公开(公告)号：US09246068B2

公开(公告)日：2016-01-26

申请号：US14305092

申请日：2014-06-16

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Min Lin

IPC: H01L33/50 ,  H01L33/46 ,  H01L33/54

CPC classification number: H01L33/504 ,  H01L33/46 ,  H01L33/505 ,  H01L33/508 ,  H01L33/54 ,  H01L2933/0041

Abstract: The present disclosure involves a method. The method includes providing a substrate having a layer disposed thereon. A plurality of light-emitting devices is attached to the layer. A gel is applied over the substrate. The gel covers the plurality of light-emitting devices. The gel is shaped into a plurality of lenses. The lenses each cover a respective one of the light-emitting devices. The light-emitting devices are separated from one another. The substrate and the layer are removed.

Abstract translation: 本公开涉及一种方法。 该方法包括提供其上设置有层的基板。 多个发光装置附着在该层上。 将凝胶施加在基底上。 凝胶覆盖多个发光装置。 凝胶成形为多个透镜。 透镜各自覆盖相应的一个发光器件。 发光装置彼此分离。 去除衬底和层。

公开(公告)号：US09224636B2

公开(公告)日：2015-12-29

申请号：US14267303

申请日：2014-05-01

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Chun-Lin Chang ,  Hsing-Kuo Hsia ,  Hung-Yi Kuo

IPC: H01L21/768 ,  H01L21/02 ,  H01L21/3065

CPC classification number: H01L21/76801 ,  H01L21/02057 ,  H01L21/3065 ,  H01L21/76898

Abstract: A method includes forming an opening in a substrate, and the opening completely extends through the substrate. A recast material is formed on sidewalls of the substrate exposed by the opening. A first chemical is applied in the opening to remove the recast material, wherein a residue of the first chemical remains on portions of the sidewalls after the applying of the first chemical. Moreover, A second chemical is applied in the opening to remove the residue of the first chemical, and the second chemical is different from the first chemical.

Abstract translation: 一种方法包括在基板中形成开口，并且开口完全延伸穿过基板。 在由开口暴露的衬底的侧壁上形成重铸材料。 在开口中施加第一种化学品以去除重铸材料，其中在施加第一种化学品之后，第一种化学物质的残留物残留在侧壁的部分上。 此外，在开口中施加第二种化学物质以除去第一化学品的残余物，而第二种化学品与第一种化学品不同。

公开(公告)号：US09153739B2

公开(公告)日：2015-10-06

申请号：US14210522

申请日：2014-03-14

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Hsin-Chieh Huang

IPC: H01L33/22 ,  H01L33/04 ,  H01L33/24

CPC classification number: H01L33/22 ,  H01L33/04 ,  H01L33/24

Abstract: A device includes a textured substrate having a trench extending from a top surface of the textured substrate into the textured substrate, wherein the trench comprises a sidewall and a bottom. A light-emitting device (LED) includes an active layer over the textured substrate. The active layer has a first portion parallel to the sidewall of the trench and a second portion parallel to the bottom of the trench.

Abstract translation: 一种器件包括纹理化衬底，其具有从纹理化衬底的顶表面延伸到纹理衬底中的沟槽，其中沟槽包括侧壁和底部。 发光器件（LED）包括纹理衬底上的有源层。 有源层具有平行于沟槽侧壁的第一部分和平行于沟槽底部的第二部分。

公开(公告)号：US20150194567A1

公开(公告)日：2015-07-09

申请号：US13834055

申请日：2013-03-15

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Hsing-Kuo Hsia ,  Ching-Hua Chiu

IPC: H01L33/00 ,  H01L33/62 ,  H01L33/32 ,  H01L33/46 ,  H01L33/06 ,  H01L33/24

CPC classification number: H01L33/20 ,  H01L33/007 ,  H01L33/0079

Abstract: The present disclosure provides one embodiment of a method for fabricating light-emitting diode (LED) devices. The method includes forming a nano-mask layer on a first substrate, wherein the nano-mask layer has a randomly arranged grain pattern; growing a first epitaxy semiconductor layer in the first substrate, forming a nano-composite layer; growing a number of epitaxy semiconductor layers over the nano-composite layer; bonding a second substrate to the epitaxy semiconductor layers from a first side of the epitaxy semiconductor layers; applying a radiation energy to the nano-composite layer; and separating the first substrate from the epitaxy semiconductor layers from a second side of the epitaxy semiconductor layers.

