公开(公告)号：US20090068858A1

公开(公告)日：2009-03-12

申请号：US12246267

申请日：2008-10-06

Applicant: Thomas H. Di Stefano

Inventor： Thomas H. Di Stefano

IPC: H01R12/00

CPC classification number: H01R12/58 ,  H01R4/027 ,  H01R12/523 ,  H01R13/111 ,  H01R13/6315 ,  H05K3/3436 ,  H05K2201/10242 ,  H05K2201/10424 ,  Y02P70/613

Abstract: A socket assembly for connecting an array of bulbous terminals such as balls wherein the female element is a miniature tube that has resilient prongs that grip the corresponding terminals with varying force during insertion and deletion. The tube is of resilient conductive material that has been sliced or helically partitioned into opposing prongs forming slots of a width that increases with axial distance from the end of the tube so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube.

Abstract translation: 一种插座组件，用于连接诸如球的球形端子阵列，其中所述阴元件是具有弹性插脚的微型管，所述微型管在插入和删除期间以变化的力夹持相应的端子。 该管是弹性导电材料，其被切片或螺旋地分隔成相对的尖头，形成宽度的槽，该宽度随着距离管的端部的轴向距离而增加，从而允许连接器的叉头围绕球状球状体 端子并机械地将端子保持在连接器内。 连接器的管状元件可以通过在管的一端或两端形成尖端而制成，该切口的宽度随着距管的端部的距离而增加。

公开(公告)号：US20090032300A1

公开(公告)日：2009-02-05

申请号：US12221256

申请日：2008-07-31

Applicant: Rajeev Joshi

Inventor： Rajeev Joshi

IPC: H05K9/00 ,  B05D5/12 ,  C23C14/34

CPC classification number: H05K9/0024 ,  H05K1/0218 ,  H05K3/284 ,  H05K3/4015 ,  H05K2201/10242 ,  H05K2203/041 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: A shielding assembly is configured to provide electromagnetic shielding and environmental protection to one or more electronic components coupled to a substrate. The shielding assembly includes a non-conductive mold compound layer, such as a dielectric epoxy. The mold compound layer is applied to a top surface of the substrate, thereby covering the electronic components and providing protection against environmentally induced conditions such as corrosion, humidity, and mechanical stress. The shielding assembly also includes a conductive layer applied to a top surface of the mold compound layer. The conductive layer is coupled to a ground plane in the substrate, thereby enabling the electromagnetic shielding function. The conductive layer is coupled to the ground plane via one or more metallized contacts that are coupled to the substrate and extend through the mold compound layer.

Abstract translation: 屏蔽组件被配置为向耦合到衬底的一个或多个电子部件提供电磁屏蔽和环境保护。 屏蔽组件包括非导电模制化合物层，例如电介质环氧树脂。 模具化合物层被施加到基板的顶表面，从而覆盖电子部件并且提供防止诸如腐蚀，湿度和机械应力的环境诱发条件的保护。 屏蔽组件还包括施加到模具化合物层的顶表面的导电层。 导电层耦合到衬底中的接地平面，从而实现电磁屏蔽功能。 导电层通过一个或多个金属化触点耦合到接地平面，金属化触点耦合到衬底并延伸穿过模具化合物层。

公开(公告)号：US07442045B1

公开(公告)日：2008-10-28

申请号：US11893979

申请日：2007-08-17

Applicant: Thomas H. Di Stefano

Inventor： Thomas H. Di Stefano

IPC: H01R12/00

CPC classification number: H01R12/58 ,  H01R4/027 ,  H01R12/523 ,  H01R13/111 ,  H01R13/6315 ,  H05K3/3436 ,  H05K2201/10242 ,  H05K2201/10424 ,  Y02P70/613

Abstract: A socket connector for connecting a bulbous terminal or ball wherein the female element grips the terminal with resilient prongs with end tips at low insertion force but positive contact is maintained and wherein attempted withdrawal is normally inhibited by increasing force applied to the post by the female element in response to the withdrawal force. The female element comprises a tube of resilient conductive material that has been sliced or helically partitioned into opposing prongs of a width that decreases with axial distance from the end of the connector so as to allow the prongs of the connector to grip around the ball-like bulbous terminal and mechanically retain the terminal within the connector. The tubular element of the connector may be made by forming prongs in one or both ends of a tube by cuts of a width that increases with distance from the end of the tube.

