公开(公告)号：US20180301859A1

公开(公告)日：2018-10-18

申请号：US15954448

申请日：2018-04-16

Applicant: Ring Inc.

Inventor： James Siminoff ,  Mark Siminoff

IPC: H01R33/94 ,  H05K1/14 ,  H01R12/70 ,  H01R12/71 ,  H01R31/06 ,  H01R13/74 ,  H01R33/97 ,  H01R13/622 ,  H05K5/00 ,  H05K5/02 ,  H01R33/72 ,  H01R13/639

CPC classification number: H01R33/94 ,  H01R12/707 ,  H01R12/7088 ,  H01R12/714 ,  H01R13/622 ,  H01R13/6397 ,  H01R13/748 ,  H01R31/065 ,  H01R33/72 ,  H01R33/9456 ,  H01R33/971 ,  H05K1/144 ,  H05K3/368 ,  H05K5/0052 ,  H05K5/0069 ,  H05K5/0073 ,  H05K5/0247 ,  H05K5/069 ,  H05K2201/041 ,  H05K2201/048 ,  H05K2201/10318 ,  H05K2201/10356 ,  H05K2201/2018

Abstract: A mounting assembly for electro-mechanically connecting an electrically-powered device to a structure includes a housing, a first printed circuit board, an adapter, and a second printed circuit board. The housing has a shape defining a front opening and a first mating structure. The first printed circuit board is located within the housing and has a first plurality of electrical contacts facing the front opening. The adapter is attachable to the device and has a second mating structure that removably engages with the first mating structure of the housing. The second printed circuit board is coupled with the adapter and has a second plurality of electrical contacts exposed on its back surface to electrically connect to the first plurality of electrical contacts when the first mating structure of the housing engages with the second mating structure of the adapter.

公开(公告)号：US20180054893A1

公开(公告)日：2018-02-22

申请号：US15264613

申请日：2016-09-14

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED ,  Lite-On Technology Corporation

Inventor： Yi-Hsun Lee ,  Chun-Lung Ho ,  Wu-Chen Lin

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/142 ,  H05K1/111 ,  H05K2201/045 ,  H05K2201/048 ,  H05K2201/09027 ,  H05K2201/094 ,  H05K2201/09727

Abstract: A circuit board structure includes a first circuit board, a second circuit board and a plurality of first connection portions. The first circuit board has a first opening, and the second circuit board is disposed inside the first opening of the first circuit board. The first circuit board and the second circuit board are electrically independent from each other. The first connection portions are connected to the first circuit board and the second circuit board.

公开(公告)号：US09867291B2

公开(公告)日：2018-01-09

申请号：US13682485

申请日：2012-11-20

Applicant: Digi International Inc.

Inventor： John Clark Roberts ,  Robert Wayne Ridgeway

IPC: H05K1/14 ,  H05K3/10 ,  H05K3/36 ,  H05K3/32 ,  H01R12/72

CPC classification number: H05K1/14 ,  H01R12/722 ,  H05K3/10 ,  H05K3/325 ,  H05K3/366 ,  H05K2201/048 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A first printed circuit board (PCB) assembly can include an embedded electrical connector configured to be mechanically coupled to a corresponding tab-shaped portion of a second PCB assembly, such as to permit insertion of the tab-shaped portion of the second PCB assembly into the embedded electrical connector when the second PCB assembly is aligned in a specified orientation. In an example, the second PCB assembly can include an approximately planar conductive antenna.

公开(公告)号：US09780471B2

公开(公告)日：2017-10-03

申请号：US15313401

申请日：2015-05-18

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Nicolaas Antonie Van Rijswijk

IPC: H01R12/73 ,  H05K1/14 ,  H05K1/11 ,  H05K3/36 ,  H01R12/70

CPC classification number: H01R12/737 ,  H01R12/7023 ,  H05K1/11 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09081

Abstract: A printed circuit board arrangement and a method for mounting a product to a main printed circuit board (100) at a substantially perpendicular angle, the printed circuit board arrangement comprises a main printed circuit board (100) comprising an elongated slot (102), and a product (128) comprising a connector portion (130) configured to be inserted into the elongated slot (102). The connector portion (130) is such that the product (128) may be attached at a substantially perpendicular angle to the main printed circuit board (100). The elongated slot (102) comprises a protrusion (104), and the connector portion (130) comprises a spring portion (132) configured to engage with the protrusion (104) when the connector portion (130) is inserted into the elongated slot (102). This results in a force pressing the connector portion (130) of the product (128) to at least one side wall of the elongated slot (102).

