公开(公告)号：US07808551B2

公开(公告)日：2010-10-05

申请号：US11934420

申请日：2007-11-02

Applicant: Hiroshi Ito ,  You Kondoh ,  Mikio Nakamura

Inventor： Hiroshi Ito ,  You Kondoh ,  Mikio Nakamura

IPC: H04N5/225

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N2005/2255 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/007 ,  H05K3/4644 ,  H05K2201/09072 ,  H05K2201/10121 ,  H05K2203/016 ,  H01L2924/00

Abstract: An imaging module includes a flexible printed circuit board which has a first area on which a first functional element is mounted, a second area on which a second functional element is mounted, and a third area which is formed between the first area and the second area, an electronic component which is mounted on the first area, and an imaging device which is mounted on the second area. The flexible printed circuit board is formed by an insulating layer which is integrated, spreading over the first area, the second area, and the third area. The flexible printed circuit board is formed such that the flexible printed circuit board can be bent at least in the third area.

Abstract translation: 成像模块包括柔性印刷电路板，其具有安装有第一功能元件的第一区域，安装有第二功能元件的第二区域和形成在第一区域和第二区域之间的第三区域 安装在第一区域上的电子部件和安装在第二区域上的摄像装置。 柔性印刷电路板由整合在第一区域，第二区域和第三区域上的绝缘层形成。 柔性印刷电路板形成为使得柔性印刷电路板可以至少在第三区域中弯曲。

公开(公告)号：US07796882B2

公开(公告)日：2010-09-14

申请号：US11507477

申请日：2006-08-22

Applicant: Ho Kyoum Kim ,  Hyoung Woo Nam

Inventor： Ho Kyoum Kim ,  Hyoung Woo Nam

IPC: G03B17/00

CPC classification number: G03B17/02 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/02164 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H05K1/0231 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/09072 ,  H05K2201/10121 ,  H05K2201/10545 ,  Y02P70/611 ,  H01L2924/00

Abstract: The present invention relates to a method of manufacturing an image sensor module including attaching an image sensor on one side of a double-sided flexible printing circuit board (FPCB) provided with a window such that the image sensor module covers the window; and mounting at least one electric part on the other side of the double-sided FPCB on which the image sensor is attached.

Abstract translation: 本发明涉及一种图像传感器模块的制造方法，其包括将图像传感器安装在设置有窗口的双面柔性印刷电路板（FPCB）的一侧，使得图像传感器模块覆盖窗口; 并且在安装有图像传感器的双面FPCB的另一侧上安装至少一个电气部件。

公开(公告)号：US20100212939A1

公开(公告)日：2010-08-26

申请号：US12681283

申请日：2008-10-03

Applicant: Shoji Ito ,  Yusuke Nakatani ,  Ryo Takami ,  Tadanori Ohminato

Inventor： Shoji Ito ,  Yusuke Nakatani ,  Ryo Takami ,  Tadanori Ohminato

IPC: H05K1/03 ,  H05K1/16 ,  H01R43/00

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L21/67126 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13123 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/331 ,  H01L2224/73204 ,  H01L2224/751 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81805 ,  H01L2224/831 ,  H01L2224/83194 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01025 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/189 ,  H05K2201/09072 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/49169 ,  H01L2924/01048 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A module of the present invention is provided with; a circuit board in which conductors are patterned on an insulating layer, and a functional element that is mounted on the conductor pattern face down via bumps. An aperture section is formed in an area of the circuit board which is the functional element mounting position, which is smaller than, a projected surface of the functional element, and is inside of a region where the bumps are joined with the conductors. A gap between the functional element and the circuit board, and the aperture section are sealed by a sealing resin.

Abstract translation: 本发明的模块具有： 其中导体在绝缘层上图案化的电路板，以及通过凸块向下安装在导体图案上的功能元件。 在作为功能元件安装位置的功能元件安装位置的小于该功能元件的突出面的电路板的区域中形成有开口部，并且在与导体接合的区域的内部。 功能元件和电路板之间的间隙以及开口部分由密封树脂密封。

公开(公告)号：US20100157550A1

公开(公告)日：2010-06-24

申请号：US12160960

申请日：2007-01-24

Applicant: Hidenobu Nishikawa ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Atsunobu Iwamoto

Inventor： Hidenobu Nishikawa ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Atsunobu Iwamoto

IPC: H05K5/00 ,  H05K3/30

CPC classification number: H05K1/141 ,  H01L23/5388 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/181 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10159 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/1316 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the first circuit board, a second semiconductor chip mounted to the top face of the second circuit board with at least a part of the second semiconductor chip confronting a part of another part other than the part of the under face of the first semiconductor chip, and a cover disposed over the top face of the second circuit board for covering the first semiconductor chip, the first circuit board and the second semiconductor chip.