Abstract translation: 本公开提供了制造发光二极管（LED）装置的方法的一个实施例。 该方法包括在第一基板上形成纳米掩模层，其中纳米掩模层具有随机布置的晶粒图案; 在第一衬底中生长第一外延半导体层，形成纳米复合层; 在纳米复合层上生长许多外延半导体层; 从所述外延半导体层的第一侧将第二衬底接合到所述外延半导体层; 向纳米复合层施加辐射能; 以及从所述外延半导体层的第二侧将所述第一衬底与所述外延半导体层分离。

公开(公告)号：US09076950B2

公开(公告)日：2015-07-07

申请号：US13790092

申请日：2013-03-08

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Kuan-Chun Chen ,  Hao-Chung Kuo ,  You-Da Lin ,  Zhen-Yu Li

IPC: H01L33/64 ,  F21V21/00 ,  H01L25/075 ,  F21S6/00 ,  F21V3/04 ,  F21V7/22 ,  F21Y101/02 ,  F21Y105/00 ,  F21V29/74 ,  F21V29/89

CPC classification number: H01L25/0753 ,  F21S6/00 ,  F21V3/049 ,  F21V7/22 ,  F21V21/00 ,  F21V29/74 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/06 ,  H01L33/20 ,  H01L33/24 ,  H01L33/32 ,  H01L33/36 ,  H01L33/502 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/647 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A lighting apparatus includes a polygon die including a plurality of light-emitting diodes (LEDs), and a submount to which each of the LEDs is coupled. Each LED includes a plurality of epi-layers which contains a p-type layer, an n-type layer, and a multiple quantum well (MQW) disposed between the p-type layer and the n-type layer, and a p-type electrode and an n-type electrode which are electrically coupled to the p-type layer and the n-type layer, respectively. The p-type and the n-type electrodes are located between the submount and the epi-layers. The submount contains a plurality of conductive elements configured to electrically couple at least a portion of the plurality of LEDs in series. At least some of the plurality of LEDs have non-rectangular top view shapes.

Abstract translation: 照明装置包括具有多个发光二极管（LED）的多边形管芯，以及与每个LED连接的基座。 每个LED包括多个外延层，其包含设置在p型层和n型层之间的p型层，n型层和多量子阱（MQW），以及p型 电极和n型电极，其分别电耦合到p型层和n型层。 p型和n型电极位于底座和外延层之间。 底座包含多个导电元件，其被配置为将多个LED的至少一部分串联耦合。 多个LED中的至少一些LED具有非矩形顶视图形状。

公开(公告)号：US20150147834A1

公开(公告)日：2015-05-28

申请号：US14608306

申请日：2015-01-29

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Chen-Hua Yu ,  Hung-Pin Chang ,  Yung-Chi Lin ,  Chia-Lin Yu ,  Jui-Pin Hung ,  Chien Ling Hwang

IPC: H01L33/00 ,  H01L33/62

CPC classification number: H01L21/76898 ,  H01L21/3065 ,  H01L21/486 ,  H01L21/6835 ,  H01L21/76843 ,  H01L21/76876 ,  H01L21/76877 ,  H01L21/76879 ,  H01L23/147 ,  H01L23/481 ,  H01L23/49827 ,  H01L24/29 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L33/005 ,  H01L33/0054 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32506 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/04941 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3512 ,  H01L2933/0066 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The substrate with through silicon plugs (or vias) described above removes the need for conductive bumps. The process flow is very simple and cost efficient. The structures described combines the separate TSV, redistribution layer, and conductive bump structures into a single structure. By combining the separate structures, a low resistance electrical connection with high heat dissipation capability is created. In addition, the substrate with through silicon plugs (or vias, or trenches) also allows multiple chips to be packaged together. A through silicon trench can surround the one or more chips to provide protection against copper diffusing to neighboring devices during manufacturing. In addition, multiple chips with similar or different functions can be integrated on the TSV substrate. Through silicon plugs with different patterns can be used under a semiconductor chip(s) to improve heat dissipation and to resolve manufacturing concerns.

Abstract translation: 具有上述通孔硅衬底（或通孔）的基板消除了对导电凸块的需要。 流程非常简单，成本效益高。 所描述的结构将单独的TSV，再分配层和导电凸块结构组合成单个结构。 通过组合单独的结构，产生具有高散热能力的低电阻电连接。 此外，具有通过硅插头（或通孔或沟槽）的基板还允许将多个芯片封装在一起。 通过硅沟槽可围绕一个或多个芯片，以在制造期间提供防止铜扩散到相邻器件的保护。 此外，具有相似或不同功能的多个芯片可以集成在TSV基板上。 通过具有不同图案的硅插头可以在半导体芯片下使用以改善散热并解决制造问题。

公开(公告)号：US20150140703A1

公开(公告)日：2015-05-21

申请号：US14603423

申请日：2015-01-23

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Hsing-Kuo Hsia ,  Chih-Kuang Yu ,  Gordon Kuo ,  Chyi Shyuan Chern

IPC: H01L33/64 ,  H01L33/54 ,  H01L33/58 ,  H01L25/075

CPC classification number: H01L33/64 ,  H01L25/075 ,  H01L33/54 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An apparatus includes a wafer with a number of openings therein. For each opening, an LED device is coupled to a conductive carrier and the wafer in a manner so that each of the coupled LED device and a portion of the conductive carrier at least partially fill the opening. A method of fabricating an LED device includes forming a number of openings in a wafer. The method also includes coupling light-emitting diode (LED) devices to conductive carriers. The LED devices with conductive carriers at least partially fill each of the openings.

