公开(公告)号：US09538636B1

公开(公告)日：2017-01-03

申请号：US13803081

申请日：2013-03-14

Applicant: MACOM Technology Solutions Holdings, Inc.

Inventor： Christopher D. Weigand ,  Andrzej Rozbicki

IPC: H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K1/03 ,  H05K3/00 ,  H05K3/42

CPC classification number: H05K1/181 ,  H01L23/13 ,  H01L23/14 ,  H01L23/49805 ,  H01L23/49822 ,  H05K1/0201 ,  H05K1/0251 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/14 ,  H05K1/141 ,  H05K1/18 ,  H05K3/0097 ,  H05K3/429 ,  H05K2201/041 ,  H05K2201/066 ,  H05K2201/09181 ,  H05K2201/09509 ,  H05K2201/09854 ,  H05K2201/10719

Abstract: An apparatus having a plurality of insulating layers, a plurality of conductive layers and a plating is disclosed. The conductive layers may be separated by the insulating layers. A first pattern in a first of the conductive layers generally extends to an edge castellation. A second pattern in a second of the conductive layers may also extends to the edge castellation. The plating may be disposed in the edge castellation and connect the first pattern to the second pattern. The plating in the castellation may extend at most between a subset of the conductive layers.

Abstract translation: 公开了一种具有多个绝缘层，多个导电层和电镀层的装置。 导电层可以被绝缘层分离。 第一导电层中的第一图案通常延伸到边缘星座。 在第二导电层中的第二图案也可以延伸到边缘星座。 电镀可以设置在边缘地毯中并且将第一图案连接到第二图案。 地板中的电镀最多可以在导电层的子集之间延伸。

公开(公告)号：US20160311380A1

公开(公告)日：2016-10-27

申请号：US15137532

申请日：2016-04-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Sung Ki Jung

IPC: B60R11/04 ,  H04N5/225

CPC classification number: B60R11/04 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H05K1/144 ,  H05K1/147 ,  H05K1/148 ,  H05K2201/041

Abstract: A camera module for automobiles is disclosed. The camera module includes a lens unit, a housing, in front of which the lens unit is disposed, and a plurality of printed circuit boards disposed in the housing so as to be opposite the lens unit, wherein the housing is provided at the inner wall thereof with a plurality of steps, the steps being provided between the respective printed circuit boards so as to be spaced apart from each other for setting the distance between the respective printed circuit boards.

Abstract translation: 公开了一种用于汽车的相机模块。 相机模块包括透镜单元，壳体，前面设置透镜单元;以及多个印刷电路板，设置在壳体中以与透镜单元相对，其中壳体设置在内壁 具有多个台阶，所述台阶设置在相应的印刷电路板之间，以便彼此间隔开，以设定各印刷电路板之间的距离。

公开(公告)号：US20160165724A1

公开(公告)日：2016-06-09

申请号：US15045024

申请日：2016-02-16

Applicant: Kevin E. Wells ,  Richard C. Stamey

Inventor： Kevin E. Wells ,  Richard C. Stamey

IPC: H05K1/11 ,  G06F1/16 ,  H05K3/36 ,  H05K3/42 ,  H05K7/02 ,  H05K1/02

CPC classification number: H05K1/115 ,  G06F1/16 ,  G06F1/18 ,  G06F1/183 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/421 ,  H05K2201/041 ,  H05K2201/10719 ,  Y02P70/613 ,  Y10T29/49128 ,  H01L2924/00

Abstract: Modular printed circuit board (PCB) structures and methods of producing them are described herein. In some embodiments, a PCB structure may include a first PCB module including first structures on one or more layers of the first PCB module. The PCB structure may further include a second PCB module including second structures on one or more layers of the second PCB module. The PCB structure may additionally include a middle layer between the first PCB module and the second PCB module. The middle layer electrically coupling, without connectors, one or more of the first structures aligned with one or more of the second structures.

Abstract translation: 本文描述了模块化印刷电路板（PCB）结构及其制造方法。 在一些实施例中，PCB结构可以包括第一PCB模块，其包括在第一PCB模块的一个或多个层上的第一结构。 PCB结构还可以包括第二PCB模块，其包括在第二PCB模块的一个或多个层上的第二结构。 PCB结构还可以包括在第一PCB模块和第二PCB模块之间的中间层。 中间层电耦合，没有连接器，一个或多个第一结构与一个或多个第二结构对准。

公开(公告)号：US20160095218A1

公开(公告)日：2016-03-31

申请号：US14858242

申请日：2015-09-18

Applicant: KYOCERA Circuit Solutions, Inc.

