公开(公告)号：US11889973B2

公开(公告)日：2024-02-06

申请号：US17704891

申请日：2022-03-25

Applicant: LG Electronics Inc.

Inventor： Changjun Lee ,  Philjae Hwang ,  Mantae Hwang ,  Jungbae Hwang ,  Eunji Sung ,  Taekgi Lee

IPC: A47L9/32 ,  A47L5/24 ,  A47L9/28 ,  A47L9/22 ,  A47L9/16 ,  H02J7/00 ,  A47L9/12 ,  H01R33/76 ,  H01R33/955 ,  H05K1/11 ,  H05K5/00 ,  H01R12/70 ,  H01R12/72

CPC classification number: A47L9/322 ,  A47L5/24 ,  A47L9/122 ,  A47L9/1683 ,  A47L9/22 ,  A47L9/28 ,  A47L9/2857 ,  A47L9/2884 ,  A47L9/2894 ,  H01R33/7671 ,  H01R33/955 ,  H02J7/0045 ,  H05K1/111 ,  H05K5/003 ,  H05K5/0069 ,  H01R12/7088 ,  H01R12/721 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/10106

Abstract: A vacuum cleaner of the present invention comprises: a main body having a suction motor for generating suction force; a main PCB capable of generating a control command for the suction motor; a handle part capable of accommodating the main body PCB; and a connector provided at the main body, and to which the main PCB is connected in a process of coupling the handle part to the main body. The main PCB includes a plurality of pads and a slit, and the connector includes: a plurality of connecting pins for making contact with the plurality of pads; and a slit insertion protrusion inserted into the slit.

公开(公告)号：US11889627B2

公开(公告)日：2024-01-30

申请号：US17223054

申请日：2021-04-06

Applicant: Innolux Corporation

Inventor： Chin-Cheng Kuo ,  Chia-Chun Yang ,  Wen-Cheng Huang

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  H05K3/28

CPC classification number: H05K1/148 ,  H05K1/181 ,  H05K3/284 ,  H05K3/303 ,  H05K3/361 ,  H05K2201/041 ,  H05K2201/09027 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10522 ,  H05K2203/0126

Abstract: A display device includes a first substrate, a second substrate, a plurality of drive ICs and at least one flexible circuit board. The first substrate has a first region and a second region near to the first region. The second substrate is disposed on the first region and has a lateral side. The plurality of drive ICs are disposed on the second region and arranged along the lateral side. The at least one flexible circuit board is disposed on the second region and disposed correspondingly to the lateral side. Wherein in a top view of the display device, each of the plurality of drive ICs does not overlap with the at least one flexible circuit board in a direction perpendicular to an extending direction of the lateral side.

公开(公告)号：US11849537B2

公开(公告)日：2023-12-19

申请号：US17430582

申请日：2020-02-11

Applicant: Mahle International GmbH

Inventor： Juan Francisco Pardo Peris ,  Anton Esmoris Bertoa ,  Alejandro Hiroshi Closa Kobayashi

IPC: H05K1/02 ,  H03H3/00 ,  H03H7/42

CPC classification number: H05K1/0233 ,  H03H3/00 ,  H03H7/427 ,  H05K1/0231 ,  H05K2201/086 ,  H05K2201/09027 ,  H05K2201/1003 ,  H05K2201/10015 ,  H05K2201/10265 ,  H05K2201/10272 ,  H05K2201/10409

Abstract: A filter module for reducing differential and common mode electrical noise may include at least a first electrically conductive busbar and a second electrically conductive busbar spaced apart from the first busbar, an at least partially electrically conductive housing at least partially enclosing the first busbar and the second busbar, at least a first common mode choke and a second common mode choke arranged in the housing and spaced apart from each other, at least a first bypass capacitor electrically connected to the first busbar and the second bus bar, at least a second bypass capacitor electrically connected to the first busbar and a midpoint, and at least a third bypass capacitor electrically connected to the second busbar and the midpoint.

