公开(公告)号：US5475568A

公开(公告)日：1995-12-12

申请号：US234101

申请日：1994-04-28

Applicant: Shoji Umesato

Inventor： Shoji Umesato

IPC: H01L23/538 ,  H01R9/03 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11

CPC classification number: H01L23/5385 ,  H01L23/538 ,  H05K1/0263 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/10189 ,  H05K2201/10272 ,  H05K2201/10689

Abstract: A power supply structure for a multichip package is provided to improve the transmission performance of signals. Cases are fitted onto one face of a ceramic substrate. On the other face are aligned substrates. On each of the substrates are erected I/O pins. The I/O pins are connected to signal pins of LSIs via the ceramic substrate's internal layer. On side faces of the substrates are provided power supply pads. To the power supply pads are connected the power supply pins of the LSIs via the ceramic substrate's internal layer. When power is to be supplied, electroconductive bars are inserted between the substrates. The electroconductive bars supply power to the LSIs via the power supply pads. A cable is connected to one of the I/O pins.

Abstract translation: 提供用于多芯片封装的电源结构以提高信号的传输性能。 将壳体安装在陶瓷基板的一个面上。 另一方面是对准基板。 在每个基板上都有直立的I / O引脚。 I / O引脚通过陶瓷基板的内层连接到LSI的信号引脚。 在基板的侧面设置有电源焊盘。 电源板通过陶瓷基板的内层连接LSI的电源引脚。 当供电时，在基板之间插入导电棒。 导电棒通过电源板向LSI供电。 电缆连接到其中一个I / O引脚。

公开(公告)号：US5363552A

公开(公告)日：1994-11-15

申请号：US96590

申请日：1993-07-23

Applicant: John B. Coniff

Inventor： John B. Coniff

IPC: H01L23/40 ,  H05K7/20 ,  H05K3/30

CPC classification number: H01L23/4093 ,  H01L2924/0002 ,  H05K2201/10272 ,  H05K2201/10409 ,  H05K2201/10659 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49204

Abstract: A unitary strip of thermally and electrically conductive spring material is formed with two rows of spring fingers formed at one end which have frictionally engaged therebetween the bus bar or plate of a solid-state device such as an FET having leads soldered to a printed circuit board. The opposite end of the strip is fastened mechanically to a conductive heat sink block on the circuit board. The strip provides electrical power, support for, and heat sinking of the solid-state device.

Abstract translation: 导电和导电弹簧材料的整体条形成有一排形成在一端的弹簧指，它们在固定状态装置的母线或板之间摩擦接合，例如具有焊接到印刷电路板的引线的FET 。 带的相对端机械地紧固在电路板上的导电散热块上。 该带提供固态设备的电力，支持和散热。

公开(公告)号：US5105340A

公开(公告)日：1992-04-14

申请号：US603213

申请日：1990-10-25

Applicant: Howard Lawrence

Inventor： Howard Lawrence

IPC: G06F13/40 ,  H05K1/02 ,  H05K3/30 ,  H05K3/32

CPC classification number: H05K1/0246 ,  G06F13/409 ,  H05K1/0231 ,  H05K1/0263 ,  H05K2201/044 ,  H05K2201/10022 ,  H05K2201/10272 ,  H05K2201/10303 ,  H05K2201/10492 ,  H05K2201/10636 ,  H05K2201/10962 ,  H05K2201/2018 ,  H05K3/301 ,  H05K3/325 ,  Y02P70/611

Abstract: In a "Futurebus+" backplane, at each end of the backplane the signal lines are each electrically connected to a power bus spaced from the rear face of the backplane via a discrete resistor which is housed in a throughbore in a body of electrically insulating material detachably secured to the rear face of the bakplane and which is electrically connected between the power bus and a pin soldered in a plated through hole and interconnected in the signal line. The ground lines are each connected to the power bus via a discrete capacitor which is housed in a throughbore in the body and which is electrically connected between the power bus and a pin soldered in a plated through hole and interconnected in the ground line. In the event that a resistor or capacitor should be faulty, only the signal or ground line to which the faulty resistor or capacitor is connected will be out of service until the faulty resistor or capacitor is replaced.

Abstract translation: 在“Futurebus +”背板中，在背板的每一端，信号线各自电连接到电源总线，电源总线通过分立的电阻器与背板的背面间隔开，该分立电阻器可以分离地容纳在电绝缘材料体中的通孔中 固定到烘焙机的背面，并且其电连接在电源总线和焊接在电镀通孔中并在信号线中互连的引脚之间。 接地线各自经由离散电容器连接到电力总线，该分立电容器容纳在主体中的通孔中，并且电连接在电源总线和焊接在电镀通孔中并在地线中互连的引脚之间。 如果电阻或电容器有故障，只有连接有故障电阻或电容器的信号或接地线将不再使用，直到有故障的电阻或电容器被更换为止。

