公开(公告)号：US07628617B2

公开(公告)日：2009-12-08

申请号：US11525755

申请日：2006-09-22

Applicant: Dirk D. Brown ,  John D. Williams ,  William B. Long

Inventor： Dirk D. Brown ,  John D. Williams ,  William B. Long

IPC: H01R12/00

CPC classification number: H01R13/2407 ,  H05K3/326 ,  H05K3/4015 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/10719 ,  H05K2201/10924 ,  H05K2201/10946

Abstract: An elastic contact array circuitized substrate includes a circuitized substrate provided with circuit traces, and an array of three dimensional contact elements joined to the circuitized substrate and electrically coupled to the circuit traces. In one configuration, the array of three dimensional contacts are formed in a spring sheet material having anisotropic grains whose long direction is selected with respect to the longitudinal direction of elastic contact arms, in accordance with desired properties. In another configuration of the invention, the circuit traces are formed integrally within the spring sheet material.

Abstract translation: 弹性接触阵列电路化衬底包括设置有电路迹线的电路化衬底和连接到电路化衬底并电耦合到电路迹线的三维接触元件的阵列。 在一种结构中，根据所需的性质，三维触点阵列形成为具有相对于弹性接触臂的纵向方向选择长方向的各向异性颗粒的弹簧片材料。 在本发明的另一种结构中，电路迹线一体形成在弹簧片材料内。

公开(公告)号：US07616016B2

公开(公告)日：2009-11-10

申请号：US12060753

申请日：2008-04-01

Applicant: Benjamin N. Eldridge ,  Igor Y. Khandros ,  A. Nicholas Sporck

Inventor： Benjamin N. Eldridge ,  Igor Y. Khandros ,  A. Nicholas Sporck

IPC: G01R31/02

CPC classification number: H05K3/4015 ,  B23K1/0016 ,  B23K20/004 ,  B23K2101/40 ,  C25D5/08 ,  C25D5/22 ,  C25D21/02 ,  G01R1/06711 ,  G01R1/07342 ,  G01R1/07364 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/4853 ,  H01L21/4889 ,  H01L21/563 ,  H01L21/76897 ,  H01L22/20 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/16 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/45014 ,  H01L2224/45144 ,  H01L2224/49109 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2224/85201 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01R12/52 ,  H05K1/141 ,  H05K3/20 ,  H05K3/308 ,  H05K3/326 ,  H05K3/3421 ,  H05K3/3426 ,  H05K3/368 ,  H05K3/4092 ,  H05K7/1069 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/1031 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10757 ,  H05K2201/10878 ,  H05K2201/10909 ,  H05K2201/10946 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2224/05599

Abstract: In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Abstract translation: 在探针卡组件中，可以将一系列探针元件排列在硅空间变压器上。 硅空间变压器可以以与半导体器件的间距相当的非常紧密的间距的主要触点阵列制造。 一个优选的主要接触是弹性弹簧接触。 空间变压器中的导电元件以更放松的间距被路由到第二触点。 在一个优选实施例中，第二触点适于直接连接带状电缆，带状电缆又可连接以提供对每个主触点的选择性连接。 硅空间变压器安装在固定装置中，其提供与待测试的晶片或装置的弹性连接。 可以调整该夹具以使主触头与支撑探针卡板的平面平坦化。

公开(公告)号：US20090237897A1

公开(公告)日：2009-09-24

申请号：US12405612

申请日：2009-03-17

Applicant: William R. Ratcliffe

Inventor： William R. Ratcliffe

IPC: H05K7/02

CPC classification number: H05K1/184 ,  H01L23/5389 ,  H01L2224/82039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12044 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/10106 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/00

Abstract: Substrate structure embodiments generally have first and second sides and are configured to form at least one opening that communicates between the first and second sides. A circuit path is carried on the first side and extended over the opening wherein the circuit path has a near side facing the substrate and has a far side facing away from the substrate. A circuit element has at least one bonding pad and is inserted into the opening after which the conductive bump is arranged to join the pad to the path. In another embodiment, the bump joins the pad to the near side of the path. In another embodiment, the path defines a hole and the bump fills the hole. In yet another system embodiment, the opening comprises a recess and associated vias. These embodiments may also have a second conductive circuit path carried on the first side and having a near side facing the substrate and a far side facing away from the substrate. The systems may then include a second circuit element and at least one second conductive bump. The second circuit element has at least one second bonding pad and the second conductive bump joins the second bonding pad to the far side of the second path. The substrate embodiments thus efficiently couple the second circuit element to the far side of one circuit path and couples the first circuit element to the near side of another circuit path. These system arrangements provide a number of packaging options that can be used to enhance packaging efficiency and reduce system costs.

