公开(公告)号：US09978725B2

公开(公告)日：2018-05-22

申请号：US14903834

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L25/075 ,  H01L33/62 ,  H05K1/02 ,  H05K3/28 ,  H01L33/50 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided is an LED lamp using a nano-scale LED electrode assembly. The LED lamp using the nano-scale LED electrode assembly may solve limitations in which, when a nano-scale LED device according to the related art stands up and is three-dimensionally coupled to an electrode, it is difficult to allow the nano-scale LED device to stand up, and when the nano-scale LED devices are coupled to one-to-one correspond to electrodes different from each other, product quality is deteriorated. Thus, the nano-scale LED device having a nano unit may be connected to the two electrodes different from each other without causing defects, and light extraction efficiency may be improved due to the directivity of the nano-scale LED devices connected to the electrodes. Furthermore, deterioration in function of the LED lamp due to the defects of a portion of the nano-scale LEDs provided in the LED lamp may be minimized, and the LED lamp may have a flexible structure and shape by using the nano-scale LED electrode assembly of which a portion is deformable according to the used purpose or position of the LED lamp.

公开(公告)号：US09787022B2

公开(公告)日：2017-10-10

申请号：US15146652

申请日：2016-05-04

Applicant: JoyLabz LLC

Inventor： Bryan Randall Wilcox ,  Todd Eddie ,  Jay Saul Silver

IPC: H01R11/30 ,  H01R13/62 ,  G06F1/16 ,  H05K1/11 ,  H05K5/02 ,  H01R13/66 ,  H01R11/24

CPC classification number: H01R13/6205 ,  G06F1/16 ,  H01R11/24 ,  H01R13/6658 ,  H01R2201/06 ,  H05K1/11 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K5/0278 ,  H05K2201/083 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/09481 ,  H05K2201/10386

Abstract: Systems and methods for magnetic coupling. One system includes an external computing device and a connector having a conductive end. The system also includes a printed circuit board. The printed circuit board includes a connector side opposite a back side. The connector side has a contact pad with an aperture. The printed circuit board also includes a magnet positioned on the back side of the printed circuit board. The magnet provides a magnetic field configured to provide magnetic attraction forces to a connector contacting the contact pad. The printed circuit board also includes a communication terminal. The system also includes a circuit in communication with the printed circuit board through the connector and contact pad.

公开(公告)号：US20170150609A1

公开(公告)日：2017-05-25

申请号：US15354825

申请日：2016-11-17

Applicant: TOYODA GOSEI CO., LTD.

Inventor： Tomohiro MIWA ,  Hideaki KATO ,  Daisuke KATO ,  Shota SHIMONISHI

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05B33/0803 ,  H05K1/0209 ,  H05K1/111 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09427 ,  H05K2201/10106 ,  Y02P70/611

Abstract: A light-emitting device includes a plurality of light-emitting elements mounted on a wiring board, and a plurality of wirings that are provided on the wiring board and each connect predetermined ones of the plurality of light-emitting elements in series. A central element-connection wiring has a longest wiring length among the plurality of wirings, and a voltage applied to a central element is a lowest one of voltages applied to the plurality of light-emitting elements. A closest one of the plurality of light-emitting elements to a center of an element mounting region of the wiring board is defined as the central element, and a wiring that connects in series the central element is defined as the central element-connection wiring.

公开(公告)号：US09648739B2

公开(公告)日：2017-05-09

申请号：US14558614

申请日：2014-12-02

Applicant: CANON KABUSHIKI KAISHA

Inventor： Takashi Aoki ,  Yasuhiro Sawada

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K1/111 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09272 ,  H05K2201/09427 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

Abstract: An electronic component mounting structure includes a first land, a second land making a pair with the first land, an electronic component having a chip shape and including a first electrode connected to the first land and a second electrode connected to the second land, a first wiring pattern connected to the first land, and a second wiring pattern connected to the second land and including a first partial pattern overlapping a portion of a body of the electronic component in planar view, the portion being not covered with the pair of electrodes, a second partial pattern formed integral with the first partial pattern and overlapping the first electrode of the electronic component in planar view, and a third partial pattern formed integral with the second partial pattern and parallel to the first wiring pattern.

