公开(公告)号：US20050239300A1

公开(公告)日：2005-10-27

申请号：US11055579

申请日：2005-02-09

Applicant: Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram ,  Kevin Grundy

Inventor： Gary Yasumura ,  Joseph Fjelstad ,  William Wiedemann ,  Para Segaram ,  Kevin Grundy

IPC: H01R12/00 ,  H01R12/16

CPC classification number: H05K1/117 ,  H01R12/523 ,  H01R12/62 ,  H01R12/716 ,  H01R13/24 ,  H01R13/6587 ,  H05K1/142 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/09063 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2203/167

Abstract: An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.

Abstract translation: 一种电连接器，包括布置成阶梯式结构的多个电触点，其设计成与具有以阶梯状构造布置的电触点的电气部件配合。 一种直接连接信号系统，包括与台阶式印刷电路板，其他楼梯电气部件或其组合配合的楼梯级电连接器。

公开(公告)号：US5912435A

公开(公告)日：1999-06-15

申请号：US766648

申请日：1996-12-13

Applicant: Herbert Elsinger ,  Johannes Oberndorfer ,  Friedrich Plappert ,  Shigeru Tajima

Inventor： Herbert Elsinger ,  Johannes Oberndorfer ,  Friedrich Plappert ,  Shigeru Tajima

IPC: F42D1/055 ,  F42D1/06 ,  H01R12/62 ,  H01R12/67 ,  H01R13/66 ,  H05K3/34 ,  H05K3/36 ,  H01B7/04 ,  H05K1/02

CPC classification number: H01R12/62 ,  H01R12/675 ,  H05K3/3421 ,  H05K3/363 ,  H01R13/6658 ,  H05K2201/0394 ,  H05K2201/09445 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/175 ,  Y02P70/613

Abstract: In an electrical circuit arrangement, specifically a sequential blasting system as used in mining, the individual circuit units 12 are contacted by a continuous flat cable 10 in such a way that each wire 16 to 19 of the cable 10 has a bared section 21 which is soldered to a contact pad 22 to 26 of a conductor pattern 15 disposed on a printed circuit board 11 which carries the circuit elements of the circuit unit 12. This not only minimizes the total number of contacts but also prevents the contact points from increasing the line resistance and prevents any faulty contact point from interrupting the line.

Abstract translation: 在电路装置中，特别是采矿中使用的连续爆破系统，各个电路单元12由连续扁平电缆10接触，使得电缆10的每个电线16至19具有裸露部分21， 焊接到布置在承载电路单元12的电路元件的印刷电路板11上的导体图案15的接触焊盘22至26上。这不仅使接触的总数最小化，而且防止接触点增加线 电阻并防止任何故障接触点中断线路。

公开(公告)号：US5238431A

公开(公告)日：1993-08-24

申请号：US842312

申请日：1992-02-24

Applicant: Robert D. Kreisinger

Inventor： Robert D. Kreisinger

IPC: H01M2/10 ,  H01M2/20 ,  H05K1/11

CPC classification number: H05K1/118 ,  H01M2/1022 ,  H01M2/20 ,  H05K2201/09081 ,  H05K2201/09445 ,  H05K2201/0999 ,  H05K2201/1034

Abstract: An electrical contact assembly (10) for insertion into an aperture (14) in a housing (12) having an exterior and an interior surface comprises a flexible circuit (20) having a tongue portion (23) and a conductor (25) on at least the tongue portion, a member (26) having an external contact (28) which is coupled to the conductor (25), wherein the member is inserted through the aperture (14) through the interior surface and covers portions of the aperture and the exterior surface.

Abstract translation: 用于插入具有外表面和内表面的壳体（12）中的孔（14）中的电接触组件（10）包括柔性电路（20），其具有舌部（23）和导体（25） 至少所述舌部，具有联接到所述导体（25）的外部接触件（28）的构件（26），其中所述构件通过所述孔（14）穿过所述内表面插入并覆盖所述孔的部分和 外表面。

公开(公告)号：US11812554B2

公开(公告)日：2023-11-07

申请号：US17227458

申请日：2021-04-12

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/118 ,  H05K1/189 ,  H05K2201/0979 ,  H05K2201/09445 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate. The chip is mounted on the chip mounting area, a space exists between a first bump and a second bump of the chip, and there are no additional bumps between the first and second bumps. A first inner lead, a second inner lead, a first dummy lead and a second dummy lead of the circuit layer are located on the chip mounting area. The first and second inner leads are electrically connected to the first and second bumps respectively. The first dummy lead is connected to the first inner lead and adjacent to the first bump, and the second dummy lead is connected to the second inner lead and adjacent to the second bump.

公开(公告)号：US20230340862A1

公开(公告)日：2023-10-26

申请号：US18342022

申请日：2023-06-27

Applicant: GEODYNAMICS, INC.

