公开(公告)号：US20150289364A1

公开(公告)日：2015-10-08

申请号：US14678039

申请日：2015-04-03

Applicant: Clothing Plus MBU Oy

Inventor： Aino-Maria ILKKO ,  Heidi MALMIVAARA ,  Heikki JAAKKOLA ,  Manu MYRY

IPC: H05K1/02 ,  H05K3/22 ,  H05K1/03

CPC classification number: H05K1/0283 ,  H05K1/0277 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/038 ,  H05K3/22 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/09281 ,  Y10T29/49218

Abstract: A stretchable device for transmitting signal between end points, such as a sensor and electronic unit, includes a conductive element, which is coupled with a supporting structure by introducing the conductive element successively through the thickness of the supporting structure to the first and second side of the supporting structure, thereby providing a corrugated structure for the conductive element, which is configured to be straighten out at least partially during stretching the device in its longitudinal direction. The conductive element is coupled with the supporting structure between first and second outer layers thereby providing the stretchable device.

Abstract translation: 用于在诸如传感器和电子单元的端点之间传输信号的可拉伸装置包括导电元件，该导电元件通过将导电元件依次通过支撑结构的厚度引导到支撑结构的第一和第二侧而与支撑结构耦合 支撑结构，从而提供用于导电元件的波纹结构，其被构造成在沿纵向拉伸装置期间至少部分地伸直。 导电元件与第一和第二外层之间的支撑结构耦合，从而提供可拉伸装置。

公开(公告)号：US20150245469A1

公开(公告)日：2015-08-27

申请号：US14629697

申请日：2015-02-24

Applicant: YAZAKI CORPORATION

Inventor： Hisashi HANAZAKI

IPC: H05K1/02 ,  H05K1/18 ,  H01B7/08

CPC classification number: H05K1/0263 ,  H01B7/0838 ,  H05K1/0265 ,  H05K1/028 ,  H05K1/0293 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/101 ,  H05K3/102 ,  H05K3/125 ,  H05K3/1275 ,  H05K2201/0305 ,  H05K2201/09281 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10181 ,  H05K2203/107

Abstract: A flexible flat circuit includes a pair of insulation sheets, and a plurality of conductors that are held between and covered with the pair of insulation sheets in a state that the plurality of conductors are separated to each other. Among from the plurality of conductors, at least conductors with different current capacities are different in thickness to each other.

Abstract translation: 柔性扁平电路包括一对绝缘片，以及多个导体，其以多个导体彼此分离的状态保持在一对绝缘片之间并被其覆盖。 在多个导体中，至少具有不同电流容量的导体的厚度彼此不同。

公开(公告)号：US09078360B2

公开(公告)日：2015-07-07

申请号：US14012195

申请日：2013-08-28

Applicant: Ronald Steven Cok

Inventor： Ronald Steven Cok

IPC: H05K1/11 ,  H05K1/00 ,  H05K1/02 ,  H05K3/46 ,  H05K3/12 ,  H05K3/00

CPC classification number: H05K1/0274 ,  H05K1/0298 ,  H05K1/097 ,  H05K3/0041 ,  H05K3/12 ,  H05K3/1258 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/465 ,  H05K3/4685 ,  H05K2201/09209 ,  H05K2201/09281 ,  H05K2201/0979 ,  H05K2201/09845 ,  H05K2203/0108

Abstract: An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.

Abstract translation: 压印的微结构包括具有与之相关的第一层的衬底。 第一，第二和第三微通道印在第一层中，并且分别位于其中的第一，第二和第三微细线。 第二层与第一层相邻并与第一层接触。 包括第一和第二连接微线的印刷的第一和第二连接微通道分别与第一和第二微线接触并与第三微线隔离。 第三层与第二层相邻并与第二层接触，并且具有印刷桥微通道，桥接微线与第一和第二连接微线接触并与第三微线分离，使得第一和第二 微线电连接并与第三微线电隔离。

公开(公告)号：US20140104802A1

公开(公告)日：2014-04-17

申请号：US14050258

申请日：2013-10-09

Applicant: Renesas Electronics Corporation

Inventor： Ryuichi Oikawa

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/64 ,  H01L23/66 ,  H01L2223/6616 ,  H01L2223/6638 ,  H01L2224/16225 ,  H01L2224/49171 ,  H01L2924/00 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/30111 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0236 ,  H05K1/0245 ,  H05K1/0248 ,  H05K1/0251 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/09227 ,  H05K2201/09281 ,  H05K2201/096 ,  H05K2201/09627 ,  H05K2201/10734

Abstract: A semiconductor device includes a semiconductor chip, a plurality of external terminals, and a board. The board includes a first main surface in which a plurality of first electrodes electrically connected to the semiconductor chip are formed, a second main surface in which a plurality of second electrodes electrically connected to the plurality of external terminals are formed, and a plurality of interconnect layers, provided between the first main surface and the second main surface, for forming a plurality of signal paths that electrically connect the first electrode and the second electrode corresponding thereto. The interconnect layer includes a plurality of metal members which are dispersedly disposed at a distance shorter than an electromagnetic wavelength equivalent to a signal band of a signal supplied to the signal path, in the vicinity of a portion in which a structure of an interconnect for forming the signal path is changed.