Abstract translation: 基底结构实施例通常具有第一和第二侧面并且构造成形成在第一和第二侧面之间连通的至少一个开口。 电路路径被承载在第一侧上并在开口上延伸，其中电路路径具有面向衬底的近侧，并且具有远离衬底的远侧。 电路元件具有至少一个接合焊盘并插入开口中，之后布置导电凸块以将焊盘接合到路径。 在另一个实施例中，凸块将焊盘连接到路径的近侧。 在另一个实施例中，路径限定一个孔，并且该凸起填充该孔。 在又一系统实施例中，开口包括凹槽和相关联的通孔。 这些实施例还可以具有在第一侧上承载的第二导电电路路径，并且具有面向衬底的近侧和远离衬底的远侧。 然后，系统可以包括第二电路元件和至少一个第二导电凸块。 第二电路元件具有至少一个第二接合焊盘，第二导电凸块将第二接合焊盘连接到第二路径的远侧。 因此，衬底实施例因此将第二电路元件有效地耦合到一个电路路径的远侧，并且将第一电路元件耦合到另一个电路路径的近侧。 这些系统布置提供了许多包装选项，可用于提高包装效率并降低系统成本。

公开(公告)号：US07583475B2

公开(公告)日：2009-09-01

申请号：US11066949

申请日：2005-02-25

Applicant: Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

Inventor： Yuhsuke Matsumoto ,  Tatsumi Tsuchiya ,  Takaaki Murokawa ,  Yoshio Uematsu ,  Tatsushi Yoshida ,  Nobuyuki Hashi ,  Hiroyasu Tsuchida ,  Takuma Muraki

IPC: G11B5/48

CPC classification number: H05K3/3442 ,  G11B5/4853 ,  H05K1/111 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2203/041 ,  Y02P70/611 ,  Y02P70/613

Abstract: Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.

Abstract translation: 本发明的实施例提供了当使用焊球连接接合焊盘和引线接线焊盘时防止焊料球偏离中心线并发生焊接问题的技术。 在一个实施例中，头悬挂组件包括设置在为弯曲提供的引线布线垫和为滑块设置的接合焊盘之间的焊球。 然后将焊球熔化以在引线接线焊盘和焊盘之间形成焊接接头。 在引线配线衬垫的前表面上的中心线附近的位置处设有通槽。 焊球通过重力从引线接线板的前表面落入通槽。 因此，与滑块接触的接触区域被固定在滑块的一侧。

公开(公告)号：US20090196001A1

公开(公告)日：2009-08-06

申请号：US12360443

申请日：2009-01-27

Applicant: Masahiro SUNOHARA ,  Kei Murayama

Inventor： Masahiro SUNOHARA ,  Kei Murayama

IPC: H05K1/00 ,  B05D5/12

CPC classification number: H01H37/52 ,  H01H11/00 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K1/16 ,  H05K3/4092 ,  H05K3/4602 ,  H05K2201/0397 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/09481 ,  H05K2201/10053 ,  H05K2203/308

Abstract: A wiring board for use in mounting an electronic component includes a switch element portion interposed in a signal transmission line including a wiring layer linked to an electrode terminal of the electronic component. The switch element portion has such a structure as to change the shape thereof depending on a temperature, and to disconnect the signal transmission line when the temperature exceeds a predetermined temperature. A conductor layer which constitutes a portion of the signal transmission line is formed at the bottom of a cavity formed in an electronic component mounting surface side of the wiring board. One end of the switch element portion is fixedly connected to the wiring layer, and another end thereof is in contact with the conductor layer when the temperature is equal to or lower than the predetermined temperature.