公开(公告)号：US09350124B2

公开(公告)日：2016-05-24

申请号：US14408039

申请日：2013-03-13

Applicant: HSIO TECHNOLOGIES, LLC

Inventor： James Rathburn

IPC: H01R12/68 ,  H01R12/50 ,  H01R13/24 ,  H01R12/82 ,  H05K3/36 ,  H05K3/40 ,  H01R12/73 ,  H01L23/00 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A method of making an array of integral terminals on a circuit assembly. The method includes the steps of depositing at least a first liquid dielectric layer on the first surface of a first circuit member, imaged to include a plurality of first recesses corresponding to the array of integral terminals. The selected surfaces of the first recesses are processed to accept electro-less conductive plating deposition. Electro-lessly plating is applied to the selected surfaces of the first recesses to create a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. Electro-plating is applied to the electro-less plating to substantially first recesses with a conductive material. The steps of depositing, processing, electro-less plating, and electro-plating are repeated to form the integral terminals of a desired shape. The dielectric layers are removed to expose the terminals.

Abstract translation: 一种在电路组件上制成集成端子阵列的方法。 该方法包括以下步骤：在第一电路构件的第一表面上沉积至少第一液体电介质层，成像为包括与集成端子阵列相对应的多个第一凹部。 处理第一凹槽的选定表面以接受无电导电电镀沉积。 对所述第一凹槽的所选择的表面施加无电镀以产生电耦合到所述第一电路层并且大致垂直于所述第一电路层延伸的多个第一导电结构。 使用导电材料将电镀施加到基本上第一凹部的无电镀。 重复沉积，加工，无电镀和电镀的步骤以形成所需形状的整体端子。 去除电介质层以露出端子。

公开(公告)号：US20160105983A1

公开(公告)日：2016-04-14

申请号：US14857430

申请日：2015-09-17

Applicant: International Rectifier Corporation

Inventor： Eung San Cho ,  Thomas J. Ribarich ,  Dean Fernando ,  Kevin Moody ,  Dae Keun Park ,  Chuan Cheah

IPC: H05K7/10

CPC classification number: H05K7/1092 ,  H02M3/145 ,  H05K1/117 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/048

Abstract: In one implementation, an insertable power unit for plugging into a mother board includes a power module situated on a substrate, and a mounting contact on an extended side of the substrate away from the power module. The mounting contact is electrically coupled to the power module by electrical routing in the substrate. The mounting contact is configured to provide electrical connection between the power module and the mother board.

Abstract translation: 在一个实现中，用于插入母板的可插入动力单元包括位于基板上的功率模块和远离电源模块的基板的延伸侧上的安装触点。 安装触头通过在衬底中的电路径电耦合到功率模块。 安装触头被配置为在电源模块和母板之间提供电连接。

公开(公告)号：US20150282320A1

公开(公告)日：2015-10-01

申请号：US14666376

申请日：2015-03-24

Applicant: NEC Corporation

Inventor： Wenda HAO

IPC: H05K1/14 ,  H05K7/14

CPC classification number: H05K1/141 ,  H05K3/366 ,  H05K7/1485 ,  H05K7/1487 ,  H05K2201/044 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/09127

Abstract: An electronic device includes a substrate having a connector formed on a main face, and a module having a terminal detachably connected to the connector of the substrate. The module includes an extended part which projects below the terminal in an installation direction. The substrate includes a bypass part which bypasses the extended part when the module is connected to the substrate. The bypass part is a cutout or a recess formed in the substrate. The extended part accommodates a plurality of components aligned in the installation direction. The extended part is extended from the lower end of the module by a difference between a first size, corresponding to multiple times the size of each component, and a second size ranging from the upper end of the module to the end of the terminal.

Abstract translation: 电子设备包括具有形成在主面上的连接器的基板和具有可拆卸地连接到基板的连接器的端子的模块。 该模块包括在安装方向上在终端下方突出的延伸部分。 当该模块连接到基板时，该基板包括旁路部分，旁路部分绕该延伸部分。 旁路部分是形成在基板中的切口或凹部。 延伸部容纳沿安装方向对准的多个部件。 扩展部分从模块的下端通过与每个部件的大小相对应的第一尺寸和从模块的上端到终端的端部的第二尺寸之间的差来延伸。

公开(公告)号：US20150237729A1

公开(公告)日：2015-08-20

申请号：US14599672

申请日：2015-01-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Thomas J. Brunschwiler ,  Dominic Gschwend ,  Keiji Matsumoto ,  Stefano S. Oggioni ,  Gerd Schlottig ,  Timo J. Tick ,  Jonas Zuercher

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/40 ,  H05K1/02 ,  H05K3/00

CPC classification number: H01L23/49822 ,  H01L23/14 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0298 ,  H05K3/3436 ,  H05K3/4046 ,  H05K2201/048 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A substrate device for electronic circuits or devices includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x2) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x3). The first orientation (x2) and the second orientation (x3) are angled (α) with respect to one another.

