公开(公告)号：US06664482B1

公开(公告)日：2003-12-16

申请号：US09561591

申请日：2000-05-01

Applicant: Ian P. Shaeffer ,  Everett Basham ,  Christopher D. Price

Inventor： Ian P. Shaeffer ,  Everett Basham ,  Christopher D. Price

IPC: H05K111

CPC classification number: H05K3/3484 ,  H01R31/08 ,  H05K1/0293 ,  H05K3/1216 ,  H05K2201/0305 ,  H05K2203/043 ,  H05K2203/173

Abstract: A method of fabricating a zero signal degradation solder bridge electrical connection for connecting adjacent conducting pads of a printed circuit board, and a printed circuit board having at least one of these solder bridge electrical connections. In the method, a stencil, having an opening that corresponds to the adjacent conducting pads and at least a portion of the surface area of the printed circuit board between the adjacent conducting pads, is placed on the surface of printed circuit board. Solder paste is then applied to the stencil such that the solder paste flows through the stencil opening and onto the adjacent conducting pads and at least a portion of the surface area of the printed circuit board between the pads. The stencil is then removed and the printed circuit board is subjected to reflow soldering, thereby fabricating a printed circuit board having a solder bridge electrical connector between adjacent conducting pads.

Abstract translation: 一种制造用于连接印刷电路板的相邻导电焊盘的零信号劣化焊桥电连接的方法以及具有这些焊桥电连接中的至少一个的印刷电路板。 在该方法中，将具有对应于相邻导电焊盘的开口和相邻导电焊盘之间的印刷电路板的表面区域的至少一部分的模板放置在印刷电路板的表面上。 然后将焊膏施加到模板上，使得焊膏流过模板开口并且流到衬垫之间的相邻导电焊盘和印刷电路板的表面区域的至少一部分。 然后去除模版，并且对印刷电路板进行回流焊接，从而制造在相邻导电焊盘之间具有焊料桥电连接器的印刷电路板。

公开(公告)号：US20030213767A1

公开(公告)日：2003-11-20

申请号：US10426326

申请日：2003-04-29

Inventor： Robert Edward Belke JR. ,  Vivek A. Jairazbhoy ,  Thomas B. Krautheim ,  William F. Quitty JR.

IPC: H01B013/00

CPC classification number: H05K3/44 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/09554 ,  H05K2201/09745 ,  H05K2201/0979 ,  H05K2201/09854 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics.

Abstract translation: 具有选择性地形成的具有改善的焊料润湿特性的孔或腔26的多层电子电路板设计10。

公开(公告)号：US06641898B2

公开(公告)日：2003-11-04

申请号：US10024470

申请日：2001-12-21

Applicant: Yoshitaro Yazaki ,  Yoshihiko Shiraishi ,  Koji Kondo ,  Toshikazu Harada ,  Tomohiro Yokochi

Inventor： Yoshitaro Yazaki ,  Yoshihiko Shiraishi ,  Koji Kondo ,  Toshikazu Harada ,  Tomohiro Yokochi

IPC: B32B300

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T428/24917

Abstract: A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.

公开(公告)号：US20030186527A1

公开(公告)日：2003-10-02

申请号：US10333767

申请日：2003-05-19

Inventor： Elke Zakel ,  Ghassem Azdasht

IPC: H01L021/44

CPC classification number: H05K3/3478 ,  H01L2224/11334 ,  H05K3/4038 ,  H05K3/4046 ,  H05K2201/0305 ,  H05K2201/0382 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/041

Abstract: The invention relates to a method for producing a contact substrate (10) as well as to a contact substrate with through-plating between a connector arrangement (21) arranged at the top of a dielectric carrier substrate (12) and the underside of the carrier substrate, wherein the connector arrangement extends along an aperture margin (22) of a substrate recess (15), and the underside (11) of the carrier substrate (12) is supported by a backstop (23), wherein a formed solder material part (24) is placed in the substrate recess (15), and in a subsequent method-related step said formed solder material part (24) is deformed within the substrate recess so as to form a formed contact part (50), such that radial displacement of the material of the formed solder material part in the substrate recess results in a non-positive connection between an intrados surface (28) of the substrate recess and the connector arrangement (21), and that the formed contact part provides through-plating between the connector arrangement (21) and the underside (11) of the carrier substrate.