Abstract translation: 用于安装电子部件的布线板包括插入在包括与电子部件的电极端子连接的布线层的信号传输线中的开关元件部。 开关元件部分具有根据温度改变其形状的结构，并且当温度超过预定温度时断开信号传输线。 构成信号传输线的一部分的导体层形成在形成在布线板的电子部件安装表面侧的空腔的底部。 当温度等于或低于预定温度时，开关元件部分的一端固定地连接到布线层，并且另一端与导体层接触。

公开(公告)号：US07554643B2

公开(公告)日：2009-06-30

申请号：US11515929

申请日：2006-09-06

Applicant: Kazuyuki Yamada

Inventor： Kazuyuki Yamada

IPC: G02F1/1345

CPC classification number: G02F1/1345 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/0393 ,  H05K3/242 ,  H05K3/361 ,  H05K2201/0397 ,  H05K2201/09236 ,  H05K2201/09354 ,  H05K2201/09672 ,  H05K2201/09727 ,  H05K2203/175

Abstract: An electro-optical device includes an electro-optical panel, and an interface board through which an image display signal is supplied to the electro-optical panel. The interface board includes a flexible film board, a plurality of terminals that are disposed on the film board, a plurality of wiring lines that are disposed on one surface of the film board and that are electrically connected to the terminals, respectively, and a first conductive member that is formed on the other surface of the film board and that is grounded. The first conductive member overlaps at least one of the wiring lines when the film board is seen in plan view, and the first conductive member is formed along the one wiring line.

Abstract translation: 电光装置包括电光面板和将图像显示信号通过其提供给电光面板的接口板。 接口板包括柔性薄膜板，设置在薄膜基板上的多个端子，分别设置在薄膜基板的一个表面上且与端子电连接的多个布线，第一 导电构件，其形成在薄膜基板的另一个表面上并且接地。 当在平面图中看到薄膜板时，第一导电构件与至少一个布线重叠，并且第一导电构件沿着一条布线形成。

公开(公告)号：US07540747B2

公开(公告)日：2009-06-02

申请号：US11381108

申请日：2006-05-01

Applicant: Donald A. Ice ,  Darin J. Douma ,  Phillip Anthony Kiely

Inventor： Donald A. Ice ,  Darin J. Douma ,  Phillip Anthony Kiely

IPC: H01R12/00

CPC classification number: H01R13/6608 ,  G02B6/4201 ,  G02B6/4246 ,  G02B6/4279 ,  G02B6/428 ,  H01L23/495 ,  H01L2924/0002 ,  H01R12/7082 ,  H01R13/405 ,  H05K1/023 ,  H05K1/0393 ,  H05K1/141 ,  H05K3/202 ,  H05K3/3405 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10121 ,  H05K2201/10446 ,  H05K2203/302 ,  H01L2924/00

Abstract: Exemplary embodiments of the present invention illustrate lead frame connectors for connecting optical sub-assemblies to printed circuit boards in optical transceiver modules. The lead frame connectors include a conductive lead structure that is encased in a plurality of polymer casings. The polymer casings provide electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. One or more passive components can mount to the conductors of the lead frame connector to aid with impedance matching between an optical sub-assembly, the lead frame connector, and the printed circuit board. The lead frame connectors connect to the leads associated with the optical sub-assemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical sub-assembly and the printed circuit board.

Abstract translation: 本发明的示例性实施例示出了用于将光学子组件连接到光收发器模块中的印刷电路板的引线框架连接器。 引线框架连接器包括被封装在多个聚合物壳体中的导电引线结构。 聚合物壳体为引线框架中的导体提供电绝缘以及用于成品部件的机械支撑。 一个或多个无源部件可以安装到引线框架连接器的导体，以有助于光学子组件，引线框架连接器和印刷电路板之间的阻抗匹配。 引线框架连接器连接到与光学子组件相关联的引线，并且被表面安装到印刷电路板上以在光学子组件和印刷电路板之间建立连接。

公开(公告)号：US07525764B2

公开(公告)日：2009-04-28

申请号：US11256800

申请日：2005-10-24

Applicant: Tetsuya Ohsawa ,  Yasuhito Funada ,  Hitoki Kanagawa

Inventor： Tetsuya Ohsawa ,  Yasuhito Funada ,  Hitoki Kanagawa

IPC: G11B5/60 ,  G11B21/21

CPC classification number: G11B5/4853 ,  G11B5/486 ,  H05K1/056 ,  H05K3/3442 ,  H05K3/3494 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2203/041 ,  H05K2203/107 ,  Y02P70/613

Abstract: An area 5 for mounting a magnetic head is formed on a metal board 1, a conductive layer 4 is formed as a circuit pattern via an insulation layer 2 interposed outside this area and up to a metal board 1. A pattern end 4 to be a connection terminal for connection with the terminal of the magnetic head is formed on the circuit pattern, an end face 4a of the pattern end 4 is aligned with an end face 2a of the insulation layer 2 directly beneath it or protruded in the terminating direction from the end face 2a, thereby providing a structure preventing irradiation of a laser beam on the insulation layer 2.