Abstract translation: 一种装置包括其中具有多个开口的晶片。 对于每个开口，LED器件以这样的方式耦合到导电载体和晶片，使得每个耦合的LED器件和导电载体的一部分至少部分地填充开口。 制造LED器件的方法包括在晶片中形成多个开口。 该方法还包括将发光二极管（LED）器件耦合到导电载体上。 具有导电载体的LED装置至少部分地填充每个开口。

公开(公告)号：US20150123571A1

公开(公告)日：2015-05-07

申请号：US14556318

申请日：2014-12-01

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Wei-Yu Yeh

IPC: H05B33/08

CPC classification number: H05B33/089 ,  H05B33/0851 ,  Y02B20/341

Abstract: A system includes a plurality of light-emitting devices electrically coupled together. A temperature of each of the light-emitting devices is correlated with a voltage of said light-emitting device. The system includes a current driver configured to control an amount of current through at least a subset of the light-emitting devices. The system includes electronic circuitry that is electrically coupled to the subset of the light-emitting devices. The electronic circuitry is configured to: measure a voltage of the subset of the light-emitting devices while the light-emitting devices are in operation; determine, based on the measured voltage, whether the subset of the light-emitting devices is hotter than an acceptable temperature threshold; and instruct the current driver to reduce the amount of current through the subset of the light-emitting devices if the subset of the light-emitting devices has been determined to be hotter than the acceptable temperature threshold.

Abstract translation: 一种系统包括电耦合在一起的多个发光器件。 每个发光器件的温度与所述发光器件的电压相关。 该系统包括被配置为控制通过至少一个发光器件子集的电流量的电流驱动器。 该系统包括电耦合到发光器件的子集的电子电路。 电子电路被配置为：在发光装置运行时测量发光装置的子集的电压; 基于测量的电压确定发光器件的子集是否比可接受的温度阈值更热; 并且如果已经确定发光装置的子集比可接受的温度阈值更热，则指示当前的驱动器减少通过发光装置的子集的电流量。

公开(公告)号：US20150118772A1

公开(公告)日：2015-04-30

申请号：US14584009

申请日：2014-12-29

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Ching-Yi Chen ,  Yu-Sheng Tang ,  Hao-Yu Yang ,  Hsin-Hung Chen ,  Tzu-Wen Shih

IPC: H01L33/58 ,  H01L33/60 ,  H01L33/50 ,  H01L25/075 ,  H01L33/54

CPC classification number: H01L33/58 ,  F21K9/64 ,  F21V13/02 ,  F21V13/14 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A lens is formed over one or more light-emitting devices disposed over a substrate. The lens includes a trench that circumferentially surrounds the one or more light-emitting devices. The trench is filled with a phosphor-containing material.

Abstract translation: 在设置在基板上的一个或多个发光器件上形成透镜。 透镜包括围绕一个或多个发光器件的沟槽。 沟槽填充有含磷材料。

公开(公告)号：US08999770B2

公开(公告)日：2015-04-07

申请号：US13949556

申请日：2013-07-24

Applicant: TSMC Solid State Lighting Ltd.

Inventor： Tien-Ming Lin ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

IPC: H01L21/20 ,  H01L33/58 ,  H01L33/50

CPC classification number: H01L33/58 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor structure includes a module with a plurality of die regions, a plurality of light-emitting devices disposed upon the substrate so that each of the die regions includes one of the light-emitting devices, and a lens board over the module and adhered to the substrate with glue. The lens board includes a plurality of microlenses each corresponding to one of the die regions, and at each one of the die regions the glue provides an air-tight encapsulation of one of the light-emitting devices by a respective one of the microlenses. Further, phosphor is included as a part of the lens board.

Abstract translation: 半导体结构包括具有多个管芯区域的模块，设置在衬底上的多个发光器件，使得每个管芯区域包括一个发光器件，以及在该模块上的透镜板，并且粘附到 基材用胶。 透镜板包括多个微透镜，每个微透镜各自对应于一个裸片区域，并且在每个裸片区域中，胶水通过相应的一个微透镜提供一个发光器件的气密封装。 此外，作为透镜板的一部分包括磷光体。