公开(公告)号：US09930783B2

公开(公告)日：2018-03-27

申请号：US15079811

申请日：2016-03-24

Applicant: QUALCOMM Incorporated

Inventor： Chengjie Zuo ,  David Francis Berdy ,  Daeik Daniel Kim ,  Changhan Hobie Yun ,  Mario Francisco Velez ,  Jonghae Kim

IPC: H05K7/00 ,  H05K1/18 ,  H03H7/01 ,  H05K3/30 ,  H05K3/40 ,  H05K3/10 ,  H05K1/11 ,  H05K1/14 ,  H01L23/12 ,  H01L21/56 ,  H01L23/15 ,  H01L23/28

CPC classification number: H05K1/181 ,  H01L21/56 ,  H01L23/12 ,  H01L23/15 ,  H01L23/28 ,  H01L23/5386 ,  H01L23/5389 ,  H01L23/552 ,  H03H7/0138 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/4007 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/09227 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10962 ,  H05K2201/2036

Abstract: Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.

公开(公告)号：US09922762B2

公开(公告)日：2018-03-20

申请号：US14657813

申请日：2015-03-13

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Ho Yoon Kim ,  Byeong Cheol Moon ,  Myeong Gi Kim ,  Jin Woo Han ,  Soo Hwan Son

IPC: H01G4/40 ,  H01F27/28 ,  H01F27/29 ,  H05K3/34

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/29 ,  H01F27/292 ,  H01F2017/0026 ,  H01F2017/0066 ,  H01F2027/2809 ,  H01G4/40 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/1053 ,  Y02P70/613

Abstract: A composite electronic component includes a composite body in which a capacitor and an inductor are coupled to each other, the capacitor including a ceramic body including a plurality of dielectric layers and first and second internal electrodes, and the inductor including a magnetic body including a coil part. An input terminal is disposed on a first side surface of the composite body and is connected to the coil part. An output terminal includes a first output terminal disposed on the first side surface of the composite body and connected to the coil part and a second output terminal disposed on a first end surface of the composite body and connected to the first internal electrodes. A ground terminal is disposed on a second end surface of the composite body and is connected to the second internal electrodes. The capacitor is coupled to a side surface of the inductor.

公开(公告)号：US20180076704A1

公开(公告)日：2018-03-15

申请号：US15703086

申请日：2017-09-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Quinn KNELLER ,  Scott PARISH ,  Mark MOFFAT

IPC: H02M1/08 ,  H02M3/337 ,  H01F27/24 ,  H01F27/28 ,  H05K1/18 ,  H05K1/11

CPC classification number: H02M1/08 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2804 ,  H01F27/2895 ,  H01F2027/2809 ,  H01F2027/2819 ,  H02M1/40 ,  H02M3/337 ,  H02M3/3376 ,  H02M2001/0048 ,  H05K1/115 ,  H05K1/165 ,  H05K1/181 ,  H05K2201/086 ,  H05K2201/1003

Abstract: A DC-DC converter includes an insulating substrate; a magnetic core embedded in the insulating substrate, the magnetic core having non-zero x, y and z dimensions of less than or equal to about 5.4 mm by about 5.4 mm by about 1.8 mm; separate primary and secondary transformer windings surrounding first and second regions of the magnetic core; and a control circuit including: an oscillator; a drive circuit coupled to the oscillator; and one or more switches coupled to the drive circuit; the drive circuit providing a switching signal to the one or more switches and energizing the one or more switches to provide a drive voltage to the primary transformer winding. The one or more switches are Field Effect Transistors implemented in a Silicon-on-Insulator configuration or as a Silicon-on-Sapphire configuration.

