METHOD FOR ATTACHING ADHESIVE TO SHOE SOLE
    34.
    发明公开

    公开(公告)号:US20240138524A1

    公开(公告)日:2024-05-02

    申请号:US18155661

    申请日:2023-01-17

    Inventor: Hsin-Ming TSENG

    CPC classification number: A43D25/185 A43D25/06 B05D3/0218

    Abstract: A method for attaching an adhesive to a shoe sole which has a top surface includes the steps of: (A) capturing a shape of the top surface of the shoe sole and generating a preset pattern using a sampling device, the preset pattern having a contour corresponding to the shape of the top surface and an area similar to that of the top surface; (B) preparing a mold according to the preset pattern; (C) coating the adhesive on the mold and allowing the adhesive to stand for a while; (D) cooling the mold to a degumming temperature; (E) pressing the mold against the shoe sole with a surface thereof having the adhesive facing the top surface so as to attach the adhesive thereto; and (F) moving the mold away from the shoe sole to separate the mold from the adhesive.

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