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公开(公告)号：US09972798B2
公开(公告)日：2018-05-15
申请号：US13883313
申请日：2011-12-05
Applicant: Dipankar Ghosh , Ge Jiang , Rui Yang
Inventor： Dipankar Ghosh , Ge Jiang , Rui Yang
CPC classification number: H01L51/0587 , H01L27/2409 , H01L51/0575 , H05K1/16 , H05K1/185 , H05K2201/10174
Abstract: A composite diode (100) includes a first conductive sheet, (110) a second conductive sheet, (120) and a nonlinear polymer composite material (130) sandwiched therebetween. The nonlinear polymer composite material comprises nonlinear inorganic particles (150) retained in a polymeric binder material (140). Methods of making the composite diode, and electronic devices including them, are also disclosed.
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公开(公告)号：US09947467B2
公开(公告)日：2018-04-17
申请号：US15495811
申请日：2017-04-24
Applicant: MJG INNOVATIONS, LLC
Inventor： Mark Eugene Goodson
IPC: H01G2/14 , H02H9/04 , H05K1/18 , H01G2/10 , H01G2/06 , H05K3/32 , H02H9/00 , H01L29/872 , H02H3/16
CPC classification number: H01G2/14 , H01G2/06 , H01G2/10 , H01L29/872 , H02H3/165 , H02H9/005 , H02H9/04 , H02H9/041 , H02H9/043 , H02H9/044 , H05K1/181 , H05K3/32 , H05K2201/10015 , H05K2201/10174 , H05K2201/10196
Abstract: A protected capacitor system/method implementing enhanced transient over-voltage suppression is disclosed. The system/method incorporates one or more surge suppression devices (SSDs) proximally located and in parallel with a capacitor structure to produce an overall protected capacitor structure having enhanced reliability and simultaneous ability to resist transient overvoltage conditions. The SSDs are formed from series combinations of transient voltage surge suppressors (TVSs) (metal oxide varistor (MOV), diode for alternating current (DIAC), and/or silicon diode for alternating current (SIDAC)) and corresponding shunt diode rectifiers (SDRs) and placed in parallel across a capacitor structure to locally suppress voltage transients across the capacitor structure in excess of the voltage rating of the capacitor structure. The parallel shunting TVS/SDR pairs may be integrated into a printed circuit board (PCB) assembly that is externally attached to the capacitor structure or encapsulated in an enclosure incorporating the capacitor structure.
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公开(公告)号：US09807848B2
公开(公告)日：2017-10-31
申请号：US14792092
申请日：2015-07-06
Inventor： Shlomo Magdassi , Michael Grouchko , Michael Layani
IPC: H05B33/28 , H01B1/02 , H01B1/10 , H01L31/0224 , C23C4/18 , C23C26/00 , H01L31/18 , H05K1/03 , H05K1/09 , H05K3/12 , C23C16/513 , B05D3/10 , B05D5/06 , B05D5/12 , H01L33/42 , H05K1/02 , H05K3/14
CPC classification number: H05B33/28 , B05D3/107 , B05D5/061 , B05D5/12 , C23C4/18 , C23C16/513 , C23C26/00 , H01B1/02 , H01B1/026 , H01B1/10 , H01L31/022466 , H01L31/1884 , H01L33/42 , H01L2924/0002 , H01L2933/0016 , H05K1/0225 , H05K1/0278 , H05K1/0306 , H05K1/0313 , H05K1/0386 , H05K1/0393 , H05K1/092 , H05K1/095 , H05K1/097 , H05K3/125 , H05K3/14 , H05K2201/0257 , H05K2201/026 , H05K2201/0302 , H05K2201/0323 , H05K2201/0329 , H05K2201/0338 , H05K2201/035 , H05K2201/0391 , H05K2201/0969 , H05K2201/10053 , H05K2201/10106 , H05K2201/10151 , H05K2201/10166 , H05K2201/10174 , H05K2203/0545 , H05K2203/1173 , H05K2203/125 , Y02E10/50 , Y10T428/24273 , Y10T428/24331 , Y10T428/249978 , Y10T428/249979 , H01L2924/00
Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.