公开(公告)号：US4875137A

公开(公告)日：1989-10-17

申请号：US295379

申请日：1989-01-10

Applicant: Robert D. Rozanski ,  James R. Medlock, III ,  Stephen F. Larson

Inventor： Robert D. Rozanski ,  James R. Medlock, III ,  Stephen F. Larson

IPC: H02B1/20 ,  H02H9/04 ,  H05K1/02 ,  H05K9/00

CPC classification number: H05K1/0254 ,  H02H9/044 ,  H05K9/0066 ,  H05K2201/09254 ,  H05K2201/09809 ,  H05K2201/10272

Abstract: A device for uniformily distributing current and voltage comprises first and second terminals, a first electrical bus electrically connected to the first terminal, a second electrical bus electrically isolated from the first electrical bus and electrically connected to the second terminal, a plurality of electrical components connected between the first and second buses so as to form a plurality of circuit paths of equal length, each circuit path running between the first terminal, the first electrical bus, one of the circuit components, the second electrical bus, and the second terminal. The plurality of electrical components are connected to the first and second buses at locations which are equidistant from the first and second terminals, respectively.

Abstract translation: 用于均匀分配电流和电压的装置包括第一和第二端子，电连接到第一端子的第一电气总线，与第一电气总线电隔离并电连接到第二端子的第二电气总线，多个电气部件连接 在第一和第二总线之间形成相同长度的多个电路，每个电路路径在第一端子，第一电气总线，电路部件之一，第二电气总线和第二端子之间运行。 多个电气部件分别在与第一和第二端子等距的位置连接到第一和第二总线。

公开(公告)号：US4866217A

公开(公告)日：1989-09-12

申请号：US304294

申请日：1989-01-31

Applicant: Yukio Muramatsu

Inventor： Yukio Muramatsu

IPC: H02G3/16 ,  G06F1/18 ,  H01R9/00 ,  H05K3/40 ,  H05K7/06

CPC classification number: H05K3/4092 ,  G06F1/189 ,  H05K2201/10272

Abstract: A new bus bar circuit board structure is provided. The structure comprises insulation substrates and a plurality of bus bars arranged on the insulation substrates parallelly with each other. The respective substrates have an edge portion and each bus bar has a portion bend erected from the respective substrate along the edge portion thereof to form frame-shaped gate portions, each frame-shaped gate portion being within another frame-shaped gate portion and separated therefrom by way of a gap when developed in plan view.

Abstract translation: 提供了一种新的母线电路板结构。 该结构包括彼此平行地布置在绝缘基板上的绝缘基板和多个汇流条。 各基板具有边缘部分，并且每个汇流条具有沿其边缘部分从相应基板竖立的部分弯曲部，以形成框形门部分，每个框状门部分在另一框架形门部分内并与之分离 通过在平面图上开发的空白。

公开(公告)号：US4708659A

公开(公告)日：1987-11-24

申请号：US900027

申请日：1986-08-25

Applicant: George Wozniczka

Inventor： George Wozniczka

IPC: H01R12/52 ,  H05K1/02 ,  H05K1/14 ,  H01R9/09

CPC classification number: H05K1/14 ,  H01R12/52 ,  H05K1/0263 ,  H05K2201/10272

Abstract: An elongated printed circuit (PC) board connector having a plurality of terminal pins aligned in a linear array has attached to its terminal pins an elongated, linear, U-shaped bus bar with a plurality of apertures in its lower edge. A plurality of U-shaped conductors are inserted through respective pairs of edge apertures in the bus bar, with the distal ends of each of the conductors adapted for coupling to a terminal on a PC board upon which the connector is mounted by means of a pair of support columns and nut/bolt combinations. The bus bar, terminal pins and conductor combination is then dip soldered to establish mechanical coupling and electrical connection therebetween. The shorting bus bar electrically couples the conductors to the terminal pins, with each conductor coupled across a plurality of terminal pins which are thus maintained at the same voltage to maintain the bus bar at a constant, uniform voltage over its entire length and to provide this well-defined voltage level to the PC board terminals.

Abstract translation: 具有以线性阵列排列的多个端子销的细长印刷电路（PC）板连接器已经在其端子销上连接有细长的线性U形汇流条，其在其下边缘具有多个孔。 多个U形导体通过汇流条中的相应的一对边缘孔插入，每个导体的远端适于联接到PC板上的端子，连接器通过一对连接器 的支柱和螺母/螺栓组合。 汇流条，端子销和导体组合然后被浸焊以在它们之间建立机械耦合和电连接。 短路母线将导体电连接到端子引脚，每个导体耦合在多个端子引脚上，从而将其保持在相同的电压，以将母线保持在其整个长度上恒定的均匀电压，并提供这一点 明确的电压水平到PC板端子。