Abstract translation: 本发明涉及一种用于制造接触衬底（10）的方法以及在布置在电介质载体衬底（12）的顶部处的连接器装置（21）和载体的下侧之间的具有穿镀的接触衬底 基板，其中所述连接器装置沿着基板凹部（15）的孔边缘（22）延伸，并且所述载体基板（12）的下侧（11）由止回件（23）支撑，其中形成的焊料材料部分 （24）被放置在基板凹部（15）中，并且在随后的方法相关步骤中，所形成的焊料材料部分（24）在基板凹部内变形，以形成形成的接触部分（50），使得径向 衬底凹陷中形成的焊料材料部分的材料的位移导致衬底凹槽的凹入表面（28）和连接器装置（21）之间的非正连接，并且形成的接触部分提供贯穿镀层 之间 e连接器布置（21）和载体基板的下侧（11）。

公开(公告)号：US20030178713A1

公开(公告)日：2003-09-25

申请号：US10348478

申请日：2003-01-21

Inventor： Akira Chinda ,  Akira Matsuura ,  Takayuki Yoshiwa ,  Mamoru Mita ,  Takashi Kageyama ,  Katsutoshi Taga

IPC: H01L023/02

CPC classification number: H05K3/403 ,  H01L2924/0002 ,  H01L2924/19107 ,  H05K3/0052 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/423 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2203/0733 ,  H01L2924/00

Abstract: A wiring board which can realize a small and thin passive component such as solid condenser, resistor, coil, transistor or so on is provided. A wiring board which forms an electronic component by mounting a passive element, comprising an insulating board provided with an opening having predetermined pattern, a wiring formed with predetermined pattern on said insulating board, and an external terminal filled to said opening, connected with said wiring by said filling, and exposed to a bottom of said insulating board where said wiring is formed.

Abstract translation: 本发明提供可实现固体冷凝器，电阻器，线圈，晶体管等小而薄的无源部件的布线基板。 一种通过安装无源元件形成电子部件的布线板，包括设置有具有预定图案的开口的绝缘板，在所述绝缘板上形成有预定图案的布线，以及填充到所述开口的外部端子，与所述布线连接 通过所述填充，并暴露于所述绝缘板的形成所述布线的底部。

公开(公告)号：US06623651B2

公开(公告)日：2003-09-23

申请号：US09815364

申请日：2001-03-22

Applicant: Bharat Patel ,  Jay D. Baker ,  Mohan Paruchuri

Inventor： Bharat Patel ,  Jay D. Baker ,  Mohan Paruchuri

IPC: H01B1300

CPC classification number: H05K3/44 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536

Abstract: A method 10 for making a multi-layer electronic circuit board 98 having at least one electrically conductive protuberance 15 which forms a “via” and which traverses through the various layers of the electric circuit board 98, and further having at least one interconnection portion 102 which supports a wide variety of components and interconnection assemblies.

Abstract translation: 一种用于制造多层电子电路板98的方法10，该多层电子电路板98具有形成“通孔”的至少一个导电突起15，并穿过电路板98的各个层，并且还具有至少一个互连部分102 其支持各种组件和互连组件。

公开(公告)号：US06621168B2

公开(公告)日：2003-09-16

申请号：US09750444

申请日：2000-12-28

Applicant: Robert C. Sundahl ,  Kenneth Wong

Inventor： Robert C. Sundahl ,  Kenneth Wong

IPC: H01L2348

CPC classification number: H05K3/4629 ,  H01L27/3281 ,  H01L2224/13 ,  H01L2924/12044 ,  H05K1/0306 ,  H05K3/28 ,  H05K3/321 ,  H05K3/4015 ,  H05K3/4038 ,  H05K3/4614 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0367 ,  H05K2201/2036 ,  H05K2203/1327 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49172 ,  H01L2924/00

Abstract: An electrical assembly (200, FIG. 2) is formed from two, interconnected circuit boards (202, 204). Conductive spacers (240) and a conductive material (260) are placed between complementary bond pads (218, 232) on the circuit boards. The conductive spacers are formed from a material that maintains its mechanical integrity during the process of attaching the circuit boards. The conductive material is a solder or conductive adhesive used to mechanically attach the circuit boards. In addition, an insulating material (270) is inserted into an interface region (250) between the circuit boards. The insulating material provides additional mechanical connection between the circuit boards. In one embodiment, one circuit board (202) includes a glass panel that holds an array of organic light emitting diodes (OLEDs), and the other circuit board (204) is a ceramic circuit board. Together, the interconnected circuit board assembly (200) forms a portion of a flat panel display (1102, FIG. 11).