Inventor： Keizou SAKURAI

IPC: H05K1/11 ,  H05K1/09 ,  H05K1/03 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/0218 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/552 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/3025 ,  H05K1/144 ,  H05K1/181 ,  H05K1/183 ,  H05K3/426 ,  H05K3/4697 ,  H05K2201/041 ,  H05K2201/0959 ,  H05K2201/09981 ,  H05K2201/10545 ,  H05K2203/025 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A composite wiring board includes a first wiring board having an opening for housing an electronic component, and including a plurality of first connection pads on an upper surface and a plurality of second connection pads on a lower surface, and a second wiring board having the electronic component mounted on a lower surface, including a third connection pad provided on the lower surface on an outer peripheral side and bonded to the first connection pad through a solder, and disposed on the first wiring board so as to cover the opening, in which a grounding inner wall conductor layer is deposited on an inner wall of the opening around the electronic component, and a grounding conductor layer is deposited on the lower surface of the second wiring board and connected to the inner wall conductor layer through a solder.

Abstract translation: 复合布线板包括具有用于容纳电子部件的开口的第一布线板，并且在上表面上包括多个第一连接焊盘和在下表面上的多个第二连接焊盘，以及具有电子部件的第二布线板 组件安装在下表面上，包括设置在外周侧的下表面上的第三连接焊盘，并通过焊料粘合到第一连接焊盘，并且设置在第一布线板上以覆盖开口，其中 接地内壁导体层沉积在围绕电子部件的开口的内壁上，并且接地导体层沉积在第二布线板的下表面上，并通过焊料与内壁导体层连接。

公开(公告)号：US09245828B2

公开(公告)日：2016-01-26

申请号：US13940121

申请日：2013-07-11

Applicant: Mindspeed Technologies, Inc.

Inventor： Atul K. Gupta ,  Ryan S. Latchman ,  Marek S. Tlalka

IPC: H01L23/488 ,  H01L23/00 ,  H01L25/065 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H01L23/488 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/15747 ,  H05K1/0209 ,  H05K1/111 ,  H05K1/141 ,  H05K2201/041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A package and integrated circuit assembly is configured to perform signal conditioning on a signal. The assembly includes a line card having line card contacts that correspond to conductors in the line card connector. Two or more integrated circuits are configured to perform signal conditioning on the signal and the two or more integrated circuits are configured within a package into at least a first row and a second row on the package. The package includes a grid array of bonding pads to electrically connect to the two or more integrated circuits through bond wires or down bonds such that the structure of the grid array corresponds in physical arrangement or bond pad pitch to the line card contacts. This assembly also includes an electrical connection from the two or more integrated circuits to the line card through the package.

Abstract translation: 封装和集成电路组件被配置为对信号执行信号调节。 组件包括具有对应于线卡连接器中的导体的线卡触点的线卡。 两个或多个集成电路被配置为对信号执行信号调节，并且两个或更多个集成电路在封装内配置成封装中的至少第一行和第二行。 封装包括焊盘的栅格阵列，以通过接合线或向下接合电连接到两个或多个集成电路，使得栅格阵列的结构在物理布置或接合焊盘间距对应于线卡接触。 该组件还包括通过封装从两个或多个集成电路到线卡的电连接。

公开(公告)号：US20150359100A1

公开(公告)日：2015-12-10

申请号：US14432195

申请日：2014-04-30

Applicant: INTEL CORPORATION

Inventor： Junfeng Zhao ,  Saeed S. Shojaie ,  Cheng Yang

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  H05K1/14

CPC classification number: H05K1/181 ,  H01L23/31 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/48 ,  H01L25/00 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/162 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/14 ,  H05K3/303 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10287 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/0415 ,  Y10T29/49128 ,  Y10T29/49131

Abstract: Embodiments of integrated circuit (IC) assemblies and related techniques are disclosed herein. For example, in some embodiments, an IC assembly may include a first printed circuit board (PCB) having a first face and an opposing second face; a die electrically coupled to the first face of the first PCB; a second PCB having a first face and an opposing second face, wherein the second face of the second PCB is coupled to the first face of the first PCB via one or more solder joints; and a molding compound. The molding compound may be in contact with the first face of the first PCB and the second face of the second PCB. Other embodiments may be disclosed and/or claimed.

Abstract translation: 本文公开了集成电路（IC）组件和相关技术的实施例。 例如，在一些实施例中，IC组件可以包括具有第一面和相对的第二面的第一印刷电路板（PCB） 电连接到第一PCB的第一面的模具; 第二PCB，其具有第一面和相对的第二面，其中所述第二PCB的所述第二面经由一个或多个焊点而耦合到所述第一PCB的所述第一面; 和模塑料。 模塑料可以与第一PCB的第一面和第二PCB的第二面接触。 可以公开和/或要求保护其他实施例。

公开(公告)号：US20150194753A1

公开(公告)日：2015-07-09

申请号：US14664900

申请日：2015-03-22

Applicant: Apple Inc.

