公开(公告)号：US20130240259A1

公开(公告)日：2013-09-19

申请号：US13799221

申请日：2013-03-13

Applicant: FUJITSU LIMITED

Inventor： Hideaki YOSHIMURA

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K1/115 ,  G01R31/2889 ,  H05K1/0298 ,  H05K1/0366 ,  H05K3/4038 ,  H05K3/425 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/09545 ,  H05K2201/09554 ,  H05K2201/0959 ,  Y10T29/49165

Abstract: A method of manufacturing a wiring board includes: forming an outer through hole in a core substrate; filling the outer through hole with an insulation resin; forming a first conductive layer on a surface of the insulation resin at a portion where a core connecting via is formed; forming a land around the first conductive layer; laminating the wiring layer on the core substrate after the forming of the first conductive layer and the forming of the land; forming an inner through hole having a smaller diameter than that of the outer through hole and penetrating through the core substrate and the wiring layer so as to penetrate through the insulation resin; and coating a first conductive film on an inner wall surface of the inner through hole, in which the core substrate and the first conductive film are electrically connected through the first conductive layer and the land.

Abstract translation: 制造布线板的方法包括：在芯基板中形成外通孔; 用绝缘树脂填充外部通孔; 在形成芯连接通孔的部分上在绝缘树脂的表面上形成第一导电层; 形成围绕所述第一导电层的区域; 在形成第一导电层并形成焊盘之后，在芯基板上层叠布线层; 形成直径小于所述外通孔直径的内通孔，穿过所述芯基板和所述布线层以贯穿所述绝缘树脂; 并且在内部通孔的内壁表面上涂覆第一导电膜，其中芯基板和第一导电膜通过第一导电层和焊盘电连接。

公开(公告)号：US08258411B2

公开(公告)日：2012-09-04

申请号：US12548933

申请日：2009-08-27

Applicant: Alan E. Wang ,  Kevin C. Olson

Inventor： Alan E. Wang ,  Kevin C. Olson

IPC: H05K1/11

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US08236186B2

公开(公告)日：2012-08-07

申请号：US12385576

申请日：2009-04-13

Applicant: Aya Mizushima ,  Toshiki Naito

Inventor： Aya Mizushima ,  Toshiki Naito

IPC: H01B13/00

CPC classification number: H05K3/243 ,  H05K1/056 ,  H05K3/06 ,  H05K3/242 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09554 ,  H05K2201/0969 ,  H05K2201/09718

Abstract: A production method of a suspension board with circuit includes the steps of forming, on a metal supporting board, an insulating layer formed with a first opening, forming a metal thin film on the insulating layer and on the metal supporting board exposed from the first opening, forming, on a surface of the metal thin film, a conductive layer having terminal portions forming, on the terminal portions, a metal plating layer by electrolytic plating using the metal supporting board as a lead, forming a second opening in a portion of the metal supporting board opposing the first opening, and partially etching the metal supporting board to form the suspension board with circuit and a support frame. In the step of forming the insulating layer, the first opening is formed in the insulating layer in which the supporting frame is formed.

Abstract translation: 具有电路的悬挂板的制造方法包括以下步骤：在金属支撑板上形成由第一开口形成的绝缘层，在绝缘层上形成金属薄膜和在第一开口露出的金属支撑板上 在所述金属薄膜的表面上形成具有端子部分的导电层，所述端子部分在所述端子部分上使用所述金属支撑板作为引线通过电解电镀形成金属镀层，在所述金属镀层的一部分中形成第二开口 金属支撑板与第一开口相对，并且部分地蚀刻金属支撑板以形成具有电路和支撑框架的悬挂板。 在形成绝缘层的步骤中，第一开口形成在形成支撑框架的绝缘层中。

公开(公告)号：US20120031655A1

公开(公告)日：2012-02-09

申请号：US13275808

申请日：2011-10-18

Applicant: Kevin C. Olson ,  Alan G. Wang

Inventor： Kevin C. Olson ,  Alan G. Wang

IPC: H05K1/09 ,  H05K3/00 ,  H05K1/02

CPC classification number: H01L21/486 ,  C09D5/4488 ,  H01L21/481 ,  H01L21/4857 ,  H01L23/142 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/056 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/388 ,  H05K3/426 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0179 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2203/0582 ,  H05K2203/135 ,  H01L2924/00

