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    Printed circuit laminate, printed circuit board produced therefrom, and printed circuit process therefor
    61.
    发明授权
    Printed circuit laminate, printed circuit board produced therefrom, and printed circuit process therefor 失效
    印刷电路层压板，由其制造的印刷电路板及其印刷电路工艺

    公开(公告)号：US4664962A

    公开(公告)日：1987-05-12

    申请号：US720975

    申请日：1985-04-08

    Applicant: Raymond C. DesMarais, Jr.

    Inventor： Raymond C. DesMarais, Jr.

    IPC: H05K1/00 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H05K3/06 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H05K3/38 ,  H05K3/40 ,  B32B3/10 ,  G03C5/00 ,  G03C5/04

    CPC classification number: H05K3/225 ,  H05K1/118 ,  H05K3/363 ,  H05K3/4092 ,  H05K1/0393 ,  H05K1/116 ,  H05K1/141 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/09845 ,  H05K2201/10477 ,  H05K2201/10977 ,  H05K2203/0455 ,  H05K3/002 ,  H05K3/0058 ,  H05K3/06 ,  H05K3/305 ,  H05K3/3447 ,  H05K3/386 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917

    Abstract: A novel printed circuit laminate product and process are provided for use in connection with a printed circuit board. The laminate is composed of a polyimide support stratum, a copper electrical conductor stratum, and an intermediate adhesive stratum. In one form, the opposite faces of the laminate are separately etched to provide different circuit related features and the laminate as an entirety has through holes, which have particular cross sectional geometry and which are produced by particular process steps. In another form, the copper stratum is laminated to the adhesive face of the adhesive and support strata and is etched after through holes have been drilled in the adhesive and support strata. The geometry is such that the diameter of a through hole in a conducting portion of the conducting stratum is smaller than the diameter of the through hole in the adhesive and support strata, so as to provide a conducting rim or flange for ease and security of mechanical and electrical connection to an associated electrical lead wire or grommet incorporated in a circuit on the object substrate below. The final product of the present invention is a printed circuit structure comprising one or more laminates of the foregoing type, bonded to a rigid printed circuit board.

    Abstract translation: 提供了一种与印刷电路板结合使用的新型印刷电路层叠产品和工艺。 层压板由聚酰亚胺支撑层，铜电导体层和中间粘合剂层构成。 在一种形式中，层压体的相对面被单独蚀刻以提供不同的电路相关特征，并且层压体整体上具有通孔，其具有特定的横截面几何形状，并且通过特定的工艺步骤产生。 在另一种形式中，铜层被层压到粘合剂和支撑层的粘合面上，并且在通孔在粘合剂和支撑层中钻出后进行蚀刻。 几何形状使得导电层的导电部分中的通孔的直径小于粘合剂和支撑层中的通孔的直径，以便提供导电边缘或法兰，以便于机械的和安全的 并且电连接到结合在下面的对象基板上的电路中的相关联的引线或索环。 本发明的最终产品是包括一种或多种上述类型的层合物的印刷电路结构，其结合到刚性印刷电路板。

    Mounting a hybrid circuit to a circuit board
    62.
    发明授权
    Mounting a hybrid circuit to a circuit board 失效
    将混合电路安装到电路板上

    公开(公告)号：US4658330A

    公开(公告)日：1987-04-14

    申请号：US773756

    申请日：1985-09-09

    Applicant: William E. Berg

    Inventor： William E. Berg

    IPC: H01R33/76 ,  H01L21/60 ,  H01L23/32 ,  H05K3/32 ,  H05K7/10 ,  H05K1/12 ,  H05K7/20

    CPC classification number: H05K7/1053 ,  H05K3/325 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K2201/10393 ,  H05K2201/10477 ,  H05K2201/10681 ,  H05K2201/10727

    Abstract: A unitary electronic circuit element has an interconnect surface at which it is provided with contact pads and is mounted on a circuit board using a flexible, sheet-form interconnect member that comprises dielectric material and runs of electrically conductive material. Each conductor run extends between a contact pad that is exposed at a first main face of the interconnect member and a termination point that is exposed at a second main face of the interconnect member. The interconnect surface of the electronic circuit element and the second main face of the interconnect member are placed in mutually confronting relationship, and the circuit element is attached to the second main face of the interconnect member by way of its interconnect surface, whereby electrically conductive contact is established between the contact pads of the circuit element and the corresponding termination points of the interconnect member. The circuit element is attached by way of its back face to a thermally conductive plate that has, at one main face, pressure pads that at least partially surround a circuit element receiving area of the plate. The first main face of the interconnect member and the main face of the circuit board are placed in mutually confronting relationship, with the contact pads of the interconnect member touching corresponding contact pads of the circuit board. The plate and the circuit board are clamped together, whereby the pressure pads supply contact force to maintain the contact pads of the interconnect member in electrically conductive pressure contact with the corresponding contact pads of the circuit board.