Abstract translation: 电气组件（200，图2）由两个互连的电路板（202,204）形成。 导电间隔物（240）和导电材料（260）放置在电路板上的互补焊盘（218,232）之间。 导电间隔物由在连接电路板的过程中保持其机械完整性的材料形成。 导电材料是用于机械地连接电路板的焊料或导电粘合剂。 此外，将绝缘材料（270）插入到电路板之间的界面区域（250）中。 绝缘材料在电路板之间提供额外的机械连接。 在一个实施例中，一个电路板（202）包括保持有机发光二极管（OLED）阵列的玻璃面板，另一个电路板（204）是陶瓷电路板。 互连电路板组件（200）一起形成平板显示器（1102，图11）的一部分。

公开(公告)号：US06614398B2

公开(公告)日：2003-09-02

申请号：US10121733

申请日：2002-04-15

Applicant: Yuichi Kushihi ,  Junichi Kurita

Inventor： Yuichi Kushihi ,  Junichi Kurita

IPC: H01Q138

CPC classification number: H01Q9/0442 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q9/0421 ,  H01Q9/14 ,  H05K1/0293 ,  H05K1/181 ,  H05K2201/0305 ,  H05K2203/171

Abstract: An antenna structure includes a surface-mounted antenna which has a base member. A radiating electrode and an antenna-side control electrode are disposed on the base member. A capacitance is generated between the antenna-side control electrode and an open end of the radiating electrode, and the antenna-side control electrode electrically floats. A board-side control electrode which is electrically connected with the antenna-side control electrode and which electrically floats is disposed on a mounting board. The board-side control electrode is connected with a ground conductor at high frequencies through a resonant frequency adjuster. The resonant frequency adjuster has a capacitance or an inductance. By changing the capacitance or the inductance, the resonant frequency of the radiating electrode can be changed without changing the surface-mounted antenna.

公开(公告)号：US06612025B1

公开(公告)日：2003-09-02

申请号：US09656043

申请日：2000-09-06

Applicant: Zhong-You (Joe) Shi ,  Lakhi N. Goenka ,  Andrew Z. Glevatsky

Inventor： Zhong-You (Joe) Shi ,  Lakhi N. Goenka ,  Andrew Z. Glevatsky

IPC: H05K334

CPC classification number: H05K3/4038 ,  H05K3/062 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0373 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09581 ,  H05K2203/1438 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method for forming connections within a multi-layer electronic circuit board 10. The method includes forming an aperture within the circuit board and selectively coating the interior surface of the aperture with a polar solder mask material that is effective to bond with solder that is selectively inserted into the aperture, thereby retaining the solder within the aperture and improving the electrical connection provided by the solder.

Abstract translation: 一种用于在多层电子电路板10内形成连接的方法。该方法包括在电路板内形成孔，并用极性焊料掩模材料选择性地涂覆孔的内表面，极性焊料掩模材料有效地与选择性地焊接 插入到孔中，从而将焊料保持在孔内并改善由焊料提供的电连接。

公开(公告)号：US20030082356A1

公开(公告)日：2003-05-01

申请号：US10247264

申请日：2002-09-19

Applicant: Fujikura Ltd.

Inventor： Tatsuo Suemasu ,  Takashi Takizawa

IPC: B32B003/00 ,  B05D001/18 ,  B05D007/22

CPC classification number: H01L21/76877 ,  C23C2/00 ,  C23C2/02 ,  C23C2/26 ,  H01L21/288 ,  H01L21/76882 ,  H01L21/76898 ,  H01L25/0657 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4076 ,  H05K3/426 ,  H05K2201/0305 ,  H05K2201/09572 ,  H05K2203/044 ,  H05K2203/085 ,  H05K2203/1394 ,  Y10S428/901 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/31678 ,  H01L2224/05599

Abstract: In the formation of through wirings in a silicon substrate and so forth, there was a need for the development of a technology that would allow metal to be reliably filled particularly in the vicinity of openings of through holes and other fine holes. This invention provides a metal filling method and member with filled metal sections in which, in the inflow and filling of a plating solution into through holes 11 of a substrate 10 by immersing said substrate 10 in heated and melted conductive metal, filled metal sections are formed by preliminarily forming a metal layer 15 on the inner surface of one of the ends of through holes 11 of this substrate 10 as well as on substrate top surface 13 around those openings, removing substrate 10 on which inflow and filling of the plating solution into through holes 11 has been completed from the plating solution, and then cooling to solidify the plating solution that has been filled into the through holes.

Abstract translation: 在硅衬底等中形成通过布线的方法中，需要开发一种能够使金属被可靠地填充到特别是通孔和其它细孔的开口附近的技术。 本发明提供了一种金属填充方法和具有填充金属部分的部件，其中，通过将所述基板10浸入加热和熔化的导电金属中，在将电镀液流入和填充到基板10的通孔11中时，形成填充的金属部分 通过在该基板10的通孔11的一个端部的内表面以及围绕这些开口的基板顶表面13上预先形成金属层15，去除基板10，电镀液的流入和填充通过 从电镀液中完成孔11，然后冷却固化已经填充到通孔中的电镀液。