公开(公告)号：US11785732B2

公开(公告)日：2023-10-10

申请号：US17227043

申请日：2021-04-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngwoo Park

IPC: H05K5/02 ,  H01L25/18 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K5/026 ,  H01L25/18 ,  H05K1/0271 ,  H05K1/18 ,  H05K2201/09027 ,  H05K2201/10159

Abstract: A memory card includes a case and an integrated circuit package disposed in the case. The case includes a first case edge, a second case edge connected to the first case edge, a third case edge connected to the second case edge, a fourth case edge connected to the third case edge and the first case edge, and a first recessed groove formed in the second case edge, the first recessed groove being spaced apart from the first case edge and inwardly recessed. The integrated circuit package is disposed in an upper portion of the case between the first case edge and a first horizontal line that extends in a direction from a top end of the first recessed groove in the second case edge to the fourth case edge.

公开(公告)号：US11729900B2

公开(公告)日：2023-08-15

申请号：US17694201

申请日：2022-03-14

Applicant: Intel Corporation

Inventor： Stephen Harvey Hall ,  Khang Choong Yong ,  Ying Ern Ho ,  Yun Rou Lim ,  Wil Choon Song

IPC: H05K1/02 ,  G05B19/4097 ,  H05K3/02 ,  H05K1/18

CPC classification number: H05K1/0225 ,  G05B19/4097 ,  H05K3/027 ,  G05B2219/45026 ,  G05B2219/45034 ,  H05K1/18 ,  H05K2201/093 ,  H05K2201/098 ,  H05K2201/09027 ,  H05K2201/10098

Abstract: Apparatuses and methods are provided for mitigating radio frequency interference and electromagnetic compatibility issues caused by the resonance of metal planes of a circuit board. A method for controlling impedance at an edge of a circuit board includes creating a cut at an edge of a plane of the circuit board. The cut extends from the edge of the plane to a point at a depth into the plane. The method can further include creating a cut pattern in the edge of the plane by repeating the cut along the edge of the plane such that an impedance of the plane at the depth is different, or lower, than an impedance of the plane at the edge of the plane. Other aspects are described.

公开(公告)号：US20190200449A1

公开(公告)日：2019-06-27

申请号：US16174665

申请日：2018-10-30

Applicant: Japan Aviation Electronics Industry, Limited

Inventor： Kentaro TODA

IPC: H05K1/02

CPC classification number: H05K1/0222 ,  H01R12/53 ,  H01R12/722 ,  H05K1/0228 ,  H05K2201/09027 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09272 ,  H05K2201/09618

Abstract: A circuit board comprises at least a first wiring layer, a second wiring layer and a via. The first wiring layer is formed with a pair of first ends, a pair of second ends, a coupling portion, a pair of first trace portions and a pair of second trace portions. The coupling portion has a pair of first coupling points, a pair of second coupling points, an inner trace portion, an outer trace portion and a ground conductor portion. The inner trace portion has a length equal to a length of the outer trace portion. The ground conductor portion is arranged between the inner trace portion and the outer trace portion. The second wiring layer is formed with a ground pattern. The ground conductor portion is connected with the ground pattern through the via.

公开(公告)号：US20190145584A1

公开(公告)日：2019-05-16

申请号：US16097949

申请日：2016-07-20

Applicant: MERLOT LABORATORIES INC.

Inventor： Young-Hun KO ,  Ui-Chung HONG ,  So-Bong SHIN

IPC: F21K9/238 ,  F21V19/00 ,  H05K1/14 ,  H05K3/36 ,  F21K9/232

CPC classification number: F21K9/238 ,  F21K9/232 ,  F21V19/00 ,  F21Y2107/00 ,  F21Y2115/10 ,  H05K1/14 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/048 ,  H05K2201/09027 ,  H05K2201/10106

Abstract: The present invention relates to a substrate structure for LED lighting, the structure being capable of improving the hemispherical intensity distribution of a lighting device in which an LED is used, thereby improving the light efficiency of the lighting device. The substrate structure includes a first substrate for mounting a first LED thereon and three second substrates, each for mounting a second LED thereon. The second substrates are coupled to the first substrate such that the second substrates are perpendicular to the first substrate and are arranged at an angular interval which is within a range of 115° to 125° with respect to each other in a cross-sectional view taken parallel to the first substrate. One or more second substrates of the three second substrates are provided with one or more control circuits for controlling operation of either of or both of the first LED and the second LED, in which the control circuit is disposed in an end portion of the second substrate in a direction perpendicular to the first substrate.