Abstract translation: 半导体器件包括半导体芯片，多个外部端子和基板。 电路板包括：第一主表面，其中形成电连接到半导体芯片的多个第一电极;第二主表面，其中形成有多个与多个外部端子电连接的第二电极;以及多个互连 层，设置在第一主表面和第二主表面之间，用于形成电连接第一电极和与其对应的第二电极的多个信号路径。 互连层包括多个金属构件，其分散配置在比构成信号路径的信号的信号频带的电磁波长短的距离处，在其附近形成用于形成的互连的结构部分 信号路径被改变。

公开(公告)号：US08420946B2

公开(公告)日：2013-04-16

申请号：US13238745

申请日：2011-09-21

Applicant: Fa-Ping Fan

Inventor： Fa-Ping Fan

IPC: H05K1/03

CPC classification number: H05K1/111 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09281 ,  Y02P70/611

Abstract: An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line includes two parallel signal conductors disposed on the substrate. Each of the two signal conductors is electrically connected to an edge of one of the weld pads of a respective pair of the at least two weld pad pairs. Thereby, the two signal conductors of the differential transmission line can extend in the same distance anywhere, particularly in the position where the two signal conductors pass the two weld pad pairs. As a result, the coupling performance and the capability of the differential transmission line to resist electromagnetic interference are both enhanced.

公开(公告)号：US08242373B2

公开(公告)日：2012-08-14

申请号：US12227365

申请日：2007-06-06

Applicant: Seiichiro Miyahara

Inventor： Seiichiro Miyahara

IPC: H05K1/00

CPC classification number: H05K1/025 ,  H05K1/028 ,  H05K2201/09263 ,  H05K2201/09281

Abstract: A flexible wiring board is provided having a wiring structure which can reduce transmission loss by reducing impedance mismatching even if being folded in a three-dimensional manner. In a flexible wiring board 10 having a characteristic impedance control circuit 20, the flexible wiring board has a planar projection shape of a folded spot 20A in the characteristic impedance control circuit after folding in an arc state along a tangent.

Abstract translation: 提供了具有布线结构的柔性布线板，即使以三维方式折叠，也可以通过降低阻抗失配来降低传输损耗。 在具有特性阻抗控制电路20的柔性布线板10中，柔性布线板在沿着切线折叠成弧状态之后，在特性阻抗控制电路中具有折叠点20A的平面投影形状。

公开(公告)号：US20120012377A1

公开(公告)日：2012-01-19

申请号：US13238761

申请日：2011-09-21

Applicant: FA-PING FAN

Inventor： FA-PING FAN

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/0245 ,  H05K2201/09236 ,  H05K2201/09281 ,  Y02P70/611

Abstract: An exemplary printed circuit board includes a substrate, a differential transmission line, and at least two weld pad pairs. The differential transmission line and the at least two weld pad pairs are disposed on the substrate. The differential transmission line includes two parallel signal conductors disposed on the substrate. Each of the two signal conductors is electrically connected to an edge of one of the weld pads of a respective pair of the at least two weld pad pairs. Thereby, the two signal conductors of the differential transmission line can extend in the same distance anywhere, particularly in the position where the two signal conductors pass the two weld pad pairs. As a result, the coupling performance and the capability of the differential transmission line to resist electromagnetic interference are both enhanced.

Abstract translation: 示例性印刷电路板包括基板，差分传输线和至少两个焊盘对。 差分传输线和至少两个焊盘对设置在基板上。 差分传输线包括设置在基板上的两个并行信号导体。 两个信号导体中的每一个电连接到相应的一对至少两个焊盘对的焊接焊盘之一的边缘。 因此，差分传输线的两个信号导体可以在任何地方延伸相同的距离，特别是在两个信号导体通过两个焊盘对的位置。 结果，提高了耦合性能和差动传输线抵抗电磁干扰的能力。

公开(公告)号：US07477118B2

公开(公告)日：2009-01-13

申请号：US11335195

申请日：2006-01-19

Applicant: Takanori Ikuta ,  Wataru Koga ,  Hiroki Kan ,  Yuuko Yokota

Inventor： Takanori Ikuta ,  Wataru Koga ,  Hiroki Kan ,  Yuuko Yokota

IPC: H01P3/08 ,  H03H9/00 ,  H01R12/14 ,  H01R12/30

CPC classification number: H05K1/0243 ,  H01L21/4853 ,  H01L2224/16225 ,  H05K1/0219 ,  H05K1/111 ,  H05K1/117 ,  H05K3/429 ,  H05K2201/09281 ,  H05K2201/09418 ,  H05K2201/09572 ,  H05K2201/09618 ,  H05K2201/0979 ,  H05K2201/09809 ,  H05K2201/10189 ,  Y02P70/611

Abstract: Terminal electrodes 9 for carrying a high frequency device 3 are formed on a surface of a circuit board having its reverse surface covered with a reverse surface conductor layer 6, and a plurality of signal lines 2 for exchanging a signal between the high frequency device 3 and an external circuit are formed thereon. The terminal electrode 9 is arranged at the center of the circuit board, and the signal lines 2 radially extends from the terminal electrode 9. Electromagnetic interference between the signal lines 2 can be reduced, so that out-of-band attenuation characteristics and isolation characteristics can be satisfactorily exhibited in a case where the high frequency device 3 is a duplexer.