Abstract translation: 存储卡包括第一电路板，第一半导体芯片，其安装到第一电路板的顶面，其第一电路板的下表面的一部分，第二电路板，其顶面接合到下部 第一电路板的表面，安装到第二电路板的顶面的第二半导体芯片，其中第二半导体芯片的至少一部分面对除了第一半导体芯片的下表面的一部分之外的另一部分的一部分 以及设置在所述第二电路板的顶面上的覆盖所述第一半导体芯片，所述第一电路板和所述第二半导体芯片的盖。

公开(公告)号：US20100039815A1

公开(公告)日：2010-02-18

申请号：US12235980

申请日：2008-09-23

Applicant: Kun Huang JHENG

Inventor： Kun Huang JHENG

IPC: F21V29/00

CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21V29/70 ,  F21Y2105/10 ,  F21Y2115/10 ,  H05K1/0272 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106

Abstract: An LED apparatus comprises a PCB and a plurality of LEDs packaged on the PCB. The PCB materials on the area between the plurality of LEDs are partially removed to form a plurality of gaps, wherein the gaps are immediately close to the LEDs and directly dissipate heat of the LEDs.

Abstract translation: LED装置包括PCB和PCB上的多个LED。 在多个LED之间的区域上的PCB材料被部分地去除以形成多个间隙，其中间隙立即靠近LED并直接耗散LED的热量。

公开(公告)号：US20090297103A1

公开(公告)日：2009-12-03

申请号：US12131207

申请日：2008-06-02

Applicant: Tom Sheau Tung Wong ,  Adrianus J.P. van Haasteren ,  Tze Wei Lim

Inventor： Tom Sheau Tung Wong ,  Adrianus J.P. van Haasteren ,  Tze Wei Lim

IPC: G02B6/36 ,  H01L33/00 ,  H01L31/18

CPC classification number: G02B6/423 ,  G02B6/4206 ,  G02B6/4236 ,  H01L31/0203 ,  H01L31/02325 ,  H01L33/483 ,  H01L33/58 ,  H05K1/0274 ,  H05K3/284 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10121

Abstract: Various embodiments of optical subassemblies, and arrangements and methods for manufacturing same, for an electro-optical assembly are disclosed. One embodiment comprises an optical subassembly for an electro-optical assembly. The optical subassembly comprises a printed circuit board, an optical semiconductor device, and an optical element. The printed circuit board has a first surface, a second surface, and an aperture therethrough. The optical semiconductor device is attached to the first surface with an active region exposed to the aperture. The optical element is attached to the second surface with an optical axis exposed to the aperture and optically aligned with the active region.

Abstract translation: 公开了用于电光学组件的光学组件的各种实施例及其制造方法。 一个实施例包括用于电光组件的光学子组件。 光学子组件包括印刷电路板，光学半导体器件和光学元件。 印刷电路板具有第一表面，第二表面和穿过其的孔。 光学半导体器件被附着到具有暴露于孔径的有源区域的第一表面。 光学元件被附接到第二表面，其中光轴暴露于孔并与活性区域光学对准。

公开(公告)号：US20090002962A1

公开(公告)日：2009-01-01

申请号：US11898221

申请日：2007-09-11

Applicant: Jung-Hui Hsu

Inventor： Jung-Hui Hsu

IPC: H05K7/00

CPC classification number: H05K1/0201 ,  H01H37/52 ,  H01H37/74 ,  H01H37/76 ,  H05K3/222 ,  H05K3/3447 ,  H05K2201/0308 ,  H05K2201/09072 ,  H05K2201/10181 ,  H05K2203/176

Abstract: A circuit protection element and a circuit board with the circuit protection element are disclosed. The circuit protection element includes a metal base, and at least one opening slot located at the metal base. The metal base forms a positioning portion. One end of the metal base is fastened onto a circuit board. The bottom of the free end of the metal base contacts a conducting point located on the circuit board to make the circuit be in a conducting status. When the current is overloaded or the circuit is over-heated, the bottom of the free end of the metal base is heated so that the bottom of the free end of the metal base separates from the conducting point and the positioning portion is wedged with the circuit board. Thereby, the circuit becomes a broken circuit. The circuit protection element can prevent the electronic components from being burnt down.