公开(公告)号：US20180070451A1

公开(公告)日：2018-03-08

申请号：US15803818

申请日：2017-11-05

Applicant: TDK Corporation

Inventor： Nobuo TAKAGI ,  Kouyu OHI ,  Tasuku MIKOGAMI ,  Setu TSUCHIDA

IPC: H05K1/18 ,  H01F27/24 ,  H01F27/29 ,  H01F27/28 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01F3/10 ,  H01F19/04 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/2828 ,  H01F27/292 ,  H05K3/3442 ,  H05K2201/1003 ,  Y02P70/611 ,  Y02P70/613

Abstract: Disclosed herein is a coil component that includes a drum-shaped core having a first flange part provided at one end of a winding core part, first to fourth terminal electrodes formed on the first flange part so as to be arranged in this order in a second direction, and first to fourth wires wound around the winding core part. One ends of the first to fourth wires are connected to different ones of the first to fourth terminal electrodes. The first and second terminal electrodes are not symmetrical with the third and fourth terminal electrodes so that the third and fourth terminal electrodes are offset outward compared with the first and second terminal electrodes.

公开(公告)号：US20180063940A1

公开(公告)日：2018-03-01

申请号：US15410081

申请日：2017-01-19

Applicant: Qorvo US, Inc.

Inventor： Tarak A. Railkar ,  Kevin J. Anderson ,  Walid M. Meliane

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/14 ,  H05K3/36 ,  H01L23/367 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01L23/00 ,  H01L23/04 ,  H01L23/10 ,  H01L25/00 ,  H01L21/50

CPC classification number: H05K1/0206 ,  H01L21/50 ,  H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/17 ,  H01L24/48 ,  H01L25/0655 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2924/01029 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19102 ,  H01L2924/19105 ,  H05K1/115 ,  H05K1/144 ,  H05K1/18 ,  H05K3/30 ,  H05K3/368 ,  H05K3/4697 ,  H05K2201/042 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10674 ,  H01L2924/00

Abstract: The present disclosure relates to an air-cavity package, which includes a bottom substrate with a first heat dissipation interface, a top substrate with a second heat dissipation interface, a perimeter wall, a bottom electronic component, and a top electronic component. The perimeter wall extends between a periphery of the top substrate and a periphery of the bottom substrate to form a cavity. The bottom electronic component is mounted on the bottom substrate, exposed to the cavity, and thermally coupled to a bottom thermally conductive structure, which extends through the bottom substrate and towards the first heat dissipation interface. The top electronic component is mounted on the top substrate, exposed to the cavity, and thermally coupled to a top thermally conductive structure, which extends through the top substrate and towards the second heat dissipation interface.

公开(公告)号：US09901265B2

公开(公告)日：2018-02-27

申请号：US14934799

申请日：2015-11-06

Applicant: Welch Allyn, Inc.

Inventor： David M. Fallat ,  Paul Delucia ,  David M. Babson

IPC: H02J1/00 ,  A61B5/022 ,  A61B5/0235 ,  A61B5/00 ,  G02F1/1333 ,  H02J7/00 ,  A61B5/0205 ,  H05K1/02 ,  A61B5/021 ,  A61B50/13 ,  H05K1/18

CPC classification number: A61B5/02233 ,  A61B5/002 ,  A61B5/02055 ,  A61B5/02141 ,  A61B5/0235 ,  A61B5/7405 ,  A61B5/742 ,  A61B50/13 ,  A61B2560/0204 ,  A61B2562/12 ,  A61B2562/166 ,  G02F1/133308 ,  G02F2001/13332 ,  G02F2001/133325 ,  H02J1/00 ,  H02J7/0054 ,  H05K1/0216 ,  H05K1/0296 ,  H05K1/183 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/1003

Abstract: A powered system includes a parent module including a first battery storing a charge and a child module including a second battery storing a charge and a controller. When the parent module and the child module are in electrical communication, the controller is configured to receive power from the parent module. When the charge in the parent module is depleted, the controller is configured to backfeed power from the child module to the parent module.