公开(公告)号：US4688149A

公开(公告)日：1987-08-18

申请号：US912688

申请日：1986-09-26

Applicant: Nori Inoue ,  Yasuharu Moriai ,  Atushi Sakatani ,  Noriyuki Yoshida

Inventor： Nori Inoue ,  Yasuharu Moriai ,  Atushi Sakatani ,  Noriyuki Yoshida

IPC: H05K3/20 ,  H05K3/36 ,  H05K3/40 ,  H05K5/03 ,  H05K7/02 ,  H05K1/18

CPC classification number: H05K3/4084 ,  H05K3/368 ,  H05K5/03 ,  H05K7/02 ,  H05K2201/0397 ,  H05K2201/10272 ,  H05K2201/10386 ,  H05K2201/10946 ,  H05K3/202 ,  H05K3/4092

Abstract: An electrical junction system for automotive internal wiring has a wiring board provided with branching conductors formed by a multiplicity of bus bars on an insulation plate, the branching conductors being adapted to be connected to electric wires in a wiring harness to form branching electric circuits. The electrical junction system has a printed circuit board detachably mounted on the wiring board, the printed circuit board generally or inclusively carrying a plurality of circuits incorporating a multiplicity of function parts which are used semi-permanently such as relays and associated control elements.

Abstract translation: 用于汽车内部布线的电连接系统具有布线板，其布置有由绝缘板上的多个母线形成的分支导体，该分支导体适于连接到线束中的电线以形成分支电路。 电连接系统具有可拆卸地安装在布线板上的印刷电路板，印刷电路板通常或包含多个电路的多个电路，多个电路结合了多个功能部件，这些功能部件是半永久性的，例如继电器和相关的控制元件。

公开(公告)号：US4511950A

公开(公告)日：1985-04-16

申请号：US507734

申请日：1983-06-27

Applicant: Charles B. D. Bunner ,  David S. Brombal

Inventor： Charles B. D. Bunner ,  David S. Brombal

IPC: H05K1/02 ,  H05K1/14 ,  H05K7/14

CPC classification number: H05K7/1457 ,  H05K1/0263 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/10272

Abstract: Each printed circuit board (PCB) on a backpanel has an associated set of power supply studs and power supply pins at an edge of the backpanel. The PCBs can be powered commonly via power supply buses interconnecting the studs. Alternatively, the PCBs can be powered individually via respective power supply PCBs which are inserted into connectors formed partly by the power supply pins and partly by pins on an additional, power supply, backpanel which is mounted to extend contiguously from and in the same plane as the first backpanel. The two arrangements can be combined to power groups of PCBs individually with all of the PCBs in each group being powered commonly.

Abstract translation: 背板上的每个印刷电路板（PCB）在背板的边缘具有一组相关的电源螺柱和电源引脚。 PCB可以通过互连螺柱的电源总线通电。 或者，PCB可以通过相应的电源PCB单独供电，这些电源PCB被插入到部分地由电源引脚形成的连接器中，部分地由另外的电源背板上的引脚组成，其安装成从同一平面连续延伸， 第一个背板 这两种布置可以单独组合到PCB的电源组，每个组中的所有PCB通常都是通电的。

公开(公告)号：US3628095A

公开(公告)日：1971-12-14

申请号：US3628095D

申请日：1970-12-02

Applicant: SPERRY RAND CORP

Inventor： SCHWARTZ LEON ,  SIMON WILLIAM F

IPC: H05K1/02 ,  H05K3/34 ,  H05K1/04

CPC classification number: H05K1/0263 ,  H05K3/3447 ,  H05K2201/10272 ,  H05K2201/10689

Abstract: There is disclosed herein an arrangement for connecting and holding a power distribution bus to a printed circuit board. The bus incorporates flat pads which extend from and are coplanar with it. An oversized hole in each respective pad is provided so that the respective bus may be oriented over an existing plated through hole in the printed circuit board. The leads of an integrated circuit package required to be connected to the voltage or ground potential elements of the power distribution bus are positioned both through the oversized hole of the pad and the plated through hole of the printed circuit board. The connection is made permanent by soldering.

公开(公告)号：US20240243441A1

公开(公告)日：2024-07-18

申请号：US18487976

申请日：2023-10-16

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Young-Hwan KWON ,  Hyeok LEE

IPC: H01M50/519 ,  H01M50/209 ,  H01M50/505 ,  H01M50/528 ,  H01M50/569 ,  H05K1/02

CPC classification number: H01M50/519 ,  H01M50/209 ,  H01M50/505 ,  H01M50/528 ,  H01M50/569 ,  H05K1/028 ,  H05K2201/10037 ,  H05K2201/10272

Abstract: A rechargeable battery module includes a plurality of battery cells stacked in a first direction; a bus bar holder covering the battery cells and exposing electrode terminals of the battery cells in a third direction crossing a second direction, wherein the electrode terminals are exposed at both sides of the bus bar holder along the second direction crossing the first direction; a bus bar connecting the electrode terminals to a bus bar support portion of the bus bar holder; a flexible printed circuit (FPC) on the bus bar and including a copper foil having one surface exposed in the third direction; an aluminum tab on another surface of the copper foil; and a welding portion including a laser welded portion of each of the bus bar, the copper foil, and the aluminum tab.