Abstract translation: 公开了具有电路保护元件的电路保护元件和电路板。 电路保护元件包括金属基座和位于金属基座处的至少一个开口槽。 金属底座形成定位部。 金属基座的一端固定在电路板上。 金属基座的自由端的底部接触位于电路板上的导电点，以使电路处于导通状态。 当电流过载或电路过热时，金属基座的自由端的底部被加热，使得金属基座的自由端的底部与导电点分离，并且定位部分楔入 电路板。 由此，电路成为断路。 电路保护元件可以防止电子元件烧毁。

公开(公告)号：US07470977B2

公开(公告)日：2008-12-30

申请号：US10519765

申请日：2003-06-19

Applicant: Akihiko Okubora

Inventor： Akihiko Okubora

IPC: H01L23/552 ,  H01L23/34

CPC classification number: H01L25/165 ,  B81C1/0023 ,  H01L23/04 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L24/48 ,  H01L24/81 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0237 ,  H05K1/0272 ,  H05K1/16 ,  H05K1/186 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0179 ,  H05K2201/09072 ,  H05K2201/09981 ,  H05K2201/10053 ,  H05K2203/061 ,  H05K2203/086 ,  H05K2203/1147 ,  H05K2203/1178 ,  Y10T29/49126 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate (11) in which conductive pattern or patterns are formed on the principal surface thereof and one element body (7) or more are mounted, and a second organic substrate (12) in which a recessed portion (22) is formed in correspondence with the area where the element body or bodies (7) are mounted at the connecting surface to the first organic substrate (11). In the state where the second organic substrate (12) is connected to the first organic substrate (11), an element body accommodating portion (24) which seals the element body or bodies (7) is constituted by the recessed portion (22), wherein the element body accommodating portion (24) is adapted so that moisture resistance characteristic and oxidation resistance characteristic are maintained.

Abstract translation: 本发明涉及一种用于无线通信模块的高频模块，并且包括：第一有机基板（11），其主体表面上形成有导电图案或图案，并且安装有一个元件体（7）以上; 以及第二有机基板（12），其中，与所述元件体（7）安装在与所述第一有机基板（11）的连接面处的区域对应地形成有凹部（22）。 在第二有机基板（12）与第一有机基板（11）连接的状态下，密封元件主体（7）的元件主体容纳部（24）由凹部（22）构成， 其特征在于，所述元件主体容纳部（24）适于保持耐湿性和抗氧化特性。

公开(公告)号：US20080235941A1

公开(公告)日：2008-10-02

申请号：US11694913

申请日：2007-03-30

Applicant: Seng Guan Chow

Inventor： Seng Guan Chow

IPC: H05K3/34

CPC classification number: H05K3/284 ,  H01L2224/32225 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K1/111 ,  H05K3/1216 ,  H05K3/3442 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4007 ,  H05K2201/035 ,  H05K2201/0367 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/043 ,  H05K2203/1476 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  H01L2924/00

Abstract: An integrated circuit package system is provided including providing a substrate having a contact pad, forming a first conductor having a first melting point over the contact pad, forming a second conductor having a second melting point over the first conductor with the first melting point higher than the second melting point, and mounting a first device over the second conductor.

Abstract translation: 提供了一种集成电路封装系统，包括提供具有接触焊盘的衬底，形成在接触焊盘上具有第一熔点的第一导体，在第一导体上形成具有第二熔点的第二导体，第一熔点高于 第二熔点，并且将第一装置安装在第二导体上。

公开(公告)号：US20080116589A1

公开(公告)日：2008-05-22

申请号：US11601266

申请日：2006-11-17

Applicant: Zong-Fu Li ,  David England ,  Bobby Nikjou ,  Joseph T. Dibene ,  Hong Xie ,  Jason Zhang

Inventor： Zong-Fu Li ,  David England ,  Bobby Nikjou ,  Joseph T. Dibene ,  Hong Xie ,  Jason Zhang

IPC: H01L23/48 ,  H01L21/00 ,  H01L21/44

CPC classification number: H01L23/3128 ,  H01L21/563 ,  H01L23/3677 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/19041 ,  H05K1/0262 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/10734 ,  H01L2924/00

Abstract: An integrated voltage regulator may be provided on the bottom of a ball grid array processor package. This may be done despite the fact that conventionally integrated voltage regulator chips are too thick to fit in the area normally available between the motherboard and the ball grid array package because that area is defined by solder balls of a necessarily limited height which is conventionally believed to be too small to accommodate the integrated voltage regulator.

Abstract translation: 集成电压调节器可以设置在球栅阵列处理器封装的底部。 尽管传统集成的电压调节器芯片太厚以至于不能装配在主板和球栅阵列封装之间通常可用的区域中，但是由于通常被认为是有限的高度的焊球限定了该区域 太小，不能容纳集成稳压器。