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公开(公告)号：US20170295641A1
公开(公告)日：2017-10-12
申请号：US15481634
申请日：2017-04-07
Applicant: Azbil Corporation
Inventor： Hiroaki NAGOYA
CPC classification number: H05K1/0209 , H05K1/0262 , H05K3/0091 , H05K3/284 , H05K7/205 , H05K7/209 , H05K2201/062 , H05K2201/068 , H05K2201/10174 , H05K2203/125 , H05K2203/16
Abstract: To improve a substrate unit in which safety maintaining devices are mounted on a wiring substrate while suppressing manufacturing costs.A substrate unit includes a wiring substrate, electronic components as safety maintaining devices arranged on the wiring substrate, plural metal components arranged on the wiring substrate at distances from the electronic components as the safety maintaining devices so as to satisfy a requirement for an intrinsically safe explosion-proof construction, and a resin film covering at least one of the plural metal components and the electronic components as the safety maintaining devices on the wiring substrate, in which the resin film has a thermal conductivity of at least 1.0 W/mk and a dielectric breakdown strength of at least 3.0 kV/mm.
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公开(公告)号：US20170229241A1
公开(公告)日：2017-08-10
申请号：US15495811
申请日：2017-04-24
Applicant: MJG INNOVATIONS, LLC
Inventor： Mark Eugene Goodson
CPC classification number: H01G2/14 , H01G2/06 , H01G2/10 , H01L29/872 , H02H3/165 , H02H9/005 , H02H9/04 , H02H9/041 , H02H9/043 , H02H9/044 , H05K1/181 , H05K3/32 , H05K2201/10015 , H05K2201/10174 , H05K2201/10196
Abstract: A protected capacitor system/method implementing enhanced transient over-voltage suppression is disclosed. The system/method incorporates one or more surge suppression devices (SSDs) proximally located and in parallel with a capacitor structure to produce an overall protected capacitor structure having enhanced reliability and simultaneous ability to resist transient overvoltage conditions. The SSDs are formed from series combinations of transient voltage surge suppressors (TVSs) (metal oxide varistor (MOV), diode for alternating current (DIAC), and/or silicon diode for alternating current (SIDAC)) and corresponding shunt diode rectifiers (SDRs) and placed in parallel across a capacitor structure to locally suppress voltage transients across the capacitor structure in excess of the voltage rating of the capacitor structure. The parallel shunting TVS/SDR pairs may be integrated into a printed circuit board (PCB) assembly that is externally attached to the capacitor structure or encapsulated in an enclosure incorporating the capacitor structure.
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Patent Agency Ranking
公开(公告)号：US20170223834A1
公开(公告)日：2017-08-03
申请号：US15297190
申请日：2016-10-19
Applicant: CYNTEC CO., LTD.
Inventor： CHI-FENG HUANG , BAU-RU LU , DA-JUNG CHEN
IPC: H05K1/18
CPC classification number: H05K1/181 , H01F27/06 , H01F27/292 , H01F2027/065 , H01F2027/297 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/10166 , H05K2201/10174
Abstract: A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is disposed under the magnetic device. First and second electronic devices are disposed between a bottom surface of the magnetic device and a top surface of the substrate. The first and second electronic devices comprise first and third terminals, disposed on first and second surfaces thereof, respectively, electrically connected to the magnetic device without using the substrate. The first and second electronic devices also comprise second and fourth terminals, disposed on second and fourth surfaces thereof, respectively, electrically connected to the substrate.
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公开(公告)号：US09642258B2
公开(公告)日：2017-05-02
申请号：US13865841
申请日：2013-04-18
Applicant: Brewer Science Inc.
Inventor： Liyong Diao , Wu-Sheng Shih , James E. Lamb, III , Christopher Landorf
CPC classification number: H05K1/162 , H01F5/003 , H01F27/2804 , H01G4/008 , H01G4/14 , H01G4/40 , H05K1/0313 , H05K1/097 , H05K1/165 , H05K2201/026 , H05K2201/0323 , H05K2201/10128 , H05K2201/10151 , H05K2201/10159 , H05K2201/10166 , H05K2201/10174
Abstract: The present invention provides novel tank circuits that are totally passive, and they are made of conductive-grade carbon nanotubes (CNTs) on substrates, and preferably flexible substrates. These components and structures contain no traditional electronic materials such as silicon, metal oxides, or ceramics, and they are totally organic. They may be used in applications where the resonant frequency and amplitude of the sensor can be modulated by a thermal, mechanical, or chemical signal, such as temperature, strain, pressure, vibration, or humidity. All-organic, and consequently combustible, passive RF sensors have unique applications for defense and consumer industries.