Abstract translation: 用于安装磁头的区域5形成在金属板1上，导电层4经由绝缘层2形成为电路图案，绝缘层2插入该区域的外部，直到金属板1为止。图案端4为 用于与磁头的端子连接的连接端子形成在电路图案上，图案端4的端面4a与绝缘层2的正下方的端面2a对齐，或者从终端方向突出 从而提供防止激光束在绝缘层2上的照射的结构。

公开(公告)号：US20090051606A1

公开(公告)日：2009-02-26

申请号：US12296509

申请日：2007-04-25

Applicant: Shozo Ochi ,  Hidenobu Nishikawa ,  Hiroshi Sakurai

Inventor： Shozo Ochi ,  Hidenobu Nishikawa ,  Hiroshi Sakurai

IPC: H01Q1/00 ,  H01Q1/22

CPC classification number: H01Q9/27 ,  G06K19/07732 ,  G06K19/07749 ,  G06K19/07771 ,  H01L2224/16225 ,  H01Q1/2225 ,  H01Q7/08 ,  H05K1/141 ,  H05K1/16 ,  H05K3/305 ,  H05K3/4084 ,  H05K3/4611 ,  H05K2201/0397 ,  H05K2201/086 ,  H05K2201/09972 ,  Y10T29/49016

Abstract: An electronic circuit module with a built-in antenna (1) includes the following elements: a mounting module having a wiring board (2), a passive component, and a semiconductor device; a resin sheet substrate (11) having an antenna pattern (12) formed on a first principle surface of a base thereof; and a magnetic layer interposed between the mounting module and the resin sheet substrate (11). These elements are housed in a case (16).

Abstract translation: 具有内置天线（1）的电子电路模块包括以下元件：具有布线板（2），无源元件和半导体器件的安装模块; 具有形成在其基材的第一主面上的天线图案的树脂片基板（11） 以及介于所述安装模块和所述树脂片基板（11）之间的磁性层。 这些元件容纳在壳体（16）中。

公开(公告)号：US07488904B2

公开(公告)日：2009-02-10

申请号：US11820980

申请日：2007-06-21

Applicant: Akihito Maegawa ,  Shinyu Nagashima

Inventor： Akihito Maegawa ,  Shinyu Nagashima

IPC: H01L23/28

CPC classification number: H05K3/202 ,  B29C45/14655 ,  B29C45/1671 ,  B29C2045/0027 ,  H05K1/056 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/10151 ,  H05K2201/10401 ,  H05K2201/10651

Abstract: A sensor unit (1) has a metal plate (10), a resin molded portion (20) and an oil temperature sensor (2). Busbars (4) made of a metal are arranged in the resin molded portion (20). Since the busbars (4) are insert-molded while having the exposed ends (4A) thereof tightly held by a pair of forming dies, a distance between the exposed ends (4A) and the placing surface 10A is held constant. Further, gate marks (5D) of the oil temperature sensor (2) are accommodated in recesses (10B) of the placing surface (10) and engaging grooves (9) and engaging projections (26A) are engaged. Thus, the oil temperature sensor (2) can be held in a proper posture. Additionally, the oil temperature sensor (2) can be held on the placing surface (10A) by riveting the exposed end (4A) and a terminal (8) of the oil temperature sensor (2).

Abstract translation: 传感器单元（1）具有金属板（10），树脂模制部分（20）和油温传感器（2）。 由树脂成型部（20）配置由金属构成的母线（4）。 由于母线（4）在将其暴露端（4A）紧紧地保持在一对成形模具上时被插入成型，所以露出端（4A）和放置面10A之间的距离保持恒定。 此外，油温传感器（2）的门标（5D）容纳在放置面（10）的凹部（10B）中，并且接合槽（9）和接合突起（26A）接合。 因此，可以将油温传感器（2）保持在适当的姿势。 此外，油温传感器（2）可以通过铆接暴露的端部（4A）和油温传感器（2）的端子（8）而保持在放置表面（10A）上。