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公开(公告)号:US12002602B2
公开(公告)日:2024-06-04
申请号:US17631854
申请日:2020-08-31
Inventor: Tengjiao Liu , Yanping Su , Xin Li , Yuan Hu
CPC classification number: H01B5/14 , B05D1/26 , B05D3/0254 , B05D3/06 , B05D3/067 , B05D3/142 , B05D7/54 , G02B1/11 , G02B1/14
Abstract: An optically consistent transparent conductive film and a preparation method thereof solve the problems of obvious etching marks, poor optical stability, easy corrosion of nanomaterials, and migration of metal ions of the metal nanowire transparent conductive film. The addition of nanoparticles with a matchable refractive index and a high corrosion resistance, the addition of an optical compensation layer, the use of a substrate with an anti-glare layer and other such means can solve the problem of obvious post-treatment etching marks of metal nanowire conductive films. A dense full-plate conductive transparent conductive film with improved corrosion resistance can be achieved by using an electric compensation layer. An ultraviolet stabilizer is added into a protective solution to improve the optical stability of the conductive film. An antioxidant, a dendrimer, and a complexing agent in the protective solution solve the problem of easy corrosion of nanomaterials and migration of metal ions.
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公开(公告)号:US11993534B2
公开(公告)日:2024-05-28
申请号:US17282572
申请日:2019-09-27
Applicant: FURUYA METAL CO., LTD.
Inventor: Shoji Saito , Tomoaki Miyazawa , Tomohiro Maruko , Yuichi Iwamoto , Atsushi Ito
IPC: B32B3/30 , B05D1/28 , B05D3/02 , B05D7/14 , C03B5/43 , C04B35/488 , C04B35/622 , C23C28/04 , C23C4/11 , C23C4/134
CPC classification number: C03B5/43 , B05D1/28 , B05D3/0272 , B05D7/14 , C04B35/488 , C04B35/62222 , C23C28/042 , C04B2235/3246 , C04B2235/3427 , C04B2235/5436 , C04B2235/5445 , C04B2235/5472 , C23C4/11 , C23C4/134
Abstract: The volatilization suppressing component according to the present disclosure has a metallic base material; and a laminated film having at least a first layer formed on a portion or the entirety of a surface of the metallic base material, and a second layer formed on the first layer, wherein the first layer is an adhesive layer between the metallic base material and the second layer, and the second layer is a protective layer for the first layer.
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公开(公告)号:US20240165661A1
公开(公告)日:2024-05-23
申请号:US18056345
申请日:2022-11-17
Applicant: HONEYWELL INTERNATIONAL INC.
Inventor: Mehrad Mehr , John Downs , Bahram Jadidian
CPC classification number: B05D5/005 , B05C3/18 , B05D3/007 , B05D3/0254
Abstract: Methods and systems are provided for filling cracks in an environmental barrier coating and/or a thermal barrier coating (EBC/TBC). The method comprises locating a component within an enclosure of an apparatus, the component including a substrate having the EBC/TBC thereon, wherein the EBC/TBC includes cracks extending from an exterior surface of the EBC/TBC toward the substrate, reducing pressure within the enclosure to a first pressure that is less than atmospheric pressure, applying a filler slurry to the exterior surface to cover the cracks while the EBC/TBC is exposed to the first pressure, increasing the enclosure to a second pressure that is greater than the first pressure, wherein the second pressure is sufficient to cause the filler slurry on the EBC/TBC to infiltrate into and fill the cracks, and sintering the filler slurry sufficient to cure the filler slurry within the cracks.
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公开(公告)号:US20240138524A1
公开(公告)日:2024-05-02
申请号:US18155661
申请日:2023-01-17
Applicant: Chi-Chien LAI , PUMMA TECHNOLOGY CO., LTD.
