Abstract:
The present disclosure relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of blocking the introduction of external air and external particles into a chamber by forming an air curtain at a loading/unloading part when the chamber is open. The substrate processing apparatus of the present disclosure includes a chamber in which a space is formed, and a fluid injection part configured to inject a fluid from an outer side of a substrate loading/unloading part of the chamber through which a substrate is loaded and unloaded.
Abstract:
A pipe doping apparatus comprises a bucket assembly including a base and a bucket supported on the base and having an inside volume, a lubricating unit having at least one lubricant applicator inside the bucket; and a source of torque configured to rotate the bucket and/or the lubricating unit relative to a tubular. The apparatus may include a cleaning unit and/or a drying unit and the source of torque may be a fluid jet in either. At least one lubricant applicator may be retractable and may be actuated between a retracted position and an extended position by centripetal force. The apparatus may further include a positioning assembly supporting the base and the rotary bucket assembly and a controller connected to and controlling each of:—the positioning assembly, the cleaning unit, the drying unit, and the lubricating unit.
Abstract:
A popcorn seasoning machine is disclosed. The popcorn seasoning machine includes a receptacle having a forced air system. A user then inputs a selected seasoning and popcorn into the device and depresses a control button for injecting air into the interior of the container for mixing popcorn and the seasoning. As a result, the seasoning is evenly distributed on the popcorn to facilitate an enjoyable popcorn eating experience. The device further includes an air pump therein which manually provides are to a vent platform to a top end of the receptable. The top end also includes a hingedly attached dome which seals the top end of the receptacle.
Abstract:
A pipe doping apparatus comprises a bucket assembly including a base and a bucket supported on the base and having an inside volume, a lubricating unit having at least one lubricant applicator inside the bucket; and a source of torque configured to rotate the bucket and/or the lubricating unit relative to a tubular. The apparatus may include a cleaning unit and/or a drying unit and the source of torque may be a fluid jet in either. At least one lubricant applicator may be retractable and may be actuated between a retracted position and an extended position by centripetal force. The apparatus may further include a positioning assembly supporting the base and the rotary bucket assembly and a controller connected to and controlling each of:—the positioning assembly, the cleaning unit, the drying unit, and the lubricating unit.
Abstract:
A transfer and coating apparatus transfers a component from a conveyor to a coating station for application of a coating. The transfer apparatus includes a mast that can move about orthogonal axes in a horizontal plane and a mast having a carriage that can move vertically. The carriage includes a hook that swings about a horizontal axis relative to the mast for movement of the component in the horizontal direction. A sway bar extends between the hook and component to inhibit movement about a horizontal axis. The component is delivered to an upper compartment of a coating apparatus where it can be lowered in to a lower compartment containing coating material. Excess coating material is removed by an array of nozzles in the upper compartment as the component is raised from the coating material.
Abstract:
A semiconductor processing station including a central transfer chamber, a load lock chamber disposed adjacent to the central transfer chamber, and a cooling stage disposed adjacent to the load lock chamber and the central transfer chamber is provided. The load lock chamber is adapted to contain a wafer carrier including a plurality of wafers. The central transfer chamber communicates between the cooling stage and the load lock chamber to transfer a wafer of the plurality of wafers between the cooling stage and the load lock chamber.
Abstract:
A chamber includes a sidewall, a cooling pipe, and an external pipe. The cooling pipe includes a first segment extending along the sidewall of the chamber, and includes multiple purge nozzles. The external pipe extends to inside the chamber and is connected to the first segment of the cooling pipe. A semiconductor processing station includes a central transfer chamber, a load lock chamber, and a cooling stage. The load lock chamber and the cooling stage are disposed adjacent to the central transfer chamber. The load lock chamber is adapted to contain a wafer carrier having multiple wafers. The central transfer chamber communicates between the cooling stage and the load lock chamber to transfer a wafer between the cooling stage and the load lock chamber. A semiconductor process using the semiconductor processing station is also provided.
Abstract:
A contact nozzle for coating an elastic strand with an adhesive. Air is discharged at the adhesive in contact with the strand, causing the adhesive to spread around the periphery of the strand. The air assists with release of the adhesive from the nozzle and also cleans the nozzle to discourage adhesive build-up on the nozzle.
Abstract:
An apparatus for hot dip coating metal strip is disclosed having a dip bath vessel (4), a snout (6) which opens into the dip bath vessel for introducing a metal strip (1) which is heated in a continuous furnace into the dip bath, and a deflecting roller (7) which is arranged in the dip bath vessel for deflecting the metal strip (1) which enters into the dip bath in a direction which points out of the dip bath. The snout (6) is provided with a shaft-shaped snout extension piece (6.1) for increasing the snout dipping depth, the internal width of the snout extension piece (6.1) tapering toward its outlet opening (6.15) at least over a part length of said snout extension piece (6.1). As a result, an increase or maximization of the eddy flow in the molten metal at or close to the metal strip (1) and therefore improved homogenization of the molten metal in the region of the strip is achieved, as a result of which slag-induced surface defects on the surface of the coated metal strip (1) can be avoided.
Abstract:
A slit opening of a slit nozzle extends unidirectionally in a longitudinal direction from near the center of a circular substrate to near an outer edge of the substrate, and has a length in the longitudinal direction equal to or smaller than a radius of the substrate. When the slit nozzle discharges chemical onto the substrate, a rotary holder rotates the substrate and the slit nozzle relatively to each other about the center of the substrate. Accordingly, the chemical from the slit nozzle all adheres to a surface of the substrate to form an excellent liquid column and a chemical film on an almost entire surface of the substrate along the outer edge of the circular substrate. This yields satisfactory coating of the substrate with the chemical while waste chemical is suppressed.