Abstract: A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; (c) removing the dielectric coating in a predetermined pattern to expose sections of the substrate; (d) applying a layer of metal to all surfaces to form metallized vias through and/or to the electrically conductive core; (e) applying a resist to the metal layer to form a photosensitive layer thereon; (f) imaging resist in predetermined locations; (g) developing resist to uncover selected areas of the metal layer; and (h) etching uncovered areas of metal to form an electrical circuit pattern connected by the metallized vias.

Abstract translation: 提供了一种用于制造多层电路组件的工艺。 该方法包括（a）提供基底，其至少一个区域包括通孔密度为500至10,000个孔/平方英寸（75至1550个孔/平方厘米）的多个通孔区域; （b）将介电涂层施加到所述基底的所有暴露表面上以在其上形成保形涂层; （c）以预定图案去除所述电介质涂层以暴露所述基板的部分; （d）将金属层施加到所有表面以形成通过和/或导电芯的金属化通孔; （e）在所述金属层上施加抗蚀剂以在其上形成感光层; （f）在预定位置的成像抗蚀剂; （g）显影抗蚀剂以露出金属层的选定区域; 和（h）蚀刻金属的未覆盖区域以形成通过金属化通孔连接的电路图案。

公开(公告)号：US08053674B2

公开(公告)日：2011-11-08

申请号：US11882667

申请日：2007-08-03

Applicant: Yasunari Ooyabu ,  Jun Ishii ,  Naohiro Terada

Inventor： Yasunari Ooyabu ,  Jun Ishii ,  Naohiro Terada

IPC: H05K1/00

CPC classification number: H05K1/0259 ,  G11B5/486 ,  G11B5/6094 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/09063 ,  H05K2201/09554 ,  H05K2201/0969

Abstract: A wired circuit board includes a wired circuit body portion having a wired circuit, an electrostatic charge removing portion conducted with the wired circuit body portion and having a semiconductive layer, and a conduction cut-off portion arranged between the wired circuit body portion and the electrostatic charge removing portion to cut off electrical conduction therebetween.

Abstract translation: 布线电路板包括具有布线电路的布线电路主体部分，与布线电路主体部分导电并具有半导体层的静电电荷去除部分，以及布置在布线电路主体部分和静电之间的导电截止部分 电荷去除部分以切断其间的电导。

公开(公告)号：US20110088928A1

公开(公告)日：2011-04-21

申请号：US12631640

申请日：2009-12-04

Applicant: Chang Hyun LIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Young Ho Sohn

Inventor： Chang Hyun LIM ,  Seog Moon Choi ,  Tae Hoon Kim ,  Young Ki Lee ,  Hye Sook Shin ,  Young Ho Sohn

IPC: H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/053 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/09345 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2203/0315

Abstract: Disclosed is a heat dissipating substrate, which includes a metal plate, an insulating film formed on the surface of the metal plate, a circuit pattern formed on the insulating film, and a first via formed to pass through at least a part of the metal plate so that the metal plate and the circuit pattern are electrically connected to each other, and also which exhibits superior heat dissipation effects and enables the configuration of a circuit board to be simple due to no need to additionally provide a ground layer and a power layer.

Abstract translation: 公开了一种散热基板，其包括金属板，形成在金属板的表面上的绝缘膜，形成在绝缘膜上的电路图案，以及形成为穿过金属板的至少一部分的第一通孔 使得金属板和电路图形彼此电连接，并且还表现出优异的散热效果，并且由于不需要另外提供接地层和功率层，能够使电路板的构造简单。

公开(公告)号：US07923644B2

公开(公告)日：2011-04-12

申请号：US12611261

申请日：2009-11-03

Applicant: Jun Ishii ,  Toshiki Naitou ,  Mitsuru Honjo

Inventor： Jun Ishii ,  Toshiki Naitou ,  Mitsuru Honjo

IPC: H05K1/00

CPC classification number: H05K3/4685 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0265 ,  H05K1/056 ,  H05K3/06 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2203/0323 ,  Y10T29/49155

Abstract: A printed circuit board and method of manufacturing the printed circuit board, including a first and a second write wiring patterns, an end of a first line and an end of a second line of the first write wiring pattern are arranged on both sides of a third line of the second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.