Inventor: Hsin-Ming TSENG
CPC classification number: A43D25/185 , A43D25/06 , B05D3/0218
Abstract: A method for attaching an adhesive to a shoe sole which has a top surface includes the steps of: (A) capturing a shape of the top surface of the shoe sole and generating a preset pattern using a sampling device, the preset pattern having a contour corresponding to the shape of the top surface and an area similar to that of the top surface; (B) preparing a mold according to the preset pattern; (C) coating the adhesive on the mold and allowing the adhesive to stand for a while; (D) cooling the mold to a degumming temperature; (E) pressing the mold against the shoe sole with a surface thereof having the adhesive facing the top surface so as to attach the adhesive thereto; and (F) moving the mold away from the shoe sole to separate the mold from the adhesive.
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公开(公告)号:US11971383B1
公开(公告)日:2024-04-30
申请号:US16602691
申请日:2019-11-20
Inventor: Jonathan Claussen , John Hondred
IPC: G01N27/30 , C23C16/02 , C23F1/02 , G01N27/327 , H01G11/26 , H01G11/36 , H01G11/44 , H01G11/86 , B05D3/02 , B05D3/06 , B05D3/10 , B05D5/02
CPC classification number: G01N27/308 , C23C16/0263 , C23F1/02 , G01N27/3271 , H01G11/26 , H01G11/36 , H01G11/44 , H01G11/86 , B05D3/0254 , B05D3/065 , B05D3/107 , B05D5/02
Abstract: The invention relates to a method of patterning a substrate with graphene-based or other electroactive-material-based solution that includes solid-phase particles as hard templates, reducing the solution, and processing the reduced solution to expose the particles. The exposed hard template particles are removed to leave a three-dimensional (3D) porous architecture that can be beneficially used for a variety of applications, including but not limited to bio sensors and supercapacitors. In one example, the exposure is by etching with a CO2 laser. The method can be practiced with scalable MEMS fabrication technologies.
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公开(公告)号:US20240113009A1
公开(公告)日:2024-04-04
申请号:US17957637
申请日:2022-09-30
Applicant: Intel Corporation
Inventor: Whitney Bryks , Aaditya Candadai , Dilan Seneviratne , Junxin Wang , Peumie Abeyratne Kuragama
IPC: H01L23/498 , B05D3/02 , B05D3/04 , B05D5/00 , H01L21/48 , H01L23/14 , H01L23/15 , H01L23/538
CPC classification number: H01L23/49894 , B05D3/0272 , B05D3/0426 , B05D5/00 , H01L21/481 , H01L23/147 , H01L23/15 , H01L23/5383 , H01L23/5384
Abstract: An electronic device can include an interposer, a first porous polymer layer, and one or more die. The interposer can include a metallic through via extending from a first surface of the interposer to a second surface of the interposer. The first polymer layer can be adjacent to the first surface of the interposer. The one or more dies can be coupled to the first porous polymer layer and connected to the metallic through via.
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公开(公告)号:US20240110068A1
公开(公告)日:2024-04-04
申请号:US18479286
申请日:2023-10-02
Applicant: California Institute of Technology
Inventor: Yu-Chong Tai , Kuang-Ming Shang , Haixu Shen , Ningxuan Dai , David Q. Kong
IPC: C09D5/16 , B05D1/00 , B05D3/02 , B05D3/14 , C09D5/08 , C09D125/02 , C09D191/00
CPC classification number: C09D5/1681 , B05D1/60 , B05D3/0218 , B05D3/148 , C09D5/086 , C09D125/02 , C09D191/00 , B05D2350/60 , B05D2507/00
Abstract: A thin oil film having parylene irregular dendritic-like columns extending from one side to another exhibits hydrophobic properties that can be used as a corrosion resistant coating or water-repellant, biofouling resistant surface. This parylene-in-oil layer can be paired with an adjacent layer of solid parylene that it overlays or underlays. The solid parylene cross polymerizes with the parylene dendrites, keeping them in place as well as the oil film. The parylene dendrites are fabricated by chemical vapor deposition (CVD) of parylene over the oil layer, the dendrites self-forming from the bottom to the top. Continued CVD over the dendrites can produce a top layer of solid parylene. Etching the solid parylene away can result in a water repellant, anti-biofouling surface.