Abstract translation: 一种用于连接球杆端子或球的插座连接器，其中，所述母体用低弹性插脚的端头将弹性插脚固定在端子上，但是保持正接触，并且通常通过增加由雌元件施加到柱的力来阻止尝试的拔出 对撤军的回应。 阴元件包括弹性导电材料管，其已经被切片或螺旋地分隔成宽度的相对的尖头，其宽度随着距离连接器的端部的轴向距离而减小，从而允许连接器的插脚围绕球状 球杆端子并将端子机械地保持在连接器内。 连接器的管状元件可以通过在管的一端或两端形成尖端而制成，该切口的宽度随着距管的端部的距离而增加。

公开(公告)号：US20080191956A1

公开(公告)日：2008-08-14

申请号：US12109521

申请日：2008-04-25

Applicant: Kunihiro WATANABE

Inventor： Kunihiro WATANABE

IPC: H01Q1/52

CPC classification number: H01Q1/526 ,  H01L24/48 ,  H01L25/162 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01Q9/0485 ,  H01Q23/00 ,  H05K1/0218 ,  H05K1/141 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09772 ,  H05K2201/10242 ,  H05K2203/1572 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In a high-frequency module, an antenna device is disposed on a first principal surface of a second substrate, a first principal surface of a first substrate and a second principal surface of the second substrate face each other and are connected to each other by conductive connecting members, electronic components including an IC chip are mounted on the first principal surface of the first substrate, ground electrodes are disposed on the first and second substrates, the conductive connecting members are connected to a ground potential, and thus the IC chip is surrounded by the ground electrodes of the first and second substrates and the conductive connecting members.

Abstract translation: 在高频模块中，天线装置设置在第二基板的第一主表面上，第一基板的第一主表面和第二基板的第二主表面彼此面对并且通过导电 连接构件，包括IC芯片的电子部件安装在第一基板的第一主表面上，接地电极设置在第一和第二基板上，导电连接构件连接到接地电位，因此IC芯片被包围 通过第一和第二基板的接地电极和导电连接构件。

公开(公告)号：US07276438B2

公开(公告)日：2007-10-02

申请号：US11135350

申请日：2005-05-24

Applicant: Yasuyoshi Horikawa ,  Keiichi Takemoto

Inventor： Yasuyoshi Horikawa ,  Keiichi Takemoto

IPC: H01L29/06

CPC classification number: H05K3/4046 ,  H05K2201/0347 ,  H05K2201/10242 ,  H05K2201/10416

Abstract: A method of manufacturing a wiring substrate of the present invention, includes a step of preparing a substrate containing a semi-cured resin layer or a thermo plastic resin layer, a step of forming a through hole that passes through the substrate, a step of inserting a conductive parts in the through hole, a step of curing the semi-resin layer or the thermo plastic resin layer in a state that the resin layer is made to flow by applying a thermal press to the substrate and filling a clearance between the through hole and the conductive parts with the resin layer, and a step of forming a wiring pattern, which is connected mutually via the conductive parts, on both surface sides of the substrate.

Abstract translation: 本发明的布线基板的制造方法包括：准备含有半固化树脂层或热塑性树脂层的基板的步骤，形成贯通基板的通孔的工序， 通孔中的导电部分，在通过向基板施加热压力使树脂层流动的状态下固化半树脂层或热塑性树脂层的步骤，并填充通孔之间的间隙 和具有树脂层的导电部件，以及在基板的两个表面侧上形成经由导电部件相互连接的布线图案的步骤。

公开(公告)号：US07273380B2

公开(公告)日：2007-09-25

申请号：US11657995

申请日：2007-01-25

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环都焊接到基板和设备。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US07183493B2

公开(公告)日：2007-02-27

申请号：US10883433

申请日：2004-06-30

Applicant: Jason A. Garcia ,  John J. Beatty

Inventor： Jason A. Garcia ,  John J. Beatty

IPC: H05K1/09

CPC classification number: H05K3/3436 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13015 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/14051 ,  H01L2224/14141 ,  H01L2224/14142 ,  H01L2224/14145 ,  H01L2224/14146 ,  H01L2224/14177 ,  H01L2224/14505 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/3511 ,  H05K3/3426 ,  H05K2201/068 ,  H05K2201/10242 ,  H05K2201/10909 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00014

Abstract: According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.

Abstract translation: 根据本发明的一个方面，提供一种电子组件。 电子组件包括其中形成有集成电路的第一基板和第二基板。 第一和第二基板通过电连接到集成电路的多个双材料互连互连，并且具有第一部件，该第一部件包括具有第一热膨胀系数的导电第一材料，第二部件包括具有第二材料的第二部件， 第二热膨胀系数。 第一和第二部件被连接和成形，使得当双材料互连件的温度改变时，互连件每个朝着第一或第二部件弯曲。 当第二基板的温度升高时，第二基板从其中心部分扩展。 双材料互连布置成使得双材料互连件远离第二基板的中心部分弯曲。

