告)号：US08853546B2

公开(公告)日：2014-10-07

申请号：US12837543

申请日：2010-07-16

Applicant: Daisuke Yamauchi ,  Tetsuya Oosawa ,  Mitsuru Honjo ,  Masami Inoue

Inventor： Daisuke Yamauchi ,  Tetsuya Oosawa ,  Mitsuru Honjo ,  Masami Inoue

IPC: H05K1/00 ,  H05K3/36 ,  H05K3/24 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K1/056 ,  C25D7/00 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/28 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/10977 ,  Y10T29/49124 ,  Y10T29/49126

Abstract: A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer.

Abstract translation: 基体绝缘层形成在悬架体上。 在基底绝缘层上一体地形成电镀用引线和布线迹线。 覆盖绝缘层形成在基底绝缘层上以覆盖电镀用引线和布线迹线。 在形成有电镀用引线的基极绝缘层的区域的上方的覆盖绝缘层的一部分的厚度设定为小于基底绝缘层的其它区域以上的覆盖绝缘层的一部分的厚度。

公开(公告)号：US20140264401A1

公开(公告)日：2014-09-18

申请号：US13837403

申请日：2013-03-15

Applicant: Grote Industries, LLC

Inventor： Tim Brooks ,  Scott J. Jones ,  Martin J. Marx ,  Cesar Perez-Bolivar ,  James E. Roberts

IPC: H01L33/48

CPC classification number: H01L33/48 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/64 ,  H01L2924/0002 ,  H05K1/0209 ,  H05K1/189 ,  H05K2201/10106 ,  H05K2201/10977 ,  H01L2924/00

Abstract: A flexible lighting element is provided, comprising: a first flexible substrate; first and second conductive elements located on the first flexible substrate; a light-emitting element having a positive contact and a negative contact, the positive and negative contacts both being on a first side of the light-emitting element, the light-emitting element being configured to emit light having a selected narrow range of wavelengths; a first conductive connector electrically connecting the first conductive element to the positive contact; a second conductive connector electrically connecting the second conductive element to the negative contact; a second flexible substrate located adjacent to a second surface of the light-emitting element; and an affixing layer located between the first flexible substrate and the second flexible substrate.

Abstract translation: 提供柔性照明元件，包括：第一柔性基板; 位于第一柔性基板上的第一和第二导电元件; 具有正接触和负接触的发光元件，所述正和负接触都在所述发光元件的第一侧上，所述发光元件被配置为发射具有选定的窄波长范围的光; 将所述第一导电元件电连接到所述正触点的第一导电连接器; 将所述第二导电元件电连接到所述负触点的第二导电连接器; 位于所述发光元件的第二表面附近的第二柔性基板; 以及位于所述第一柔性基板和所述第二柔性基板之间的固定层。

公开(公告)号：US08835773B2

公开(公告)日：2014-09-16

申请号：US12752692

申请日：2010-04-01

Applicant: Shigetsugu Muramatsu ,  Yasuhiko Kusama

Inventor： Shigetsugu Muramatsu ,  Yasuhiko Kusama

IPC: H05K1/16 ,  H05K7/00 ,  H05K3/34 ,  H01L23/498 ,  H01L21/56 ,  H05K3/00 ,  H01L23/31 ,  H05K3/30 ,  H05K1/11 ,  H05K3/24

CPC classification number: H05K3/3452 ,  H01L21/563 ,  H01L23/3121 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15151 ,  H05K1/111 ,  H05K3/0044 ,  H05K3/243 ,  H05K3/305 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/025 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of manufacturing a wiring board for use in mounting of an electronic component includes: forming an outermost wiring layer on a surface side where the electronic component is mounted; forming an insulating layer so as to cover the wiring layer; and forming a concave portion in the insulating layer. The concave portion is formed by removing, using a mask formed in a required shape by patterning, an exposed portion of the insulating layer in a step-like shape until a surface of a pad defined at a portion of the wiring layer is exposed. The concave portion is preferably formed by removing the portion of the insulating layer by sand blast.

Abstract translation: 制造电子部件安装用布线基板的方法包括：在安装有电子部件的表面侧形成最外层布线层; 形成绝缘层以覆盖所述布线层; 以及在所述绝缘层中形成凹部。 通过使用通过图案化形成所需形状的掩模，以阶梯状形状除去绝缘层的露出部分，直到露出布线层的一部分的焊盘的表面来形成凹部。 凹部优选通过用喷砂除去绝缘层的一部分而形成。