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公开(公告)号:US11932949B2
公开(公告)日:2024-03-19
申请号:US17463056
申请日:2021-08-31
Applicant: THE BOEING COMPANY
Inventor: Patrick J. Kinlen , Anthony E. Dillard
IPC: C23F11/16 , C09D5/00 , C09D5/08 , C09D183/04 , C23F11/04 , C23F11/12 , B05D1/02 , B05D1/18 , B05D3/02 , B05D3/10 , B05D7/00
CPC classification number: C23F11/161 , C09D5/002 , C09D5/086 , C09D183/04 , C23F11/04 , C23F11/12 , B05D1/02 , B05D1/18 , B05D3/0254 , B05D3/107 , B05D7/50
Abstract: Aspects described herein generally relate to a method of coating a metallic surface. The method includes forming a solution including a corrosion inhibitor having one or more thiol moieties and a hydroxide. The metallic surface is coated with the solution to form a treated metallic surface. The treated metallic surface is further coated with an organosilane, an acid, and a metal alkoxide to form a coating system.
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公开(公告)号:US11931773B1
公开(公告)日:2024-03-19
申请号:US17964733
申请日:2022-10-12
Inventor: Lauren M. Abro , Yuko N. Gidcumb , Michelle R. Vargo , Lindsay A. Babian
IPC: B05D3/06 , B05D3/02 , B05D5/06 , C09D5/32 , H04B10/50 , H04B10/516 , H04B10/564 , H05B1/02 , H05B47/175 , B05D7/14
CPC classification number: B05D3/06 , B05D3/0254 , B05D5/065 , C09D5/32 , H04B10/505 , H04B10/516 , H04B10/564 , H05B1/023 , H05B47/175 , B05D7/14
Abstract: The systems and methods utilize thermal energy linked to certain colors vehicles may be manufactured in a single color and changed to a specific color at a dealership before customer purchase and/or throughout the lifetime of the vehicle. A system for modulating vehicle paint of a vehicle includes a paint layer disposed on an exterior surface of the vehicle and a color modulator configured to radiate a light such that the paint layer reacts when the paint layer is exposed to the light.
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公开(公告)号:US20240075457A1
公开(公告)日:2024-03-07
申请号:US18502262
申请日:2023-11-06
Applicant: Sustaera Inc.
Inventor: Tyson Lee LANIGAN-ATKINS , Jian-Peng SHEN , Cory Elliott SANDERSON , Raghubir Prasad GUPTA
IPC: B01J20/32 , B01D53/62 , B01D53/82 , B01D53/96 , B01J20/04 , B01J20/08 , B01J20/28 , B01J20/30 , B01J20/34 , B05D3/02
CPC classification number: B01J20/3204 , B01D53/62 , B01D53/82 , B01D53/96 , B01J20/043 , B01J20/08 , B01J20/28042 , B01J20/3078 , B01J20/3234 , B01J20/3291 , B01J20/3433 , B01J20/3458 , B01J20/3483 , B05D3/0254 , B01D2251/304 , B01D2251/606 , B01D2257/504 , B01D2258/06
Abstract: A method for forming an integrated composite comprises providing a three-dimensional substrate having at least one channel; coating the substrate with a phenolic resin, wherein coating comprises dispersing the phenolic resin on the substrate, impregnating the phenolic resin in the substrate or a combination of both; curing the substrate and the phenolic resin; heating the cured substrate and cured phenolic resin to a temperature in a range of about 600° C. to about 1100° C. in an inert environment thereby pyrolyzing the phenolic resin, forming a conductive carbon network on, in, or both on and in the substrate; and coating a support material on, in, or both on and in the substrate to form an integrated composite.
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