公开(公告)号：US20190104619A1

公开(公告)日：2019-04-04

申请号：US15821931

申请日：2017-11-24

Applicant: BCM Communication Co.,Ltd ,  Ufro Inc

Inventor： Kao-Jung Chou ,  Hsien-Chuan Kuo ,  Hung-Yu Lin

IPC: H05K5/00 ,  H01R12/52 ,  H05K1/14 ,  H05K1/11 ,  H01R24/60 ,  H01R13/6581 ,  H01R13/50 ,  H05K1/18 ,  G06F3/041 ,  G06F3/0354 ,  G06F3/038

CPC classification number: H05K5/003 ,  G06F3/03542 ,  G06F3/0386 ,  G06F3/041 ,  H01R12/52 ,  H01R13/50 ,  H01R13/6581 ,  H01R24/60 ,  H05K1/117 ,  H05K1/141 ,  H05K1/181 ,  H05K5/0039 ,  H05K5/0086 ,  H05K5/0278 ,  H05K2201/044 ,  H05K2201/09027 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10522 ,  H05K2201/10545

Abstract: A USB socket connector includes a columnar housing, a circuit board, and an expansion board. The columnar housing has a front portion and an opposite rear portion. The columnar housing includes an accommodating slot recessed from the front portion toward the rear portion and a receiving slot recessed on the rear portion and in air communication with the accommodating slot. A cross section of the receiving slot is larger than that of the accommodating slot. The circuit board includes a tongue plate portion arranged on one side thereof and having a USB3.1 Type-C interface. The circuit board is inserted into the accommodating slot, and the tongue plate portion is arranged in the front portion. The expansion board is substantially and perpendicularly connected to an end of the circuit board away from the tongue plate portion, and the expansion board is arranged in the receiving slot.

公开(公告)号：US20190078573A1

公开(公告)日：2019-03-14

申请号：US15953182

申请日：2018-04-13

Applicant: Delta Electronics, Inc.

Inventor： Chao-Wen LU

IPC: F04D25/06 ,  H05K1/18 ,  F04D25/08 ,  F04D29/62

CPC classification number: F04D25/068 ,  F04D17/16 ,  F04D25/0653 ,  F04D25/08 ,  F04D29/424 ,  F04D29/624 ,  H05K1/181 ,  H05K2201/09027 ,  H05K2201/1003

Abstract: A fan device is provided, including a housing, a circuit board, a plurality of driving coils, at least one magnetic member, and a metal member. The housing includes a first surface, a second surface corresponding to the first surface, and a hollow protruding portion protruding from the first surface. The circuit board is disposed on the first surface, and the driving coils are disposed on the circuit board. The magnetic member is disposed corresponding to the driving coils. The metal member is disposed on the second surface and corresponds to the magnetic member. A method for manufacturing the fan device is also provided.

公开(公告)号：US20180306391A1

公开(公告)日：2018-10-25

申请号：US15753009

申请日：2016-08-16

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Michel Cornelis Josephus Marie VISSENBERG ,  Anna Wilhelmina Maria WONDERGEM-DE BEST

IPC: F21S4/10 ,  F21S4/28 ,  F21V29/503 ,  F21V29/70

CPC classification number: F21S4/10 ,  F21S4/20 ,  F21S4/28 ,  F21V29/503 ,  F21V29/70 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09027 ,  H05K2201/09127 ,  H05K2201/09918 ,  H05K2201/09972 ,  H05K2201/10106

Abstract: A lighting device comprising a carrier board and an array of lighting elements mounted on the carrier board. The carrier board has a generally spiral shape and the carrier board can be tessellated with one or more identical other carrier boards with windings interleaved with each other. This enables multiple carrier boards to be formed from a single substrate with little or no waste of material. Different designs enable two, four or even more different identical carried board shapes to be tessellated together.