公开(公告)号：US09900987B2

公开(公告)日：2018-02-20

申请号：US15089805

申请日：2016-04-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chan Yoon ,  Dong Hwan Lee ,  Young Ghyu Ahn

IPC: H01F27/28 ,  H05K1/18 ,  H01F27/29 ,  H01F17/00 ,  H01F17/04

CPC classification number: H05K1/181 ,  H01F17/0013 ,  H01F17/0033 ,  H01F17/04 ,  H01F27/292 ,  H01F2017/048 ,  H05K2201/1003

Abstract: There are provided a coil component and a board for mounting the same. The coil component includes a magnetic body including first and second coil portions disposed on one surface of a substrate and disposed linearly, based on a central portion of the magnetic body, and third and fourth coil portions disposed on the other surface of the substrate and disposed linearly, based on the central portion of the magnetic body; and first to fourth external electrodes disposed on an external surface of the magnetic body and connected to the first to fourth coil portions. The first coil portion and the third coil portion have a first core portion, and the second coil portion and the fourth coil portion have a second core portion. A peripheral portion disposed outwardly of the first to fourth coil portions has greater permeability than that of the first and second core portions.

公开(公告)号：US20180014426A1

公开(公告)日：2018-01-11

申请号：US15358742

申请日：2016-11-22

Applicant: Ku Yong KIM

Inventor： Ku Yong KIM

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K5/00 ,  H05K1/14

CPC classification number: H05K7/205 ,  H05K1/0204 ,  H05K1/144 ,  H05K1/181 ,  H05K1/182 ,  H05K3/4608 ,  H05K5/0008 ,  H05K7/20472 ,  H05K2201/0367 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/1003 ,  H05K2201/10242

Abstract: A PCB module having a multi-surface heat dissipation structure is provided. The PCB module includes: a multi-layer PCB assembly which includes a heat dissipation plate having electrical insulating properties, and an upper PCB and a lower PCB attached to a top surface and a bottom surface of the heat dissipation plate, respectively; an upper case for covering a top surface of the multi-layer PCB assembly; and a lower case for covering a bottom surface of the multi-layer PCB assembly, and the heat dissipation plate includes; a first heat pole which is thermally in contact with an electronic circuit element mounted on the upper PCB or the lower PCB; and a second heat pole which is thermally in contact with an inner surface of at least one of the upper and lower cases.

公开(公告)号：US20180012879A1

公开(公告)日：2018-01-11

申请号：US15205702

申请日：2016-07-08

Applicant: Cisco Technology, Inc.

Inventor： Paul L. Mantiply ,  Straty Argyrakis

IPC: H01L25/18 ,  H05K1/18 ,  H01L23/538 ,  H05K3/34 ,  H01L25/00 ,  H01L23/367 ,  H02M3/158 ,  H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/17 ,  H01L25/16 ,  H01L25/50 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1306 ,  H01L2924/1426 ,  H01L2924/1427 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19102 ,  H02M3/158 ,  H05K1/0204 ,  H05K1/0262 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10734

Abstract: Presented herein is a method and apparatus for enhanced power distribution to application specific integrated circuits (ASICs). The apparatus includes a substrate, an ASIC, and a voltage regulator module. The substrate includes a first side, a second side, and a vertical interconnect access (via) extending between the first side and the second side. The ASIC is mounted on the first side of the substrate in alignment with the via. The voltage regulator module is mounted on the second side of the substrate in alignment with the via so that the voltage regulator module is electrically coupled to the ASIC through the via.

公开(公告)号：US20170367178A1

公开(公告)日：2017-12-21

申请号：US15525237

申请日：2016-10-19

Applicant: SIEMENS HEALTHCARE GNBH

Inventor： Walter Beyerlein ,  Richard Eichhorn ,  Christian Hoffmann ,  Norbert Hoffmann ,  Rashid Karimi

IPC: H05K1/02 ,  H05G1/12 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0254 ,  H02M7/003 ,  H05G1/10 ,  H05G1/12 ,  H05K1/111 ,  H05K1/181 ,  H05K2201/1003

Abstract: The disclosure specifies a circuit arrangement having electronic first components arranged on a circuit board and lying at high-voltage potential. The circuit arrangement includes functionless, electronic second components lying at high-voltage potential, which are arranged on the circuit board adjacent to the electronic first components, and configured to reduce the maximum electrical field strength between the first components and a reference potential and/or between pads of the circuit board and the reference potential. Through the additional, functionless components, the maximum electrical field strength between electronic components at high voltage and at a reference potential will be reduced. The disclosure also specifies a high voltage generation unit and an x-ray generator.