Inventor： Phillip Phelps ,  Brad Perry ,  Rick Wallace

IPC: E21B43/1185 ,  H01R12/71 ,  H05K1/11 ,  F42D1/05 ,  F42D1/055

CPC classification number: E21B43/1185 ,  H01R12/714 ,  H05K1/119 ,  F42D1/05 ,  F42D1/055 ,  H05K2201/09445 ,  H05K2201/09027 ,  H05K2201/09809 ,  H01R13/08

Abstract: A switch assembly, which is part of a chain of switch assemblies, includes a communication unit (CU) configured to receive, from an external controller, a fire command to activate a detonator and a computing core (CC) configured to locally make a decision whether or not to activate the detonator, after receiving the fire command to activate the detonator.

公开(公告)号：US11751326B2

公开(公告)日：2023-09-05

申请号：US17324784

申请日：2021-05-19

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Mitsuaki Morimoto

IPC: H05K1/02 ,  H05K1/11 ,  G01R1/073 ,  G01R1/067 ,  H05K1/18 ,  H05K1/03

CPC classification number: H05K1/0268 ,  G01R1/06794 ,  G01R1/07314 ,  H05K1/0269 ,  H05K1/118 ,  H05K1/0346 ,  H05K1/189 ,  H05K2201/094 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09445 ,  H05K2201/09909 ,  H05K2201/10136

Abstract: An electronic apparatus includes: an electronic module; and a flexible substrate electrically connected to the electronic module. The flexible substrate includes: a base film; a plurality of first contact pads arranged at one end on the base film in a first direction, and electrically connected to the electronic module; a plurality of second contact pads arranged at an other end on the base film in the first direction; a plurality of first wires arranged on the base film, and each electrically connecting one of the first contact pads and one of the second contact pads together; and a plurality of third contact pads arranged on the base film, each of the third contact pads being positioned along the first direction between one of the first contact pads and one of the second contact pads, and being electrically connected to one of the first wires.

公开(公告)号：US20230266363A1

公开(公告)日：2023-08-24

申请号：US18017128

申请日：2021-07-28

Applicant: KYOCERA Corporation

Inventor： Hitoshi TEGA

IPC: G01R1/073 ,  H05K1/02 ,  H05K1/11

CPC classification number: G01R1/07342 ,  H05K1/0298 ,  H05K1/119 ,  H05K1/025 ,  H05K2201/09609 ,  H05K2201/09672 ,  H05K2201/09445

Abstract: A circuit board includes an insulating substrate including a wiring conductor and a first resin substrate that is made of a resin different from the insulating substrate and is laminated on the insulating substrate. The first resin substrate has a plurality of internal conductors located from a surface thereof facing the insulating substrate to a surface on a side opposite to the insulating substrate. Each of the plurality of internal conductors includes a part that is inclined with respect to a perpendicular to the surface facing the insulating substrate. Intervals at which the plurality of internal conductors are located on the side opposite to the insulating substrate are narrower than intervals at which the plurality of internal conductors are located on an insulating substrate side.

公开(公告)号：US11665820B2

公开(公告)日：2023-05-30

申请号：US17536321

申请日：2021-11-29

Applicant: QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD ,  Avary Holding (Shenzhen) Co., Limited.

Inventor： Man-Zhi Peng ,  Rui-Wu Liu ,  Ming-Jaan Ho

IPC: H05K1/16 ,  H05K3/14 ,  H01L23/13 ,  H01L23/60 ,  H01L23/488 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K1/112 ,  H05K3/0014 ,  H05K3/0052 ,  H05K1/119 ,  H05K3/0029 ,  H05K3/0038 ,  H05K2201/09118 ,  H05K2201/09445 ,  H05K2201/09609 ,  H05K2201/09672 ,  H05K2203/0169

Abstract: Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

公开(公告)号：US20190159340A1

公开(公告)日：2019-05-23

申请号：US15917864

申请日：2018-03-12

Applicant: Wistron Corporation

Inventor： Chang-Chun Wang ,  Su-Kai Hsu

IPC: H05K1/11 ,  G06F17/50 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/111 ,  G06F17/5072 ,  H05K1/0243 ,  H05K1/14 ,  H05K1/181 ,  H05K3/0005 ,  H05K2201/09227 ,  H05K2201/09445 ,  H05K2201/10098 ,  H05K2201/10159

Abstract: A circuit board and a layout structure are provided. The layout structure includes a plurality of chip carrying areas, a plurality of inner layer connection pads and a plurality of outer leading wires. The chip carrying areas respectively carry a plurality of chips. The outer leading wires are disposed between the inner layer connection pads and the chip carrying areas. The layout structure is disposed on at least one circuit board and connects to a plurality of wires of the at least one circuit board through the outer leading wires, and the outer leading wires and the wires of the at least one circuit board are formed by sharing at least one metal layer.

公开(公告)号：US20180123206A1

公开(公告)日：2018-05-03

申请号：US15856122

申请日：2017-12-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki YOSUI

IPC: H01P3/08 ,  H05K1/14 ,  H01L23/66 ,  H01P5/02 ,  H05K1/11 ,  H01L23/12 ,  H05K1/02

CPC classification number: H01P3/08 ,  H01L23/12 ,  H01L23/66 ,  H01L2924/0002 ,  H01P3/085 ,  H01P5/028 ,  H05K1/0251 ,  H05K1/0253 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/0191 ,  H05K2201/058 ,  H05K2201/0919 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/10189 ,  H01L2924/00

Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.