公开(公告)号：US20170053726A1

公开(公告)日：2017-02-23

申请号：US15211967

申请日：2016-07-15

Applicant: TDK Corporation

Inventor： Nobuo Takagi

IPC: H01F27/24 ,  H01F41/076 ,  H05K1/18 ,  H05K1/11 ,  H01F27/29 ,  H01F27/28

CPC classification number: H05K1/165 ,  H01F17/045 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/292 ,  H01F41/076 ,  H01F2017/0093 ,  H05K1/111 ,  H05K1/16 ,  H05K1/181 ,  H05K3/30 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/1003 ,  Y02P70/611

Abstract: Disclosed herein is a coil component that includes a drum-shaped core having a flange portion and a winding core around which a wire is wound. The flange portion includes first and second side surface opposite to each other, and a mounting surface. The mounting surface of the flange portion includes first and second convex portions and a concave portion positioned therebetween. The first convex portion has a third side surface parallel to the first side surface of the flange portion. The second convex portion has a fourth side surface parallel to the second side surface of the flange portion. A level difference between the first side surface and the third side surface is larger than a level difference between the second side surface and the fourth side surface.

Abstract translation: 本文公开了一种线圈部件，其包括具有凸缘部分的卷筒形芯和卷绕在其上的绕线芯。 凸缘部包括彼此相对的第一和第二侧表面以及安装表面。 凸缘部的安装面包括第一和第二凸部以及位于其间的凹部。 第一凸部具有与凸缘部的第一侧面平行的第三侧面。 第二凸部具有与凸缘部的第二侧面平行的第四侧面。 第一侧表面和第三侧表面之间的水平差大于第二侧表面和第四侧表面之间的水平差。

公开(公告)号：US09478879B2

公开(公告)日：2016-10-25

申请号：US13935292

申请日：2013-07-03

Applicant: PANASONIC CORPORATION

Inventor： Hiroshi Iwano ,  Mitsuru Iida ,  Daisuke Sato ,  Hidetoshi Takeyama

IPC: H01R12/79 ,  H05K1/11 ,  H01R12/61 ,  H05K3/00 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01R12/613 ,  H01R12/79 ,  H05K1/11 ,  H05K1/114 ,  H05K1/117 ,  H05K3/0038 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2201/2072 ,  H05K2203/167

Abstract: A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.

Abstract translation: 用于连接器组件的插座（母连接器）包括由绝缘材料制成的柔性薄板构成的薄膜基片。 薄膜基片设置有适于插入插头（公连接器）的连接柱中的连接通孔。 连接衬垫围绕各个连接通孔形成在薄膜基片的第一表面上。 连接焊盘包括第一焊盘和第二焊盘。 薄膜基板在第一表面上设置有连接到第一焊盘的第一图案化导体和连接到第二焊盘的第三图案化导体。 第三图案化导体通过盲孔通过第二图案导体连接到形成在膜基板的第二表面上的第二图案化导体，所述盲孔通过从第二表面镗孔而形成，以到达第三图案化导体。

公开(公告)号：US09159665B2

公开(公告)日：2015-10-13

申请号：US13645397

申请日：2012-10-04

Applicant: STATS ChipPAC, Ltd.

Inventor： Rajendra D. Pendse

IPC: H01L21/60 ,  H01L23/488 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01L23/49838 ,  H01L21/563 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13013 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/1607 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81136 ,  H01L2224/81193 ,  H01L2224/81204 ,  H01L2224/8121 ,  H01L2224/81211 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/3011 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/09427 ,  H05K2201/09727 ,  H05K2201/0989 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A flip chip interconnect of a die on a substrate is made by mating the interconnect bump onto a narrow interconnect pad on a lead or trace, rather than onto a capture pad. The width of the narrow interconnect pad is less than a base diameter of bumps on the die to be attached. Also, a flip chip package includes a die having solder bumps attached to interconnect pads in an active surface, and a substrate having narrow interconnect pads on electrically conductive traces in a die attach surface, in which the bumps are mated onto the narrow pads on the traces.