公开(公告)号：US20060272850A1

公开(公告)日：2006-12-07

申请号：US11422164

申请日：2006-06-05

Applicant: Shinji MORIMOTO ,  Toyokazu YOSHINO ,  Shigeki OGATA ,  Kouji NAKASHIMA ,  Katsuya OKAMOTO

Inventor： Shinji MORIMOTO ,  Toyokazu YOSHINO ,  Shigeki OGATA ,  Kouji NAKASHIMA ,  Katsuya OKAMOTO

IPC: H05K1/00

CPC classification number: H05K3/4046 ,  H05K1/0393 ,  H05K3/363 ,  H05K3/386 ,  H05K3/4617 ,  H05K3/4635 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2203/0113 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/082 ,  Y10T29/49124 ,  Y10T29/49165 ,  Y10T29/53843

Abstract: An interlayer connection conductor 1 is formed of a substantially spherical interlayer connector that is formed by forced in through holes 108, in a thickness direction, on a flexible printed circuit board having wiring layers 106, 107 on at leas one surface of an insulating layer The interlayer connection conductor includes a small cylindrical piece of metal core 102 formed by cutting a metal fine wire and a solder metal 103 coated around the surface of the metal core.

Abstract translation: 层间连接导体1由大致球形的层间连接器形成，该层间连接器通过在厚度方向上被迫穿过通孔108而形成在具有布线层106,107的柔性印刷电路板上，绝缘层的一个表面 层间连接导体包括通过切割金属细线而形成的小圆柱形金属芯102和围绕金属芯的表面涂覆的焊料金属103。

公开(公告)号：US20060166490A1

公开(公告)日：2006-07-27

申请号：US11392120

申请日：2006-03-29

Applicant: Kumamoto Takashi

Inventor： Kumamoto Takashi

IPC: H01L21/4763

CPC classification number: H01L21/486 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0204 ,  H05K3/022 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/10242 ,  H05K2201/10416 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A preformed copper plug may be inserted into a via hole in a package substrate. The opposed surfaces of the copper preform may be covered with a solder material. Copper foils may then be applied over the core and over the preformed plug. A vacuum hot press method may be utilized to activate or cure adhesive between the foil and the core to adhesively secure the foil to the core. At the same time, the heat from the vacuum hot press method may solder the copper foil to the solder coated copper plug. Thus, in some embodiments, the difficulty of filling via holes in situ with plated copper may be reduced, increasing throughput and reducing cost in some cases.

Abstract translation: 预先形成的铜塞可以插入到封装基板的通孔中。 铜预制件的相对表面可以用焊料材料覆盖。 然后可以将铜箔施加在芯上并在预制塞上。 可以使用真空热压法来激活或固化箔和芯之间的粘合剂，以将箔粘合地固定到芯上。 同时，来自真空热压法的热量可以将铜箔焊接到焊料涂覆的铜塞上。 因此，在一些实施例中，可以减少用电镀铜原位填充孔的困难，在一些情况下可以降低生产量并降低成本。

公开(公告)号：US07023288B2

公开(公告)日：2006-04-04

申请号：US10475072

申请日：2002-04-17

Applicant: Hitoshi Takanashi ,  Tsuneo Uchiyama ,  Youji Nagano ,  Kyo Horie ,  Noriyuki Watanabe ,  Kazuhiro Shii

Inventor： Hitoshi Takanashi ,  Tsuneo Uchiyama ,  Youji Nagano ,  Kyo Horie ,  Noriyuki Watanabe ,  Kazuhiro Shii

IPC: H03B5/32 ,  H03B5/36

CPC classification number: H03H9/1021 ,  H03H9/0547 ,  H03H9/0552 ,  H05K1/181 ,  H05K3/3442 ,  H05K5/0091 ,  H05K2201/10083 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10515 ,  H05K2201/2018 ,  Y02P70/611

Abstract: A piezoelectric oscillator comprising a piezoelectric vibrator with a piezoelectric vibrating element housed in a package and bottom terminals formed on the outer side of the bottom of the package, a circuit board with at least one electronic circuit component mounted and conductor patterns formed on the top side, and columnlike supports which mechanically and electrically connects the bottom terminals of the piezoelectric vibrator and the conductor patterns on the circuit board. The piezoelectric oscillator has a smaller board occupation area, and can be manufactured by quantity production using a batch process at a high productivity and a reduced cost.

Abstract translation: 一种压电振荡器，包括压电振动器，其具有容纳在封装中的压电振动元件和形成在所述封装的底部的外侧上的底端子;电路板，具有安装的至少一个电子电路部件和形成在所述顶侧上的导体图案 和柱状支撑体，其将压电振动器的底端和电路板上的导体图案机械地和电连接。 压电振荡器具有较小的板占用面积，并且可以通过以高生产率和降低成本的批量处理的数量生产来制造。