公开(公告)号：US20030076663A1

公开(公告)日：2003-04-24

申请号：US10309707

申请日：2002-12-03

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Yoshihisa Yamashita

IPC: H05K007/02 ,  H05K007/06 ,  H05K007/08 ,  H05K007/10

CPC classification number: H05K7/205 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/4084 ,  H05K7/20463 ,  H05K2201/0209 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2203/1189 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.

Abstract translation: 一种片状导热性树脂组合物，其含有70〜95重量％ ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。

公开(公告)号：US06522555B2

公开(公告)日：2003-02-18

申请号：US09834710

申请日：2001-04-13

Applicant: Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Yoshihisa Yamashita

Inventor： Koichi Hirano ,  Seiichi Nakatani ,  Mitsuhiro Matsuo ,  Yoshihisa Yamashita

IPC: H05K702

CPC classification number: H05K7/205 ,  H01L23/3737 ,  H01L23/4334 ,  H01L23/49861 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19041 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/4084 ,  H05K7/20463 ,  H05K2201/0209 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/0969 ,  H05K2201/10416 ,  H05K2203/1189 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.

Abstract translation: 一种片状导热性树脂组合物，其含有70〜95重量％ ％无机填料和5〜30wt。 热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。 因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。 因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。 因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。

公开(公告)号：US06507095B1

公开(公告)日：2003-01-14

申请号：US09701138

申请日：2000-11-24

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23495

CPC classification number: H05K3/4084 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2203/0195 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A wiring board comprises a substrate (10) in which an opening (14) is formed, a wiring pattern (20) formed on one surface of the substrate (10) and having a bent portion (22) intruding into the opening (14) and protruding from the other surface of the substrate (10), and a resin 26 with which an inside of the bent portion (22) is filled and allowing deformation to a certain degree while preventing large deformation, and the bent portion (22) forms the external terminals of the semiconductor device.

Abstract translation: 布线板包括其中形成有开口（14）的基板（10），形成在基板（10）的一个表面上并且具有侵入到开口（14）中的弯曲部分（22）的布线图案（20） 并且从基板（10）的另一个表面突出，并且在弯曲部分（22）的内部被填充并允许变形到一定程度同时防止大的变形的树脂26，并且弯曲部分（22）形成 半导体器件的外部端子。

公开(公告)号：US06492201B1

公开(公告)日：2002-12-10

申请号：US09119079

申请日：1998-07-10

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H01L2148

CPC classification number: H01L24/50 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H05K1/056 ,  H05K3/386 ,  H05K3/423 ,  H05K3/445 ,  H05K2201/0382 ,  H05K2201/09554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electrically conductive article such as a sheet having holes therein is coated with a dielectric polymer using a multi-stage electrophoretic deposition process. A coating of uncured polymer is deposited electrophoretically and then cured. After the first polymer is cured, the part is subject to a further electrophoretic deposition process and further curing. Use of a second electrophoretic deposition step allows effective coating of parts having small holes without plugging the holes. The coated parts may be used as microelectronic connection components such as chip carriers used in packaging semiconductor chips.

Abstract translation: 使用多阶段电泳沉积工艺，用介电聚合物涂覆诸如其中具有孔的片的导电制品。 将未固化的聚合物涂层电泳沉积，然后固化。 在第一聚合物固化后，该部分进行进一步的电泳沉积工艺并进一步固化。 使用第二电泳沉积步骤允许有效涂覆具有小孔的部件而不堵塞孔。 涂覆部件可以用作微电子连接部件，例如用于封装半导体芯片的芯片载体。

公开(公告)号：US20020158110A1

公开(公告)日：2002-10-31

申请号：US09845448

申请日：2001-04-30

Applicant: International Business Machines Corporation

Inventor： David Vincent Caletka ,  Krishna Darbha ,  Donald W. Henderson ,  Lawrence P. Lehman ,  George Henry Thiel

IPC: B23K031/00 ,  B23K031/02

CPC classification number: H01L23/49811 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/05026 ,  H01L2224/05078 ,  H01L2224/05551 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H05K1/113 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0382 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49171 ,  H01L2924/00011 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05552

Abstract: Solder balls, such as, low melt C4 solder balls undergo volume expansion during reflow. Where the solder balls are encapsulated, expansion pressure can cause damage to device integrity. A volume expansion region in the semiconductor chip substrate beneath each of the solder balls accommodates volume expansion. Air-cushioned diaphgrams, deformable materials and non-wettable surfaces may be used to permit return of the solder during cooling to its original site. A porous medium with voids sufficient to accommodate expansion may also be used.

Abstract translation: 诸如低熔点C4焊球的焊球在回流期间经历体积膨胀。 当焊球被封装时，膨胀压力可能会损坏器件的完整性。 每个焊球下方的半导体芯片基板中的体积扩展区容纳体积膨胀。 可以使用气垫缓冲图，可变形材料和不可润湿的表面，以允许在冷却期间焊料返回到其原始位置。 也可以使用具有足以适应膨胀的空隙的多孔介质。

公开(公告)号：US06399889B1

公开(公告)日：2002-06-04

申请号：US09394153

申请日：1999-09-13

Applicant: Kurt J. Korkowski ,  Kenneth R. Fastner ,  Adam K. Himes ,  Gregory P. Myers ,  Andrew R. Motzko

Inventor： Kurt J. Korkowski ,  Kenneth R. Fastner ,  Adam K. Himes ,  Gregory P. Myers ,  Andrew R. Motzko

IPC: H05K100

CPC classification number: G11B5/4853 ,  H05K3/366 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09645 ,  Y10T29/49023 ,  Y10T29/49025 ,  Y10T29/49027

Abstract: A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.