Abstract translation: 通过将互连凸块配合到引线或迹线上的窄互连焊盘而不是捕获板上，来制造衬底上的管芯的倒装芯片互连。 窄互连焊盘的宽度小于要连接的裸片上的凸块的基底直径。 此外，倒装芯片封装包括具有附着到有源表面中的互连焊盘的焊料凸块的芯片，以及在芯片附着表面中的导电迹线上具有窄互连焊盘的衬底，其中凸块配合到 痕迹

公开(公告)号：US20150288390A1

公开(公告)日：2015-10-08

申请号：US14664954

申请日：2015-03-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： MAKI NAKAMURA ,  SUGURU FUJITA

IPC: H04B1/03

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0216 ,  H05K1/144 ,  H05K3/3436 ,  H05K2201/043 ,  H05K2201/09381 ,  H05K2201/09418 ,  H05K2201/09427 ,  H05K2201/10098 ,  H05K2201/10734 ,  H05K2203/041 ,  Y02P70/611 ,  Y10T29/4913

Abstract: There is provided a radio module including: a first substrate; a second substrate that has a side which is opposed to the first substrate and on which an electronic component is mounted; a conductive member that connects the first substrate and the second substrate and that transmits a signal between the first substrate and the second; at least one first pad that is disposed in the first substrate and connected to the conductive member; and at least one second pad that is disposed in the second substrate and connected to the conductive member, each of the at least one second pad being opposed to each of the at least one first pad and each of larger than the at least one first pad in area.

Abstract translation: 提供了一种无线电模块，包括：第一基板; 第二基板，其具有与第一基板相对的一侧，并且安装有电子部件; 导电构件，其连接所述第一基板和所述第二基板，并且在所述第一基板和所述第二基板之间传递信号; 至少一个第一衬垫，其设置在所述第一衬底中并连接到所述导电构件; 以及至少一个第二垫，其设置在所述第二基板中并连接到所述导电构件，所述至少一个第二垫中的每一个与所述至少一个第一垫中的每一个相对，并且每个第二垫大于所述至少一个第一垫 在区域。

公开(公告)号：US20150221436A1

公开(公告)日：2015-08-06

申请号：US14549824

申请日：2014-11-21

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takanobu KATSUYAMA ,  Yasunari NAKAMURA ,  Naoto MURANISHI ,  Masaaki TANIGUCHI ,  Takashi SAWADA

IPC: H01G2/06 ,  H01G4/012 ,  H01G4/30 ,  H05K1/11 ,  H05K1/18 ,  H01G4/12 ,  H01G4/248

CPC classification number: H01G2/065 ,  H01G4/012 ,  H01G4/232 ,  H05K1/111 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/162 ,  Y02P70/611

Abstract: A first terminal electrode extends from a second principal surface onto first and second side surfaces and a first end surface such as not to reach a first principal surface. A second terminal electrode extends from the second principal surface onto the first and second side surfaces and a second end surface such as not to reach the first principal surface. A third terminal electrode extends from the second principal surface onto the first and second side surfaces such as not to reach the first principal surface.

Abstract translation: 第一端子电极从第二主表面延伸到第一和第二侧表面以及第一端面，例如不能到达第一主表面。 第二端子电极从第二主表面延伸到第一和第二侧表面以及第二端表面，例如不能到达第一主表面。 第三端子电极从第二主表面延伸到第一和第二侧表面上，例如不能到达第一主表面。

公开(公告)号：US09099242B2

公开(公告)日：2015-08-04

申请号：US13588696

申请日：2012-08-17

Applicant: Young Ghyu Ahn ,  Sang Soo Park ,  Min Cheol Park ,  Se Hwa Jeong

Inventor： Young Ghyu Ahn ,  Sang Soo Park ,  Min Cheol Park ,  Se Hwa Jeong

IPC: H05K1/16 ,  H01G4/005 ,  H05K1/02 ,  H01G4/30

CPC classification number: H01G4/005 ,  H01G4/30 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09427 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/2045 ,  Y02P70/611

Abstract: A laminated chip electronic component includes: a ceramic body including internal electrodes and dielectric layers; external electrodes formed to cover both end portions of the ceramic body in a length direction; an active layer in which the internal electrodes are disposed in an opposing manner, while having the dielectric layers interposed therebetween, to form capacitance; and upper and lower cover layers formed on upper and lower portions of the active layer in a thickness direction, the lower cover layer having a thickness greater than that of the upper cover layer.

Abstract translation: 层叠芯片电子部件包括：陶瓷体，其包括内部电极和电介质层; 形成为在长度方向上覆盖陶瓷体的两端部的外部电极; 其中内部电极以相对的方式设置在其间插入电介质层的有源层以形成电容; 以及在有源层的厚度方向的上部和下部形成的上部和下部覆盖层，所述下部覆盖层的厚度大于上部覆盖层的厚度。