Abstract translation: 用于承载高频器件3的端子电极9形成在电路板的表面，其表面覆盖有反面导体层6，并且多个信号线2用于在高频器件3和 在其上形成外部电路。 端子电极9布置在电路板的中心，并且信号线2从端子电极9径向延伸。可以减小信号线2之间的电磁干扰，使得带外衰减特性和隔离特性 可以在高频装置3为双工器的情况下令人满意地展现。

公开(公告)号：US07449978B2

公开(公告)日：2008-11-11

申请号：US11845990

申请日：2007-08-28

Applicant: Kunio Yamaguchi ,  Ryouhei Kimura ,  Atsushi Tanaka ,  Kenyu Morozumi

Inventor： Kunio Yamaguchi ,  Ryouhei Kimura ,  Atsushi Tanaka ,  Kenyu Morozumi

IPC: H03H9/64 ,  H05K5/04 ,  H05K9/00

CPC classification number: H05K1/0243 ,  H03H9/0259 ,  H03H9/02913 ,  H05K1/111 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/09336 ,  H05K2201/10083

Abstract: In a fitting region for a SAW filter which includes langasite as its piezoelectric element, there are included an input side terminal electrode and an output side terminal electrode which are connected to an input terminal and to an output terminal of the SAW filter. To each of the terminal electrodes, at a position which is separated by just a predetermined distance from the fitting region of the SAW filter, there is connected a micro strip line which extends in mutually opposite directions along a direction which is parallel to the transmission direction of a frequency signal within the SAW filter. A slit is provided in the fitting region of the SAW filter and extends in a direction which intersects the transmission direction of the frequency signal within the SAW filter. A plurality of through holes are provided in the printed substrate and electrically connect together its surface and its rear surface which is grounded. Furthermore, there is provided a protective member which has a conductive surface and which is in contact with the surface of said filter, and said conductive surface of said protective member which is in contact with the surface of said filter is set so as to be of the same size as the surface of said filter, or so as to be smaller than it.

Abstract translation: 在包括硅灰石作为其压电元件的SAW滤波器的嵌合区域中，包括连接到SAW滤波器的输入端子和输出端子的输入侧端子电极和输出侧端子电极。 对于每个端子电极，在与SAW滤波器的嵌合区域分开只有预定距离的位置处连接有沿着与传输方向平行的方向在相互相反的方向上延伸的微带线 的SAW滤波器内的频率信号。 在SAW滤波器的装配区域中设置有狭缝，并且在与SAW滤波器内的频率信号的传输方向相交的方向上延伸。 多个通孔设置在印刷基板中，并将其表面及其背面接地电连接在一起。 此外，提供了具有导电表面并与所述过滤器的表面接触的保护构件，并且与所述过滤器的表面接触的所述保护构件的所述导电表面被设定为 与所述过滤器的表面相同的尺寸，或者比其小。

公开(公告)号：US20080261415A1

公开(公告)日：2008-10-23

申请号：US12062580

申请日：2008-04-04

Applicant: Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

Inventor： Pierre Bormann ,  Luc Morineau ,  Jacques Chavade

IPC: H05K1/00 ,  H01R12/00

CPC classification number: H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/111 ,  H05K2201/09281 ,  H05K2201/10734 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electrical connection board includes electrical connection terminals on one face with a view toward connecting with a semiconductor component and electrical connection tracks connected respectively to these terminals. The terminals are arranged in a square matrix having two orthogonal directions. On its face, the board includes a multiplicity of identical adjacent connection groups, each group having N adjacent terminals and N tracks placed along this direction while extending towards an edge of the matrix. The terminals of a group are offset by one pitch relative to the terminals of an adjacent group. The board and a semiconductor component are connected together by electrical connection balls.

Abstract translation: 电连接板包括在一个面上的电连接端子，其具有与半导体部件连接的视图和分别连接到这些端子的电连接轨道。 端子布置成具有两个正交方向的正方形矩阵。 在其表面上，板包括多个相同的相邻连接组，每个组具有N个相邻的端子和沿着该方向放置的N个磁道，同时向矩阵的边缘延伸。 组的端子相对于相邻组的端子偏移一个间距。 板和半导体部件通过电连接球连接在一起。