Abstract translation: 一种用于将数据头的换能器元件连接到驱动电路的头部互连电路，驱动电路包括在引线端上的对准指状物，用于将引线相对于用于将头部电连接到驱动电路的连接器或焊盘对准。 一种用于将头互连电路连接到支撑在头致动器上的印刷电路的方法，包括将引线尖端上的对准指针与驱动电路的印刷表面对准，用于将引线尖端上的引线焊接到驱动电路上的焊盘或连接器 。

公开(公告)号：US06351885B2

公开(公告)日：2002-03-05

申请号：US09079857

申请日：1998-05-15

Applicant: Etsuji Suzuki ,  Akira Yonezawa ,  Toshio Okuno

Inventor： Etsuji Suzuki ,  Akira Yonezawa ,  Toshio Okuno

IPC: H05K302

CPC classification number: H01R12/57 ,  H01L21/4853 ,  H01L23/13 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15173 ,  H05K1/0284 ,  H05K3/025 ,  H05K3/205 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0382 ,  H05K2201/09045 ,  H05K2203/0113 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49208 ,  H01L2224/05599

Abstract: A wiring board structure has an insulating base having at least one projection located thereon, wherein the insulating base and the at least one projection are integrally formed from a same piece of insulating material. The wiring board structure also has at least one lead located on the insulating base, wherein a part of the at least one lead covers the at least one projection to form at least one conductive bump.

Abstract translation: 布线板结构具有绝缘基底，其上具有位于其上的至少一个突起，其中所述绝缘基底和所述至少一个突出部由相同的绝缘材料构成。 所述布线板结构还具有位于所述绝缘基底上的至少一个引线，其中所述至少一个引线的一部分覆盖所述至少一个突起以形成至少一个导电凸块。

公开(公告)号：US06320748B1

公开(公告)日：2001-11-20

申请号：US09527260

申请日：2000-03-17

Applicant: Garey G. Roden ,  Peter G. Heseltine

Inventor： Garey G. Roden ,  Peter G. Heseltine

IPC: H05K720

CPC classification number: H05K1/0204 ,  H01L23/367 ,  H01L2924/0002 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10166 ,  H05K2201/10545 ,  H01L2924/00

Abstract: A Printed Circuit Board (PCB) has a cut-out that permits a monolithic copper or aluminum heatsink to be mounted flush with the surface of the PCB. Electrical devices can be mounted to the monolithic heat sink. The heat sink is bent to extend out of the plane of the PCB. The heatsink can have parts mounted to connect with either face of the PCB, and can extend from either side of the PCB. The heatsink is stepped to present one surface flush with the PCB and another surface that lies along the face of the PCB.

Abstract translation: 印刷电路板（PCB）具有允许单片铜或铝散热器与PCB表面齐平地安装的切口。 电气设备可以安装到单片散热器。 散热器弯曲以伸出PCB的平面。 散热器可以安装与PCB的任一面连接的部件，并且可以从PCB的任一侧延伸。 散热器是阶梯式的，呈现与PCB平齐的一个表面和位于PCB表面的另一个表面。

公开(公告)号：US20010011604A1

公开(公告)日：2001-08-09

申请号：US09829213

申请日：2001-04-09

Inventor： Kurt J. Korkowski ,  Kenneth R. Fastner ,  Adam K. Himes ,  Gregory P. Myers ,  Andrew R. Motzko

IPC: H05K001/11 ,  H05K001/14

CPC classification number: G11B5/4853 ,  H05K3/366 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09645 ,  Y10T29/49023 ,  Y10T29/49025 ,  Y10T29/49027

Abstract: A head interconnect circuit for connecting transducer elements of a data head to drive circuitry including an alignment finger on a lead tip for aligning leads relative to connectors or solder pads for electrically connecting heads to drive circuitry. A method for connecting a head interconnect circuit to a printed circuit supported on an head actuator including aligning an alignment finger on the lead tip with a printed surface of a drive circuit for soldering leads on the lead tip to solder pads or connectors on the drive circuit.

Abstract translation: 一种用于将数据头的换能器元件连接到驱动电路的头部互连电路，驱动电路包括在引线端上的对准指状物，用于将引线相对于用于将头部电连接到驱动电路的连接器或焊盘对准。 一种用于将头互连电路连接到支撑在头致动器上的印刷电路的方法，包括将引线尖端上的对准指针与驱动电路的印刷表面对准，用于将引线尖端上的引线焊接到驱动电路上的焊盘或连接器 。

公开(公告)号：US06247228B1

公开(公告)日：2001-06-19

申请号：US08989305

申请日：1997-12-12

Applicant: Thomas H. Distefano ,  Joseph Fjelstad

Inventor： Thomas H. Distefano ,  Joseph Fjelstad

IPC: H05K336

CPC classification number: H05K3/462 ,  H01L23/49827 ,  H01L23/5385 ,  H01L2924/0002 ,  H01R12/523 ,  H01R12/714 ,  H01R13/2414 ,  H01R43/0256 ,  H05K1/0272 ,  H05K1/036 ,  H05K1/056 ,  H05K1/116 ,  H05K3/0032 ,  H05K3/326 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0195 ,  H05K2201/0382 ,  H05K2201/0397 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0554 ,  H05K2203/0582 ,  H05K2203/135 ,  H05K2203/308 ,  Y10T29/49126 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T156/1744 ,  H01L2924/00

Abstract: An interposer for interconnection between microelectronic circuit panels has contacts at its surfaces. Each contact extends from a central conductor, and has a peripheral portion adapted to contract radially inwardly toward the central conductor response to a force applied by a contact pad defining a central hole on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts contract radially inwardly and wipe across the pads. The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.