Abstract translation: 印刷电路板和制造印刷电路板的方法，包括第一和第二写入布线图案，第一线的末端和第一写入布线图案的第二条线的末端布置在第三布线图案的两侧 第二行写线路图。 圆形连接部设置在第一线和第二线的端部。 此外，在连接部分下方的基底绝缘层的各个部分中形成通孔。 每个连接部分与通孔内的悬架体的连接区域接触。

公开(公告)号：US07907417B2

公开(公告)日：2011-03-15

申请号：US12015541

申请日：2008-01-17

Applicant: Gregory M. Jandzio ,  Anders P. Pedersen ,  Gary A. Rief ,  Walter M. Whybrew

Inventor： Gregory M. Jandzio ,  Anders P. Pedersen ,  Gary A. Rief ,  Walter M. Whybrew

IPC: H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

CPC classification number: H05K1/0243 ,  H01Q3/26 ,  H01Q21/0006 ,  H01Q21/0037 ,  H05K3/429 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/10553 ,  H05K2203/049 ,  Y10T29/49165

Abstract: A printed circuit board (PCB) is disclose such that the PCB has enhanced structural integrity. The PCB has opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel.

Abstract translation: 公开了印刷电路板（PCB），使得PCB具有增强的结构完整性。 PCB具有相对的外表面和层间互连，可以传送RF，电源和控制信号。 连接区域形成在至少一个面上或之上，用于连接层间互连和任何电气部件。 金属面板固定在至少一个外表面上，为多层印刷线路板增加结构刚性。 金属面板可以具有定位成允许接近连接区域的孔。 RF部件可以由面板承载并且可操作地连接到连接区域。 天线元件可以定位在相同或相对的面板上并且可操作地连接到RF部件以形成相控阵列印刷线路板（PWB）面板。

公开(公告)号：US07810232B2

公开(公告)日：2010-10-12

申请号：US11976617

申请日：2007-10-25

Applicant: Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  II-Kyoon Jeon ,  Eung-Suek Lee

Inventor： Keun-Ho Kim ,  Dek-Gin Yang ,  Jong-Guk Kim ,  II-Kyoon Jeon ,  Eung-Suek Lee

IPC: H05K3/36

CPC classification number: H05K3/4641 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/056 ,  H05K3/4069 ,  H05K3/4608 ,  H05K3/4614 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board and manufacturing method thereof. A printed circuit board has an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.

Abstract translation: 印刷电路板及其制造方法。 印刷电路板具有绝缘基板，该绝缘基板包括绝缘层，形成在绝缘层的一侧的电路图案，以及与该绝缘层接合并被构造为与电路图形电连接的层间通道， 层叠在绝缘层的另一方的层叠在绝缘基板上的剥离层能够通过由散热层形成的内层或接地层提供高散热效果和高弯曲强度 。

公开(公告)号：US20100230135A1

公开(公告)日：2010-09-16

申请号：US11485912

申请日：2006-07-13

Applicant: Christopher Schreiber ,  Christopher Dunn

Inventor： Christopher Schreiber ,  Christopher Dunn

IPC: H01B5/14 ,  H05K13/00

CPC classification number: H05K1/00 ,  G11B5/486 ,  H05K1/056 ,  H05K3/388 ,  H05K3/44 ,  H05K2201/0347 ,  H05K2201/09554 ,  H05K2201/09827 ,  Y10T29/49004 ,  Y10T29/49007 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49224 ,  Y10T428/30 ,  Y10T428/31678

Abstract: An additive process disk drive suspension interconnect, and method therefor is provided. The interconnect has a metal grounding layer of typically stainless steel or copper metallized stainless steel, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.