    Abstract translation: 单一电子电路元件具有互连表面，在该互连表面处设置有接触焊盘，并且使用包括电介质材料和导电材料的导体的柔性片状互连构件来安装在电路板上。 每个导体延伸在暴露在互连构件的第一主面处的接触焊盘和暴露在互连构件的第二主面之间的端接点之间延伸。 电子电路元件的互连表面和互连构件的第二主面以相互面对的关系放置，并且电路元件通过其互连表面附接到互连构件的第二主面，由此导电接触 建立在电路元件的接触焊盘和互连构件的相应端接点之间。 电路元件通过其背面连接到导热板，该导热板在一个主表面处具有至少部分地围绕板的电路元件接收区域的压力垫。 互连构件的第一主面和电路板的主面以相互面对的关系放置，互连构件的接触垫接触电路板的对应的接触垫。 板和电路板夹在一起，由此压垫提供接触力，以使互连构件的接触垫与电路板的相应接触垫导电压力接触。

    Downward-facing optical component module
    65.
    发明授权
    Downward-facing optical component module 有权
    向下的光学部件模块

    公开(公告)号：US08804368B2

    公开(公告)日：2014-08-12

    申请号：US12433751

    申请日：2009-04-30

    Applicant: Yoshinari Matsuda ,  Ramon Osuma ,  Ivan Cazarez ,  Rogelio Ruiz

    Inventor： Yoshinari Matsuda ,  Ramon Osuma ,  Ivan Cazarez ,  Rogelio Ruiz

    IPC: H05K1/11 ,  H05K1/14

    CPC classification number: H05K1/141 ,  H05K1/182 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10477

    Abstract: A motherboard for an electronic device comprising a main printed circuit board (PCB) with a through-hole extending between the upper component surface and the lower surface. The motherboard includes a carrier PCB having a top surface and a bottom surface, and at least one component, e.g. an optical device, sensor, or the like, coupled to the top surface. The carrier PCB is mounted in an in an inverted orientation with respect to the main PCB such that the top surface of the carrier PCB faces the upper component surface of the main PCB. The carrier PCB is aligned with the main PCB such that the component is substantially aligned with the through hole of the main PCB and is visible from the lower surface of the PCB.

    Abstract translation: 一种用于电子设备的母板，包括具有在上部部件表面和下部表面之间延伸的通孔的主印刷电路板（PCB）。 主板包括具有顶表面和底表面的载体PCB，以及至少一个部件，例如， 耦合到顶表面的光学装置，传感器等。 载体PCB相对于主PCB以相反方向安装，使得载体PCB的顶表面面向主PCB的上部组件表面。 载体PCB与主PCB对准，使得该部件基本上与主PCB的通孔对准，并且可从PCB的下表面看到。

    Interconnect board, printed circuit board unit, and method
    70.
    发明授权
    Interconnect board, printed circuit board unit, and method 失效
    互连板，印刷电路板单元和方法

    公开(公告)号：US08289728B2

    公开(公告)日：2012-10-16

    申请号：US12888013

    申请日：2010-09-22

    Applicant: Masateru Koide

    Inventor： Masateru Koide

    IPC: H05K1/11 ,  H05K1/14

    CPC classification number: H05K3/4608 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/19106 ,  H05K1/141 ,  H05K3/445 ,  H05K2201/10378 ,  H05K2201/10477 ,  H01L2924/00

    Abstract: An interconnect board for interconnecting and arranged between a first circuit board and a second circuit board, the interconnect board includes a first conductive plate including a first connection terminal, a first insulating member wrapping the first conductive plate except for the first connection terminal, a second conductive plate including a second connection terminal, a second insulating member wrapping the second conductive plate except for the second connection terminal, an insulating substrate arranged between the first insulating member and the second insulating member, and a conductive member penetrating the first insulating member, the second insulating member and the insulating substrate.

    Abstract translation: 一种用于互连并布置在第一电路板和第二电路板之间的互连板，所述互连板包括第一导电板，所述第一导电板包括第一连接端子，第一绝缘构件，所述第一绝缘构件包围除所述第一连接端子之外的所述第一导电板， 包括第二连接端子的导电板，包围除了第二连接端子之外的第二导电板的第二绝缘构件，布置在第一绝缘构件和第二绝缘构件之间的绝缘基板，以及贯穿第一绝缘构件的导电构件， 第二绝缘构件和绝缘基板。

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