Abstract translation: 一种用于电子电路或器件的衬底装置包括：第一衬底部分，包括彼此附接的第一多个层，具有第一取向（x2）;以及第二衬底部分，第二衬底部分包括彼此附接的第二多个层。 第二多个层具有第二取向（x3）。 第一取向（x2）和第二取向（x3）相对于彼此成角度（α）。

公开(公告)号：US20150136467A1

公开(公告)日：2015-05-21

申请号：US14408039

申请日：2013-03-13

Applicant: HSIO TECHNOLOGIES, LLC

Inventor： James Rathburn

IPC: H01R12/77 ,  H01R12/82 ,  H01R12/79

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A method of making an array of integral terminals on a circuit assembly. The method includes the steps of depositing at least a first liquid dielectric layer on the first surface of a first circuit member, imaged to include a plurality of first recesses corresponding to the array of integral terminals. The selected surfaces of the first recesses are processed to accept electro-less conductive plating deposition. Electro-lessly plating is applied to the selected surfaces of the first recesses to create a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. Electro-plating is applied to the electro-less plating to substantially first recesses with a conductive material. The steps of depositing, processing, electro-less plating, and electro-plating are repeated to form the integral terminals of a desired shape. The dielectric layers are removed to expose the terminals.

Abstract translation: 一种在电路组件上制成集成端子阵列的方法。 该方法包括以下步骤：在第一电路构件的第一表面上沉积至少第一液体电介质层，成像为包括与集成端子阵列相对应的多个第一凹部。 处理第一凹槽的选定表面以接受无电导电电镀沉积。 对所述第一凹槽的所选择的表面施加无电镀以产生电耦合到所述第一电路层并且大致垂直于所述第一电路层延伸的多个第一导电结构。 使用导电材料将电镀施加到基本上第一凹部的无电镀。 重复沉积，加工，无电镀和电镀的步骤以形成所需形状的整体端子。 去除电介质层以露出端子。

公开(公告)号：US08884164B2

公开(公告)日：2014-11-11

申请号：US13707572

申请日：2012-12-06

Applicant: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd. ,  Hon Hai Precision Industry Co., Ltd.

Inventor： Shin-Wen Chen ,  Wen-Hsiung Chen ,  Yu-Tsan Cheng ,  Wen-Chang Chen ,  Shu-Sheng Peng

IPC: H05K1/00 ,  H05K1/09 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/09 ,  H05K1/02 ,  H05K1/18 ,  H05K3/0061 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/048 ,  H05K2201/093

Abstract: A circuit board assembly includes a flexible circuit board, a dielectric layer and a reinforcing plate. The flexible circuit board includes a surface. A copper plating layer is positioned on the surface. The copper plating layer includes a circuit portion and a grounding portion. The circuit portion is entirely covered by the dielectric layer. The grounding portion is exposed outside the dielectric layer. The dielectric layer includes a bonding portion. The reinforcing plate includes a connection surface. The connection surface defines a cavity spatially corresponding to the bonding portion. The connection surface also includes an extending portion which is bulgy with respect to a bottom surface of the cavity. The extending portion spatially corresponds to the grounding portion. The bonding portion is received in the cavity with the extending portion in contact with and electrically connecting to the grounding portion by means of a conductive adhesive.

Abstract translation: 电路板组件包括柔性电路板，电介质层和加强板。 柔性电路板包括表面。 铜镀层位于表面。 镀铜层包括电路部分和接地部分。 电路部分被电介质层完全覆盖。 接地部分暴露在电介质层的外部。 介电层包括接合部分。 加强板包括连接表面。 连接表面限定空间对应于结合部分的空腔。 连接表面还包括相对于空腔的底表面膨胀的延伸部分。 延伸部在空间上对应于接地部。 接合部分被容纳在空腔中，其中延伸部分借助于导电粘合剂与接地部分接触并电连接到接地部分。