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公开(公告)号：US20170118844A1
公开(公告)日：2017-04-27
申请号：US15175378
申请日：2016-06-07
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Bruce J. CHAMBERLIN , Andreas HUBER , Harald HUELS , Thomas STRACH , Thomas-Michael WINKEL
CPC classification number: H05K1/184 , B23K1/0016 , H05K1/0298 , H05K1/092 , H05K1/111 , H05K1/113 , H05K1/116 , H05K1/162 , H05K1/165 , H05K1/167 , H05K1/185 , H05K1/186 , H05K3/0047 , H05K3/3447 , H05K3/429 , H05K3/46 , H05K3/4644 , H05K3/4697 , H05K2201/093 , H05K2201/09309 , H05K2201/09327 , H05K2201/09345 , H05K2201/09381 , H05K2201/09518 , H05K2201/09545 , H05K2201/096 , H05K2201/09845 , H05K2201/10 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003 , H05K2201/1006 , H05K2201/10174
Abstract: Embedding a discrete electrical device in a printed circuit board (PCB) includes: providing a vertical via as a blind hole from a horizontal surface of the PCB to an electrically conductive structure in a first layer, the first layer being one layer of a first core section of a plurality of core sections vertically arranged above each other, each core section including lower and upper conductive layers, and a non-conductive layer in between; inserting the electrical device into the via, with the device extending within at least two of the core sections; establishing a first electrical connection between a first electrical device contact device and the electrically conductive structure in the first layer; and establishing a second electrical connection between a second electrical device contact and a second layer, the second layer being one of the electrically conductive layers of a second horizontal core section.
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59.发明申请公开(公告)号：US20170104505A1
公开(公告)日：2017-04-13
申请号：US15346828
申请日：2016-11-09
Applicant: HARRIS CORPORATION
Inventor： JOHN MCINTYRE , KEVIN DELL , CHRISTOPHER DAVID MACKEY , JOHN PAUL SHOOTS
CPC classification number: H04B1/0483 , H01L23/13 , H01L23/66 , H01L29/06 , H01L29/0688 , H01L2924/1015 , H01P3/08 , H03K17/74 , H04B1/006 , H05K1/0243 , H05K3/30 , H05K2201/10098 , H05K2201/10174
Abstract: An RF communications device may include a circuit board having a dielectric layer and conductive traces, one of the conductive traces defining a transmission line. The RF communications device may also include an RF transmitter carried by the circuit board and coupled to the transmission line, and RF switching circuits, each RF switching circuit including a substrate having a tapered proximal end coupled to the transmission line, and a distal end extending outwardly on the convex side of the transmission line. Each RF switching circuit may include a series diode, and a shunt diode coupled to the series diode, the series diode extending from the tapered proximal end and across an interior of the substrate.
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60.发明申请公开(公告)号：US20170104504A1
公开(公告)日：2017-04-13
申请号：US15346819
申请日：2016-11-09
Applicant: HARRIS CORPORATION
Inventor： JOHN MCINTYRE , KEVIN DELL , CHRISTOPHER DAVID MACKEY , JOHN PAUL SHOOTS
CPC classification number: H04B1/0483 , H01L23/13 , H01L23/66 , H01L29/06 , H01L29/0688 , H01L2924/1015 , H01P3/08 , H03K17/74 , H04B1/006 , H05K1/0243 , H05K3/30 , H05K2201/10098 , H05K2201/10174
Abstract: An RF communications device may include a circuit board having a dielectric layer and conductive traces, one of the conductive traces defining a transmission line. The RF communications device may also include an RF transmitter carried by the circuit board and coupled to the transmission line, and RF switching circuits, each RF switching circuit including a substrate having a tapered proximal end coupled to the transmission line, and a distal end extending outwardly on the convex side of the transmission line. Each RF switching circuit may include a series diode, and a shunt diode coupled to the series diode, the series diode extending from the tapered proximal end and across an interior of the substrate.
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