Inventor： John Raff ,  Robert Scritzky

IPC: H01R12/71 ,  H05K1/18 ,  H05K3/36 ,  H05K1/14

CPC classification number: H01R12/716 ,  H01R12/79 ,  H01R13/20 ,  H05K1/0281 ,  H05K1/144 ,  H05K1/183 ,  H05K3/361 ,  H05K2201/041 ,  H05K2201/10189 ,  H05K2201/10265 ,  Y10T29/49126

Abstract: Board-to-board connectors that may consume a reduced amount of space in an electronic device by having a reduced height, provide a durable and reliable connection, and may be easy to manufacture. In one example, a board-to-board connector having a reduced height may reside at least partially in a recess or opening in a printed circuit board or other substrate.

Abstract translation: 板对板连接器可以通过具有减小的高度而消耗电子设备中的空间，提供耐用和可靠的连接，并且可以容易地制造。 在一个示例中，具有降低的高度的板对板连接器至少部分地可以位于印刷电路板或其他基板中的凹部或开口中。

公开(公告)号：US09042116B2

公开(公告)日：2015-05-26

申请号：US13781677

申请日：2013-02-28

Applicant: HONG FU JIN PRECISION INDUSTRY (WuHan) CO., LTD. ,  HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Hsin-Kuan Wu ,  Hou-Yuan Chou

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/144 ,  H05K1/141 ,  H05K3/368 ,  H05K2201/041 ,  H05K2201/10363

Abstract: A printed circuit board includes a motherboard and a daughterboard. The motherboard includes at least one first signal pad and defines at least one via under the at least one first signal pad. The daughterboard includes at least one second signal pad and defines at least one via under the at least one second signal pad. The at least one first signal pad and the at least one second signal pad are sucked into the respective vias on the motherboard and the daughterboard according to siphon principle to allow each of the first signal pads and the second signal pads to form uneven top surfaces, the uneven top surfaces of the at least one first signal pads and the at least one second signal pads are connected to each other for electronically connecting the daughterboard to the motherboard.

Abstract translation: 印刷电路板包括母板和子板。 主板包括至少一个第一信号焊盘并且限定至少一个第一信号焊盘下的至少一个通孔。 所述子板包括至少一个第二信号焊盘并且限定所述至少一个第二信号焊盘下的至少一个通孔。 所述至少一个第一信号焊盘和所述至少一个第二信号焊盘根据虹吸原理被吸入主板和子板上的相应通孔中，以允许第一信号焊盘和第二信号焊盘中的每一个形成不均匀的顶表面， 至少一个第一信号焊盘和至少一个第二信号焊盘的不平坦的顶表面彼此连接，以将子板电连接到主板。

公开(公告)号：US08975525B2

公开(公告)日：2015-03-10

申请号：US13614314

申请日：2012-09-13

Applicant: Kevin Bills ,  Mahesh Bohra ,  Jinwoo Choi ,  Tae Hong Kim ,  Rohan Mandrekar

Inventor： Kevin Bills ,  Mahesh Bohra ,  Jinwoo Choi ,  Tae Hong Kim ,  Rohan Mandrekar

IPC: H05K1/00 ,  H05K1/02 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49822 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/024 ,  H05K1/0251 ,  H05K1/113 ,  H05K1/144 ,  H05K2201/0187 ,  H05K2201/041 ,  H05K2201/09481 ,  H05K2201/09718 ,  H05K2201/10734 ,  Y10T29/49124 ,  Y10T29/49151 ,  H01L2924/00

Abstract: A multi layer interconnecting substrate has at least two spaced apart metal layers with a conductive pad on each one of the metal layers. Two different types of insulating layers are placed between the metal layers. The placement is such that one of the two different types of insulating layers is placed between the conductive pads and the other type of insulating layer is placed between the two spaced apart metal layers.

Abstract translation: 多层互连衬底具有至少两个间隔开的金属层，每个金属层上具有导电焊盘。 在金属层之间放置两种不同类型的绝缘层。 这种放置使得两种不同类型的绝缘层中的一种被放置在导电焊盘之间，另一种类型的绝缘层被放置在两个间隔开的金属层之间。

公开(公告)号：US20150060127A1

公开(公告)日：2015-03-05

申请号：US14473110

申请日：2014-08-29

Applicant: IBIDEN CO., LTD.

Inventor： Makoto Terui ,  Takashi Kariya ,  Yoshinori Shizuno ,  Masatoshi Kunieda

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/12 ,  H05K1/02

CPC classification number: H05K1/141 ,  H01L2224/16225 ,  H01L2224/81193 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/19107 ,  H05K1/0243 ,  H05K3/1241 ,  H05K3/323 ,  H05K3/3436 ,  H05K2201/041 ,  H05K2203/173 ,  Y10T29/49128

Abstract: A combined printed wiring board includes a multilayer printed wiring board, and a wiring film fixed to a surface of the multilayer printed wiring board and including a first wiring structure formed to connect multiple semiconductor elements and a second wiring structure formed to connect the multilayer printed wiring board and each of the semiconductor elements.

Abstract translation: 组合印刷线路板包括多层印刷线路板和固定到多层印刷线路板的表面上的布线膜，并且包括形成为连接多个半导体元件的第一布线结构和形成为连接多层印刷布线的第二布线结构 板和每个半导体元件。